Conductive via connections through the device

Industry

CPC
H01L2225/06541

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06541Conductive via connections through the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,328
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 12,355,002
- Issue date Jul 8, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit die and integrated circuit package...
- Patent number 12,356,724
- Issue date Jul 8, 2025
- Myeong-Eun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 12,355,023
- Issue date Jul 8, 2025
- Hong Kong HaiCun Technology Co., Limited
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,355,005
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,355,007
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a through-hole electrode
- Patent number 12,347,747
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method manufacturing the same
- Patent number 12,347,785
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,341,132
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Cheng-Jer Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,334,471
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 12,334,475
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,334,477
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 12,327,820
- Issue date Jun 10, 2025
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 12,315,860
- Issue date May 27, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a contact plug electrically conn...
- Patent number 12,317,500
- Issue date May 27, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ARCHITECTURE WITH INTERPOSER
- Publication number 20250233109
- Publication date Jul 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234554
- Publication date Jul 17, 2025
- Yunjo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20250233042
- Publication date Jul 17, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20250234589
- Publication date Jul 17, 2025
- Zinite Corporation
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250226339
- Publication date Jul 10, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250226340
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE
- Publication number 20250226324
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...
- Publication number 20250226308
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Chip Including Arrays Of Multi-Threaded Dynamic...
- Publication number 20250218499
- Publication date Jul 3, 2025
- ATOMERA INCORPORATED
- Richard S. Roy
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250218899
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure For An Array Of Multi-Threaded Dynamic Rando...
- Publication number 20250218468
- Publication date Jul 3, 2025
- ATOMERA INCORPORATED
- Richard S. Roy
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH POWER GATING ELEMENT
- Publication number 20250220928
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Chang Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY COMPONENT WITH INPUT/OUTPUT DATA RATE ALIGNMENT
- Publication number 20250217070
- Publication date Jul 3, 2025
- Rambus Inc.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250220927
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250220929
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250218902
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...
- Publication number 20250210590
- Publication date Jun 26, 2025
- SD Optics, Inc.
- KYUNG PYO HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210076
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Woohyun SON
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210481
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210499
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR BALANCING TIMING CLOSURE
- Publication number 20250210591
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250210068
- Publication date Jun 26, 2025
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250201776
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- SEOKBEOM YONG
- H01 - BASIC ELECTRIC ELEMENTS

Conductive via connections through the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

3D semiconductor memory device and structure

Semiconductor package

Semiconductor package and method of fabricating the same

Stack type semiconductor device and method of testing the stack typ...

Hyperchip

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Double-sided integrated circuit die and integrated circuit package...

Discrete three-dimensional processor

Semiconductor package

Semiconductor package and method of fabricating the same

Package and method of fabricating the same

Signal routing between memory die and logic die for performing oper...

Semiconductor components having conductive vias with aligned back s...

Semiconductor devices including a through-hole electrode

Semiconductor structure and method manufacturing the same

Semiconductor structure

Semiconductor devices and manufacturing methods of the same

3D trench capacitor for integrated passive devices

Semiconductor packages

Semiconductor device with discrete blocks

3D system integration

Integrated circuit package and method of forming the same

Thermal management of three-dimensional integrated circuits

Wafer reconstitution and die-stitching

Method of manufacturing die stack structure

Integrated circuit package for high bandwidth memory

Storage layers for wafer bonding

Semiconductor memory device having a contact plug electrically conn...

Patents Applicationslast 30 patents

PACKAGE ARCHITECTURE WITH INTERPOSER

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

THIN FILM SEMICONDUCTOR SWITCHING DEVICE

ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...

MICROELECTRONIC ASSEMBLIES

Integrated Circuit Chip Including Arrays Of Multi-Threaded Dynamic...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

Interconnect Structure For An Array Of Multi-Threaded Dynamic Rando...

SEMICONDUCTOR DEVICE WITH POWER GATING ELEMENT

MEMORY COMPONENT WITH INPUT/OUTPUT DATA RATE ALIGNMENT

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

APPARATUS, SYSTEM, AND METHOD FOR BALANCING TIMING CLOSURE

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME