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Conductors directly under a component but not electrically connected to the component
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H05K2201/09772
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/09772
Conductors directly under a component but not electrically connected to the component
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Patents Grants
last 30 patents
Information
Patent Grant
Circuit board connector footprint
Patent number
11,729,898
Issue date
Aug 15, 2023
TE CONNECTIVITY SOLUTIONS GmbH
Justin Dennis Pickel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate and method for manufacturing the same
Patent number
11,398,421
Issue date
Jul 26, 2022
Advanced Semiconductor Engineering, Inc.
Chun-Che Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component, and contacting assembly having a semicondu...
Patent number
11,310,913
Issue date
Apr 19, 2022
Robert Bosch GmbH
Guenter Gera
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer system and motherboard thereof
Patent number
10,740,279
Issue date
Aug 11, 2020
ASUSTeK COMPUTER Inc.
Li-Chien Wan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device having a plated antenna and/or trace, and methods...
Patent number
10,667,397
Issue date
May 26, 2020
Thin Film Electronics ASA
Mao Ito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate mitigating bridging
Patent number
10,181,438
Issue date
Jan 15, 2019
Advanced Semiconductor Engineering, Inc.
Chun-Che Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High-frequency module
Patent number
10,008,757
Issue date
Jun 26, 2018
Murata Manufacturing Co., Ltd.
Kunitoshi Hanaoka
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Method for manufacturing printed wiring board with conductive post...
Patent number
9,713,267
Issue date
Jul 18, 2017
Ibiden Co., Ltd.
Toru Furuta
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Printed wiring board, printed circuit board, and printed circuit bo...
Patent number
9,282,634
Issue date
Mar 8, 2016
Canon Kabushiki Kaisha
Masaharu Ohira
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic control device including interrupt wire
Patent number
9,148,948
Issue date
Sep 29, 2015
Denso Corporation
Ryoichi Shiraishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
9,131,615
Issue date
Sep 8, 2015
Canon Kabushiki Kaisha
Hideaki Hirasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming thermally conductive lay...
Patent number
8,999,760
Issue date
Apr 7, 2015
STATS ChipPAC, Ltd.
Reza A. Pagaila
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic control device including interrupt wire
Patent number
8,780,518
Issue date
Jul 15, 2014
Denso Corporation
Takahiko Furuta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
8,780,575
Issue date
Jul 15, 2014
Wistron Corporation
Chih-Yung Chia
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board circuit apparatus and light source apparatus
Patent number
8,746,925
Issue date
Jun 10, 2014
AU OPTRONICS CORPORATION
Hua-Chen Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board unit having routing unit mounted thereon and...
Patent number
8,711,575
Issue date
Apr 29, 2014
Samsung Electronics Co., Ltd.
Do-kyun Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
8,681,509
Issue date
Mar 25, 2014
Canon Kabushiki Kaisha
Hideaki Hirasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board, semiconductor device and method for manufacturing sem...
Patent number
8,436,456
Issue date
May 7, 2013
Sharp Kabushiki Kaisha
Yoshiki Sota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with improved resin configuration
Patent number
8,368,233
Issue date
Feb 5, 2013
Seiko Epson Corporation
Yoshiharu Ogata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Tape wiring substrates and packages including the same
Patent number
8,350,158
Issue date
Jan 8, 2013
Samsung Electronics Co., Ltd.
Yechung Chung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and circuit device
Patent number
8,258,409
Issue date
Sep 4, 2012
Sanyo Electric Co., Ltd.
Yasuhiro Kohara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming thermally conductive lay...
Patent number
8,236,617
Issue date
Aug 7, 2012
STATS ChipPAC, Ltd.
Reza A. Pagaila
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mount structure, illumination apparatus and liquid crystal apparatus
Patent number
8,212,957
Issue date
Jul 3, 2012
Sony Corporation
Daisuke Nakanishi
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Wiring substrate and electronic device
Patent number
8,125,789
Issue date
Feb 28, 2012
Fujitsu Semiconductor Limited
Takao Nishimura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing printed circuit board, printed circuit boa...
Patent number
8,101,870
Issue date
Jan 24, 2012
Kabushiki Kaisha Toshiba
Norihiro Ishii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and semiconductor package including the same
Patent number
8,063,313
Issue date
Nov 22, 2011
Samsung Electronics Co., Ltd.
Yun-Jin Oh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Feedthrough capacitor and mounted structure thereof
Patent number
8,018,711
Issue date
Sep 13, 2011
TDK Corporation
Masaaki Togashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with improved resin configuration
Patent number
7,982,319
Issue date
Jul 19, 2011
Seiko Epson Corporation
Yoshiharu Ogata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting substrate and semiconductor device
Patent number
7,838,998
Issue date
Nov 23, 2010
Shinko Electric Industries Co., Ltd.
Takashi Ozawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible circuit board, display unit having the same and display de...
Patent number
7,830,489
Issue date
Nov 9, 2010
Samsung Electronics Co., Ltd.
Ock-Jin Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR COMPONENT, AND CONTACTING ASSEMBLY HAVING A SEMICONDU...
Publication number
20200196449
Publication date
Jun 18, 2020
ROBERT BOSCH GmbH
Guenter Gera
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20190148280
Publication date
May 16, 2019
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Chun-Che Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device Having a Plated Antenna and/or Trace, and Methods...
Publication number
20180359858
Publication date
Dec 13, 2018
Thin Film Electronics ASA
Mao ITO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20140041920
Publication date
Feb 13, 2014
Canon Kabushiki Kaisha
Hideaki Hirasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BO...
Publication number
20140043783
Publication date
Feb 13, 2014
Canon Kabushiki Kaisha
Masaharu Ohira
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit Board Circuit Apparatus and Light Source Apparatus
Publication number
20130120993
Publication date
May 16, 2013
AU OPTRONICS CORPORATION
Hua-Chen Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SIGNAL TRANSFER CIRCUIT
Publication number
20120262885
Publication date
Oct 18, 2012
Hitachi, Ltd.
Yasuhiro IKEDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Device and Method of Forming Thermally Conductive Lay...
Publication number
20120248596
Publication date
Oct 4, 2012
STATS ChipPAC, Ltd.
Reza A. Pagaila
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE
Publication number
20120200973
Publication date
Aug 9, 2012
Murata Manufacturing Co., Ltd.
Ryoichi Shiraishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRRUPT WIRE
Publication number
20120200972
Publication date
Aug 9, 2012
Murata Manufacturing Co., Ltd.
Takahiko FURUTA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD UNIT AND COMPUTER DEVICE HAVING THE SAME
Publication number
20120002389
Publication date
Jan 5, 2012
Samsung Electronics Co., Ltd.
Do-kyun Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Device and Method of Forming Thermally Conductive Lay...
Publication number
20110298110
Publication date
Dec 8, 2011
STATS ChipPAC, Ltd.
Reza A. Pagaila
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20110247868
Publication date
Oct 13, 2011
Wistron Corporation
Chih-Yung CHIA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION
Publication number
20110241221
Publication date
Oct 6, 2011
SEIKO EPSON CORPORATION
Yoshiharu OGATA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
Publication number
20110164391
Publication date
Jul 7, 2011
Yee Na SHIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEM...
Publication number
20110042828
Publication date
Feb 24, 2011
Yoshiki Sota
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SUSPENSION DESIGN FOR HIGH SHOCK PERFORMANCE SOLDERING BALL BONDING
Publication number
20100214697
Publication date
Aug 26, 2010
Minggao Yao
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
MOUNT STRUCTURE, ILLUMINATION APPARATUS AND LIQUID CRYSTAL APPARATUS
Publication number
20100182529
Publication date
Jul 22, 2010
EPSON IMAGING DEVICES CORPORATION
Daisuke NAKANISHI
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20100181101
Publication date
Jul 22, 2010
Samsung Electronics Co., Ltd.
Jang Soon HAN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION
Publication number
20100090327
Publication date
Apr 15, 2010
SEIKO EPSON CORPORATION
Yoshiharu OGATA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20100046185
Publication date
Feb 25, 2010
Canon Kabushiki Kaisha
Hideaki Hirasawa
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME
Publication number
20100038117
Publication date
Feb 18, 2010
Yechung CHUNG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE THEREOF
Publication number
20090229871
Publication date
Sep 17, 2009
TDK Corporation
Masaaki Togashi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOA...
Publication number
20090218121
Publication date
Sep 3, 2009
Kabushiki Kaisha Toshiba
Norihiro ISHII
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20090179335
Publication date
Jul 16, 2009
Samsung Electronics Co., Ltd.
Yun-Jin OH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED BOARD AND FILTER USING THE SAME
Publication number
20090174502
Publication date
Jul 9, 2009
Junichi Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPAC...
Publication number
20090059469
Publication date
Mar 5, 2009
Samsung Electro-Mechanics CO., LTD.
Byoung Hwa LEE
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20080277803
Publication date
Nov 13, 2008
SEIKO EPSON CORPORATION
Yoshiharu OGATA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEV...
Publication number
20080236879
Publication date
Oct 2, 2008
Sanyo Electric Co., Ltd.
Yasuhiro Kohara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
Publication number
20080223608
Publication date
Sep 18, 2008
Fujitsu Limited
Takao NISHIMURA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...