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SEMICONDUCTOR PACKAGE
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Publication number 20240421020
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Publication date Dec 19, 2024
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Samsung Electronics Co., Ltd.
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YOUNG KWAN SEO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240421129
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Publication date Dec 19, 2024
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Samsung Electronics Co., Ltd.
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SEUNGDUK BAEK
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H01 - BASIC ELECTRIC ELEMENTS
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QUASI-VOLATILE SYSTEM-LEVEL MEMORY
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Publication number 20240411711
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Publication date Dec 12, 2024
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Sunrise Memory Corporation
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Robert D. Norman
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G06 - COMPUTING CALCULATING COUNTING
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Heat Dissipation Structures
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Publication number 20240413052
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Publication date Dec 12, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Po-Hsiang HUANG
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-DIE MEMORY DEVICE
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Publication number 20240404580
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Publication date Dec 5, 2024
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Rambus Inc.
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Scott C. Best
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H01 - BASIC ELECTRIC ELEMENTS
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MEMORY DEVICE
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Publication number 20240395706
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Publication date Nov 28, 2024
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Macronix International Co., Ltd.
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Meng-Yen Wu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240387413
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Publication date Nov 21, 2024
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Samsung Electronics Co., Ltd.
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Jaejun LEE
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H01 - BASIC ELECTRIC ELEMENTS
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Chip Package Structure with Bump
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Publication number 20240387431
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Wei-Yu CHEN
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H01 - BASIC ELECTRIC ELEMENTS
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