TREA

Conductive through-holes or vias

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  • CPC
  • H05K2201/095
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/095Conductive through-holes or vias
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate
    • Patent number 12,219,704
    • Issue date Feb 4, 2025
    • Ibiden Co., Ltd.
    • Naoki Mizutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-layer printed circuit board
    • Patent number 12,213,254
    • Issue date Jan 28, 2025
    • JESS-LINK PRODUCTS CO., LTD.
    • Yu-Liang Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 12,213,251
    • Issue date Jan 28, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Sang Hoon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Beveled overburden for vias and method of making the same
    • Patent number 12,207,405
    • Issue date Jan 21, 2025
    • Corning Incorporated
    • Dhananjay Joshi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board
    • Patent number 12,200,859
    • Issue date Jan 14, 2025
    • TOPPAN INC.
    • Jun Onohara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board and wire arrangement method thereof
    • Patent number 12,200,863
    • Issue date Jan 14, 2025
    • CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
    • Jing Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and electronic device including circuit board includi...
    • Patent number 12,200,864
    • Issue date Jan 14, 2025
    • Samsung Electronics Co., Ltd.
    • Bumhee Bae
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power conversion device
    • Patent number 12,184,190
    • Issue date Dec 31, 2024
    • Denso Corporation
    • Daisuke Yamazaki
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Circuit board with rigid portion and flexible portion having connec...
    • Patent number 12,185,456
    • Issue date Dec 31, 2024
    • First Hi-tec Enterprise Co., Ltd.
    • Min-Lin Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 12,185,467
    • Issue date Dec 31, 2024
    • Denso Corporation
    • Keitaro Ito
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring circuit board and method of producing the same
    • Patent number 12,185,463
    • Issue date Dec 31, 2024
    • Nitto Denko Corporation
    • Kanayo Sawashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flexible circuit board and manufacturing method thereof
    • Patent number 12,185,479
    • Issue date Dec 31, 2024
    • Unimicron Technology Corp.
    • Cheng-Ta Ko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board
    • Patent number 12,177,974
    • Issue date Dec 24, 2024
    • LG Innotek Co., Ltd
    • Dong Hun Joung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 12,177,973
    • Issue date Dec 24, 2024
    • Sumitomo Electric Industries, Ltd.
    • Shoichiro Sakai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and manufacturing method thereof and electronic device
    • Patent number 12,177,964
    • Issue date Dec 24, 2024
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 12,167,535
    • Issue date Dec 10, 2024
    • Ibiden Co., Ltd.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 12,156,329
    • Issue date Nov 26, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seong Ho Choi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Technologies for power tunnels on circuit boards
    • Patent number 12,156,331
    • Issue date Nov 26, 2024
    • Intel Corporation
    • Khai Ern See
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board structure
    • Patent number 12,144,113
    • Issue date Nov 12, 2024
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Hermetic metallized via with improved reliability
    • Patent number 12,131,985
    • Issue date Oct 29, 2024
    • Corning Incorporated
    • Mandakini Kanungo
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Display apparatus and electronic device
    • Patent number 12,127,345
    • Issue date Oct 22, 2024
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Xiaoxia Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semi-flex component carrier with dielectric material surrounding an...
    • Patent number 12,127,338
    • Issue date Oct 22, 2024
    • AT&S(China) Co. Ltd.
    • Mikael Tuominen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cable assembly, signal transmission structure, and electronic device
    • Patent number 12,114,425
    • Issue date Oct 8, 2024
    • Huawei Technologies Co., Ltd.
    • Guodong Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Micro-ground vias for improved signal integrity for high-speed seri...
    • Patent number 12,114,419
    • Issue date Oct 8, 2024
    • Dell Products L.P.
    • William Andrew Smith
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and preparation method thereof
    • Patent number 12,114,424
    • Issue date Oct 8, 2024
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Mei Yang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board comprising via
    • Patent number 12,108,531
    • Issue date Oct 1, 2024
    • LG Innotek Co., Ltd
    • Kyo Hun Koo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and manufacturing method therefor
    • Patent number 12,101,891
    • Issue date Sep 24, 2024
    • Avary Holding (Shenzhen) Co., Limited.
    • Chao Peng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 12,101,880
    • Issue date Sep 24, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hee-Joon Chun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board
    • Patent number 12,101,894
    • Issue date Sep 24, 2024
    • Shinko Electric Industries Co., Ltd.
    • Junichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 12,089,325
    • Issue date Sep 10, 2024
    • LG Innotek Co., Ltd
    • Jae Hwa Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents