Conductive through-holes or vias

Industry

CPC
H05K2201/095

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/095Conductive through-holes or vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 12,167,535
- Issue date Dec 10, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display apparatus and electronic device
- Patent number 12,127,345
- Issue date Oct 22, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xiaoxia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,101,894
- Issue date Sep 24, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband millimeter wave via transition
- Patent number 12,069,805
- Issue date Aug 20, 2024
- Apple Inc.
- Chi V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,041,729
- Issue date Jul 16, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and electronic device
- Patent number 12,028,968
- Issue date Jul 2, 2024
- Sony Group Corporation
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and method for manufacturing same
- Patent number 12,028,990
- Issue date Jul 2, 2024
- STEMCO CO., LTD.
- Sung Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency front-end module, manufacturing method thereof and...
- Patent number 12,022,616
- Issue date Jun 25, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20240404937
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240334601
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
- Publication number 20240324104
- Publication date Sep 26, 2024
- Japan Tobacco Inc.
- Keiji MARUBASHI
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE JOINING STRUCTURE
- Publication number 20240314943
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Hiromitsu Itamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS WITH SURGE VOLTAGE PROTECTION FUNCTION
- Publication number 20240313525
- Publication date Sep 19, 2024
- CABLE VISION ELECTRONICS CO., LTD
- Chien-Chung LEE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Circuit Board, Circuit Board Assembly, and Electronic Device
- Publication number 20240306300
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H01 - BASIC ELECTRIC ELEMENTS

Conductive through-holes or vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Printed circuit board

Technologies for power tunnels on circuit boards

Circuit board structure

Hermetic metallized via with improved reliability

Display apparatus and electronic device

Semi-flex component carrier with dielectric material surrounding an...

Cable assembly, signal transmission structure, and electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Circuit board and preparation method thereof

Circuit board comprising via

Circuit board and manufacturing method therefor

Printed circuit board

Wiring board

Printed circuit board

Through-hole electrode substrate

Wideband millimeter wave via transition

Circuit board having laminated build-up layers

Devices and methods related to metallization of ceramic substrates...

Method and process for creating high-performance coax sockets

Wafer level chip scale packaging intermediate structure apparatus a...

Axial field rotary energy device with PCB stator with thermal expan...

Printed wiring board

Electronic module and method for producing an electronic module

Wiring circuit board

Substrate and electronic device

Multilayer board and method for manufacturing same

Assembly structure for vehicle camera module using solder-jet

Semiconductor chip module

Radio frequency front-end module, manufacturing method thereof and...

Patents Applicationslast 30 patents

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

REDUCED BALL GRID ARRAY PAD CAPACITANCE

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

PRINTED WIRING BOARD

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

PRINTED CIRCUIT BOARD

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

WIRING SUBSTRATE

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Component Carrier and Method Manufacturing the Same

Component Carrier Method of Manufacturing the Component Carrier and...

POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

WIRING SUBSTRATE

SUBSTRATE JOINING STRUCTURE

ELECTRONIC SYSTEM

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

ELECTRONIC APPARATUS WITH SURGE VOLTAGE PROTECTION FUNCTION

WIRING SUBSTRATE

CIRCUIT STRUCTURE

Three-Dimensional (3D) Copper in Printed Circuit Boards

Flexible Circuit Board, Circuit Board Assembly, and Electronic Device