TREA

Conductive through-holes or vias

Follow

Industry

  • CPC
  • H05K2201/095
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/095Conductive through-holes or vias
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250240876
    • Publication date Jul 24, 2025
    • KYOCERA CORPORATION
    • Daichi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
    • Publication number 20250227837
    • Publication date Jul 10, 2025
    • Rockwell Collins, Inc.
    • John A. Bauer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
    • Publication number 20250227841
    • Publication date Jul 10, 2025
    • TOPPAN Holdings Inc.
    • Masashi SAWADAISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
    • Publication number 20250227842
    • Publication date Jul 10, 2025
    • TOPPAN Holdings Inc.
    • Masashi SAWADAISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
    • Publication number 20250227854
    • Publication date Jul 10, 2025
    • HAMILTON SUNDSTRAND CORPORATION
    • Robert C. Cooney
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT CARRIER
    • Publication number 20250227857
    • Publication date Jul 10, 2025
    • Unimicron Technology Corp.
    • John Hon-Shing Lau
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250220815
    • Publication date Jul 3, 2025
    • PanelSemi Corporation
    • CHIN-TANG LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
    • Publication number 20250212317
    • Publication date Jun 26, 2025
    • NVIDIA Corporation
    • Tibet Zhao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250212324
    • Publication date Jun 26, 2025
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20250203776
    • Publication date Jun 19, 2025
    • Unimicron Technology Corp.
    • Chin-Sheng Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
    • Publication number 20250194011
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • Eunhye Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...
    • Publication number 20250194012
    • Publication date Jun 12, 2025
    • Canon Kabushiki Kaisha
    • SHOJI MATSUMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME
    • Publication number 20250194006
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • DONGYOON SEO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250193994
    • Publication date Jun 12, 2025
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic Device and Manufacturing Method thereof
    • Publication number 20250183148
    • Publication date Jun 5, 2025
    • InnoLux Corporation
    • Kuang-Ming FAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250159793
    • Publication date May 15, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Meng-Jen WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stamping Surface Profile in Design Layer and Filling an Indentation...
    • Publication number 20250142736
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250132224
    • Publication date Apr 24, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Chul GONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20250133655
    • Publication date Apr 24, 2025
    • TRIPOD (WUXI) ELECTRONIC CO., LTD.
    • CHI SUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250126709
    • Publication date Apr 17, 2025
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126710
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE
    • Publication number 20250126706
    • Publication date Apr 17, 2025
    • AAC MICROTECH (CHANGZHOU) CO., LTD.
    • Guohui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250125269
    • Publication date Apr 17, 2025
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER RADIO FREQUENCY COMPONENT
    • Publication number 20250118881
    • Publication date Apr 10, 2025
    • Knowles Cazenovia, Inc.
    • Jared P. Burdick
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
    • Publication number 20250089154
    • Publication date Mar 13, 2025
    • Skyworks Solutions, Inc.
    • Shaul BRANCHEVSKY
    • H01 - BASIC ELECTRIC ELEMENTS