Conductive package seal

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CPC
B81B2207/093

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/093Conductive package seal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resonance device and resonance device manufacturing method
- Patent number 12,252,393
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone with reduced overall size
- Patent number 12,215,022
- Issue date Feb 4, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Samer Dagher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,784,110
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung Hao Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with perimeter barometric relief pierce
- Patent number 11,772,961
- Issue date Oct 3, 2023
- Knowles Electronics, LLC
- Michael Kuntzman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 11,274,036
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,078,075
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 10,865,103
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,854,533
- Issue date Dec 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Chung Hao Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Trench-based microelectromechanical transducer and method for manuf...
- Patent number 10,737,929
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 10,611,629
- Issue date Apr 7, 2020
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 10,472,231
- Issue date Nov 12, 2019
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature self-sealing vacuum packaging
- Patent number 10,407,194
- Issue date Sep 10, 2019
- United States of America as represented by the Secretary of the Navy
- Paul D. Swanson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
- Patent number 10,134,698
- Issue date Nov 20, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Fucheng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a lid for an electronic device package, a...
- Patent number 9,822,001
- Issue date Nov 21, 2017
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 9,718,675
- Issue date Aug 1, 2017
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked chip package including substrate with recess adjoining side...
- Patent number 9,633,935
- Issue date Apr 25, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pre-molded MEMS device package having conductive column coupled to...
- Patent number 9,573,800
- Issue date Feb 21, 2017
- Invensense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 9,508,663
- Issue date Nov 29, 2016
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 9,452,922
- Issue date Sep 27, 2016
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component and method for producing a component
- Patent number 9,382,110
- Issue date Jul 5, 2016
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device using silicon substrate to glass substrate anodic...
- Patent number 9,156,679
- Issue date Oct 13, 2015
- Innovative Micro Technology
- Benedikt Zeyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and fabrication method of a sensing device
- Patent number 9,133,018
- Issue date Sep 15, 2015
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 9,002,040
- Issue date Apr 7, 2015
- Invensense, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer and corresponding assembly process
- Patent number 8,837,754
- Issue date Sep 16, 2014
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 8,577,063
- Issue date Nov 5, 2013
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for conductive pillars
- Patent number 8,502,327
- Issue date Aug 6, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH PERIMETER BAROMETRIC RELIEF PIERCE
- Publication number 20230062556
- Publication date Mar 2, 2023
- KNOWLES ELECTRONICS, LLC
- Michael Kuntzman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230050181
- Publication date Feb 16, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20210403316
- Publication date Dec 30, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20210371273
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE WITH REDUCED OVERALL SIZE
- Publication number 20210292158
- Publication date Sep 23, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Samer DAGHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082788
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chung Hao CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...
- Publication number 20200385263
- Publication date Dec 10, 2020
- SOLID STATE SYSTEM CO., LTD.
- Chien-Hsing Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20200385260
- Publication date Dec 10, 2020
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190295926
- Publication date Sep 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung Hao CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20190100431
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP
- Publication number 20190010046
- Publication date Jan 10, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRENCH-BASED MICROELECTROMECHANICAL TRANSDUCER AND METHOD FOR MANUF...
- Publication number 20180312393
- Publication date Nov 1, 2018
- STMicroelectronic S.r.l.
- Mohammad ABBASI GAVARTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low Temperature Self-Sealing Vacuum Packaging
- Publication number 20170361963
- Publication date Dec 21, 2017
- United States of America as represented by Secretary of the Navy
- Paul D. Swanson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20170297906
- Publication date Oct 19, 2017
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20170225947
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO...
- Publication number 20160130134
- Publication date May 12, 2016
- InvenSense, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS WAFER ASSEMBLY
- Publication number 20150353348
- Publication date Dec 10, 2015
- RF Micro Devices, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MICROPHONE
- Publication number 20140367808
- Publication date Dec 18, 2014
- Omron Corporation
- Naoto Kuratani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC L...
- Publication number 20140339688
- Publication date Nov 20, 2014
- CAVENDISH KINETICS, INC.
- Roberto GADDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20140230546
- Publication date Aug 21, 2014
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component and Method for Producing a Component
- Publication number 20140226285
- Publication date Aug 14, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES
- Publication number 20140225203
- Publication date Aug 14, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, A...
- Publication number 20140131819
- Publication date May 15, 2014
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TSV-MEMS COMBINATION
- Publication number 20140117469
- Publication date May 1, 2014
- TEXAS INSTRUMENTS INCORPORATED
- YOSHIMI TAKAHASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pre-Molded MEMS Device Package
- Publication number 20140070382
- Publication date Mar 13, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pre-Molded MEMS Device Package with Conductive Shell
- Publication number 20140070383
- Publication date Mar 13, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component and Method for Producing a Component
- Publication number 20130214405
- Publication date Aug 22, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR CONDUCTIVE PILLARS
- Publication number 20130193528
- Publication date Aug 1, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Conductive package seal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resonance device and resonance device manufacturing method

Microelectromechanical microphone with reduced overall size

Wafer level package for device

Semiconductor package and method for manufacturing the same

MEMS device with perimeter barometric relief pierce

Packaging method and associated packaging structure

Microelectromechanical device with signal routing through a protect...

Packaging method and associated packaging structure

Packaging method and associated packaging structure

Semiconductor package and method for manufacturing the same

Trench-based microelectromechanical transducer and method for manuf...

Microelectromechanical device with signal routing through a protect...

Assembly and packaging of MEMS device

Low temperature self-sealing vacuum packaging

Bonding pad structure, bonding ring structure, and MEMS device pack...

Process for manufacturing a lid for an electronic device package, a...

Microelectromechanical device with signal routing through a protect...

Stacked chip package including substrate with recess adjoining side...

Pre-molded MEMS device package having conductive column coupled to...

Assembly and packaging of MEMS device

Molded package structure with glue bleed stopper for sealing a MEMs...

Microelectromechanical device with signal routing through a protect...

Component and method for producing a component

Method and device using silicon substrate to glass substrate anodic...

Structure and fabrication method of a sensing device

Packages and methods for packaging MEMS microphone devices

Microelectromechanical transducer and corresponding assembly process

Wafer level package and a method of forming a wafer level package

Packages and methods for packaging MEMS microphone devices

Systems and methods for conductive pillars

Patents Applicationslast 30 patents

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

MEMS DEVICE WITH PERIMETER BAROMETRIC RELIEF PIERCE

Wafer level package for device

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

MICROELECTROMECHANICAL MICROPHONE WITH REDUCED OVERALL SIZE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP

TRENCH-BASED MICROELECTROMECHANICAL TRANSDUCER AND METHOD FOR MANUF...

Low Temperature Self-Sealing Vacuum Packaging

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO...

GLASS WAFER ASSEMBLY

SEMICONDUCTOR DEVICE AND MICROPHONE

TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC L...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

Component and Method for Producing a Component

PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES

PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, A...

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

TSV-MEMS COMBINATION

Pre-Molded MEMS Device Package

Pre-Molded MEMS Device Package with Conductive Shell

Component and Method for Producing a Component

SYSTEMS AND METHODS FOR CONDUCTIVE PILLARS