Conductive through-holes or vias

Industry

CPC
H05K2201/095

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/095Conductive through-holes or vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and manufacturing method therefor
- Patent number 11,956,904
- Issue date Apr 9, 2024
- STEMCO CO., LTD.
- Jae Soo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,924,961
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ai Jing Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlayer connective structure of wiring board and method of manuf...
- Patent number 11,895,772
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Chi-Min Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,864,316
- Issue date Jan 2, 2024
- Fujikura Ltd.
- Naoki Oyaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inductor built-in substrate
- Patent number 11,856,699
- Issue date Dec 26, 2023
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and display device including the same
- Patent number 11,856,698
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Jongjin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adapter board, method for manufacturing the same and circuit board...
- Patent number 11,856,702
- Issue date Dec 26, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 11,842,958
- Issue date Dec 12, 2023
- Chun-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flexible printed circuit board and display touch apparatus
- Patent number 11,839,018
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Wenxiao Niu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and vehicle including the same
- Patent number 11,832,387
- Issue date Nov 28, 2023
- Hyundai Mobis Co., Ltd.
- Myeong Je Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,832,388
- Issue date Nov 28, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,818,833
- Issue date Nov 14, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial field rotary energy device having PCB stator with non-linear...
- Patent number 11,777,354
- Issue date Oct 3, 2023
- Infinitum Electric, Inc.
- Paulo Guedes-Pinto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, preparation method thereof, and electronic device
- Patent number 11,770,902
- Issue date Sep 26, 2023
- WUXI SHENNAN CIRCUITS CO., LTD.
- Yunfeng Jiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240147612
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
- Publication number 20240147617
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single Layer Capacitor
- Publication number 20240136123
- Publication date Apr 25, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107684
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY
- Publication number 20240096774
- Publication date Mar 21, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240098897
- Publication date Mar 21, 2024
- IBIDEN CO., LTD.
- Yoshio MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240090129
- Publication date Mar 14, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20240090134
- Publication date Mar 14, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240064893
- Publication date Feb 22, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...
- Publication number 20240063110
- Publication date Feb 22, 2024
- CHUN-MING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240057267
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Soo Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20240055744
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240055745
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040698
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240040686
- Publication date Feb 1, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Maria BØE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040697
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Young Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR
- Publication number 20240023227
- Publication date Jan 18, 2024
- FIRST HI-TEC ENTERPRISE Co., Ltd.
- Ching-Shan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240008191
- Publication date Jan 4, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20240008177
- Publication date Jan 4, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductive through-holes or vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component-embedded substrate

Three-dimensional (3D) copper in printed circuit boards

Multilayer circuit board and manufacturing method therefor

Mating backplane for high speed, high density electrical connector

Circuit board for transmitting high-frequency signal and method for...

Circuit board preparation method

Circuit board and method of manufacturing the same

Multilayer wiring board and method of producing the same

Structure for embedding and packaging multiple devices by layer and...

Interlayer connective structure of wiring board and method of manuf...

Circuit board structure

Noise suppression structure for differential pair

Wiring substrate

Sn—Bi and copper powder conductive paste in through hole of insulat...

Plated metallization structures

Inductor built-in substrate

Circuit board and display device including the same

Adapter board, method for manufacturing the same and circuit board...

Conductive structure including copper-phosphorous alloy and a metho...

Flexible printed circuit board and display touch apparatus

Printed circuit board and vehicle including the same

Printed wiring board and method for manufacturing printed wiring board

Wiring board

Circuit board structure

Imaging device for connection with a circuit element

Circuit board structure and method for manufacturing a circuit boar...

Printed circuit boards with plated blind slots for improved vertica...

Component carrier with through hole filled with extra plating struc...

Axial field rotary energy device having PCB stator with non-linear...

Circuit board, preparation method thereof, and electronic device

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

Single Layer Capacitor

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

PRINTED WIRING BOARD

METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY

WIRING SUBSTRATE

POWER VIA RESONANCE SUPPRESSION

ELECTRONIC DEVICE

ELECTRONIC CIRCUIT MODULE

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

SUBSTRATES WITH CONTINUOUS SLOT VIAS

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

PRINTED CIRCUIT BOARD

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR

WIRING SUBSTRATE

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE