Conductive through-holes or vias

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  • Information Patent Application

    CIRCUIT BOARD AND DISPLAY MODULE

    • Publication number 20250024607
    • Publication date Jan 16, 2025
    • Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    • Rong GUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250016909
    • Publication date Jan 9, 2025
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250016917
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wideband Millimeter Wave Via Transition

    • Publication number 20250016923
    • Publication date Jan 9, 2025
    • Apple Inc.
    • Chi V. Pham
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY PANELS AND DISPLAY DEVICES

    • Publication number 20250008644
    • Publication date Jan 2, 2025
    • Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    • Liwang SONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250008659
    • Publication date Jan 2, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Heun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

    • Publication number 20240431026
    • Publication date Dec 26, 2024
    • Samsung Electronics Co., Ltd.
    • Jaeho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

    • Publication number 20240422900
    • Publication date Dec 19, 2024
    • KYOCERA CORPORATION
    • Noriyuki SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240422908
    • Publication date Dec 19, 2024
    • LG Innotek Co., Ltd.
    • Kyo Hun KOO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

    • Publication number 20240414844
    • Publication date Dec 12, 2024
    • LG Innotek Co., Ltd.
    • Yong Suk KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

    • Publication number 20240404937
    • Publication date Dec 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Sami NURMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE

    • Publication number 20240404934
    • Publication date Dec 5, 2024
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

    • Publication number 20240407095
    • Publication date Dec 5, 2024
    • LG Innotek Co., Ltd.
    • Han Sang KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCED BALL GRID ARRAY PAD CAPACITANCE

    • Publication number 20240389220
    • Publication date Nov 21, 2024
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

    • Publication number 20240389230
    • Publication date Nov 21, 2024
    • NVIDIA Corporation
    • Mingyi Yu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

    • Publication number 20240389219
    • Publication date Nov 21, 2024
    • Dell Products L.P.
    • William Andrew Smith
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240389231
    • Publication date Nov 21, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

    • Publication number 20240381538
    • Publication date Nov 14, 2024
    • AT&S Austria Technologie & Systemtechnik
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240381527
    • Publication date Nov 14, 2024
    • LG Innotek Co., Ltd.
    • Jae Hwa KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

    • Publication number 20240372426
    • Publication date Nov 7, 2024
    • INFINITUM ELECTRIC INC.
    • Rich Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

    • Publication number 20240357736
    • Publication date Oct 24, 2024
    • Hitachi Astemo, Ltd.
    • Takanori SEKIGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20240349426
    • Publication date Oct 17, 2024
    • Murata Manufacturing Co., Ltd.
    • Atsushi SAKURAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    • Publication number 20240334601
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sangho Jeong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier and Method Manufacturing the Same

    • Publication number 20240334613
    • Publication date Oct 3, 2024
    • AT&S (Chongqing) Company Limited
    • JyunMin WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Component Carrier Method of Manufacturing the Component Carrier and...

    • Publication number 20240334617
    • Publication date Oct 3, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Hans PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

    • Publication number 20240324104
    • Publication date Sep 26, 2024
    • Japan Tobacco Inc.
    • Keiji MARUBASHI
    • A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE JOINING STRUCTURE

    • Publication number 20240314943
    • Publication date Sep 19, 2024
    • Mitsubishi Electric Corporation
    • Hiromitsu Itamoto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC SYSTEM

    • Publication number 20240314920
    • Publication date Sep 19, 2024
    • MEDIATEK INC.
    • Tso-Ju YI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR