Conductive via connections through the device

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H01L2225/06541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06541Conductive via connections through the device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,253,943
- Issue date Mar 18, 2025
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,254,949
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Game engine on a chip
- Patent number 12,249,018
- Issue date Mar 11, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat Yerli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks with inte...
- Patent number 12,249,598
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 12,243,575
- Issue date Mar 4, 2025
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Quasi-volatile memory device with a back-channel usage
- Patent number 12,242,759
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Robert D. Norman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 12,243,865
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent multi-bit self-referenced read of programmable resistanc...
- Patent number 12,237,010
- Issue date Feb 25, 2025
- SanDisk Technologies, Inc.
- Nathan Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 12,237,299
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having pads with stepped structure
- Patent number 12,237,309
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Myung Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages
- Patent number 12,237,319
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory component with input/output data rate alignment
- Patent number 12,229,435
- Issue date Feb 18, 2025
- RAMBUS INC.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE
- Publication number 20250120099
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- MINWOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250120072
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seryeun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250113479
- Publication date Apr 3, 2025
- SwaySure Technology Co., Ltd.
- MING-HUNG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...
- Publication number 20250105223
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY LAYERS WITH UNIFORM ACCESS
- Publication number 20250107107
- Publication date Mar 27, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105213
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Shao-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE
- Publication number 20250105123
- Publication date Mar 27, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Takeo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250105182
- Publication date Mar 27, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- JAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105193
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105214
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH CONNECTION PILLARS
- Publication number 20250105189
- Publication date Mar 27, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20250105212
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Publication number 20250105215
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhyo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250105150
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jeon Il Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YEONGSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20250096202
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY
- Publication number 20250095753
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- George Kakuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of Through-Silicon Vias
- Publication number 20250098549
- Publication date Mar 20, 2025
- IMEC vzw
- Robert Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMORY CONTROLLER CIRCUITRY
- Publication number 20250098181
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Alan D. SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Conductive via connections through the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor memory device and structure with memory and metal...

Three-dimensional device structure including substrate-embedded int...

Stacked dies and methods for forming bonded structures

3D stacked integrated circuits having functional blocks configured...

Package process and package structure

Integrated circuit packages

Memory device interface and method

Stacked semiconductor device

Secure semiconductor integration and method for making thereof

Semiconductor package including heat dissipation layer

Memory device

Game engine on a chip

Semiconductor package and method manufacturing the same

Three dimensional circuit implementing machine trained network

Integrated assemblies comprising vertically-stacked decks with inte...

Memory system having combined high density, low bandwidth and low d...

Quasi-volatile memory device with a back-channel usage

Bonded semiconductor die assembly containing through-stack via stru...

3D semiconductor device and structure with metal layers and memory...

Correction die for wafer/die stack

Concurrent multi-bit self-referenced read of programmable resistanc...

Package structure

Semiconductor package and method for fabricating the same

Systems and methods for direct bonding in semiconductor die manufac...

Semiconductor package having pads with stepped structure

Stacked-chip packages

Electronics assemblies employing copper in multiple locations

Vertical semiconductor package including horizontally stacked dies...

Memory component with input/output data rate alignment

Semiconductor package structure

Patents Applicationslast 30 patents

MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE

SEMICONDUCTOR PACKAGE

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...

STACKED MEMORY LAYERS WITH UNIFORM ACCESS

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

ELECTRONIC CHIP WITH CONNECTION PILLARS

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICES

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

STACKED SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY

Fabrication of Through-Silicon Vias

INTEGRATED MEMORY CONTROLLER CIRCUITRY

LOW COST PACKAGE WARPAGE SOLUTION