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HIGH BANDWIDTH MEMORY
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Publication number 20250240977
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Publication date Jul 24, 2025
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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Discrete Three-Dimensional Processor
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Publication date Jul 24, 2025
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ShenZhen CunDi Technology Co., Ltd.
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PACKAGE ARCHITECTURE WITH INTERPOSER
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Publication number 20250233109
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Publication date Jul 17, 2025
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Powerchip Semiconductor Manufacturing Corporation
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Chun-Lin Lu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES
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Publication date Jul 17, 2025
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Yunjo Lee
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20250226332
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Publication date Jul 10, 2025
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Intel Corporation
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Aleksandar Aleksov
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES
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Publication number 20250220929
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Publication date Jul 3, 2025
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication date Jun 26, 2025
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Samsung Electronics Co., Ltd.
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Publication date Jun 26, 2025
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS