Conductors directly under a component but not electrically connected to the component

Industry

CPC
H05K2201/09772

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09772Conductors directly under a component but not electrically connected to the component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board connector footprint
- Patent number 11,729,898
- Issue date Aug 15, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Justin Dennis Pickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, and contacting assembly having a semicondu...
- Patent number 11,310,913
- Issue date Apr 19, 2022
- Robert Bosch GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system and motherboard thereof
- Patent number 10,740,279
- Issue date Aug 11, 2020
- ASUSTeK COMPUTER Inc.
- Li-Chien Wan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device having a plated antenna and/or trace, and methods...
- Patent number 10,667,397
- Issue date May 26, 2020
- Thin Film Electronics ASA
- Mao Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate mitigating bridging
- Patent number 10,181,438
- Issue date Jan 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module
- Patent number 10,008,757
- Issue date Jun 26, 2018
- Murata Manufacturing Co., Ltd.
- Kunitoshi Hanaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing printed wiring board with conductive post...
- Patent number 9,713,267
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Toru Furuta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Printed wiring board, printed circuit board, and printed circuit bo...
- Patent number 9,282,634
- Issue date Mar 8, 2016
- Canon Kabushiki Kaisha
- Masaharu Ohira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device including interrupt wire
- Patent number 9,148,948
- Issue date Sep 29, 2015
- Denso Corporation
- Ryoichi Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,131,615
- Issue date Sep 8, 2015
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming thermally conductive lay...
- Patent number 8,999,760
- Issue date Apr 7, 2015
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device including interrupt wire
- Patent number 8,780,518
- Issue date Jul 15, 2014
- Denso Corporation
- Takahiko Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,780,575
- Issue date Jul 15, 2014
- Wistron Corporation
- Chih-Yung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board circuit apparatus and light source apparatus
- Patent number 8,746,925
- Issue date Jun 10, 2014
- AU OPTRONICS CORPORATION
- Hua-Chen Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board unit having routing unit mounted thereon and...
- Patent number 8,711,575
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Do-kyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,681,509
- Issue date Mar 25, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device and method for manufacturing sem...
- Patent number 8,436,456
- Issue date May 7, 2013
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved resin configuration
- Patent number 8,368,233
- Issue date Feb 5, 2013
- Seiko Epson Corporation
- Yoshiharu Ogata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape wiring substrates and packages including the same
- Patent number 8,350,158
- Issue date Jan 8, 2013
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and circuit device
- Patent number 8,258,409
- Issue date Sep 4, 2012
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming thermally conductive lay...
- Patent number 8,236,617
- Issue date Aug 7, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount structure, illumination apparatus and liquid crystal apparatus
- Patent number 8,212,957
- Issue date Jul 3, 2012
- Sony Corporation
- Daisuke Nakanishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring substrate and electronic device
- Patent number 8,125,789
- Issue date Feb 28, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board, printed circuit boa...
- Patent number 8,101,870
- Issue date Jan 24, 2012
- Kabushiki Kaisha Toshiba
- Norihiro Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 8,063,313
- Issue date Nov 22, 2011
- Samsung Electronics Co., Ltd.
- Yun-Jin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feedthrough capacitor and mounted structure thereof
- Patent number 8,018,711
- Issue date Sep 13, 2011
- TDK Corporation
- Masaaki Togashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved resin configuration
- Patent number 7,982,319
- Issue date Jul 19, 2011
- Seiko Epson Corporation
- Yoshiharu Ogata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate and semiconductor device
- Patent number 7,838,998
- Issue date Nov 23, 2010
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, display unit having the same and display de...
- Patent number 7,830,489
- Issue date Nov 9, 2010
- Samsung Electronics Co., Ltd.
- Ock-Jin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT, AND CONTACTING ASSEMBLY HAVING A SEMICONDU...
- Publication number 20200196449
- Publication date Jun 18, 2020
- ROBERT BOSCH GmbH
- Guenter Gera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190148280
- Publication date May 16, 2019
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Having a Plated Antenna and/or Trace, and Methods...
- Publication number 20180359858
- Publication date Dec 13, 2018
- Thin Film Electronics ASA
- Mao ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140041920
- Publication date Feb 13, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BO...
- Publication number 20140043783
- Publication date Feb 13, 2014
- Canon Kabushiki Kaisha
- Masaharu Ohira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Circuit Apparatus and Light Source Apparatus
- Publication number 20130120993
- Publication date May 16, 2013
- AU OPTRONICS CORPORATION
- Hua-Chen Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSFER CIRCUIT
- Publication number 20120262885
- Publication date Oct 18, 2012
- Hitachi, Ltd.
- Yasuhiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Thermally Conductive Lay...
- Publication number 20120248596
- Publication date Oct 4, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE
- Publication number 20120200973
- Publication date Aug 9, 2012
- Murata Manufacturing Co., Ltd.
- Ryoichi Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRRUPT WIRE
- Publication number 20120200972
- Publication date Aug 9, 2012
- Murata Manufacturing Co., Ltd.
- Takahiko FURUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND COMPUTER DEVICE HAVING THE SAME
- Publication number 20120002389
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Do-kyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Thermally Conductive Lay...
- Publication number 20110298110
- Publication date Dec 8, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20110247868
- Publication date Oct 13, 2011
- Wistron Corporation
- Chih-Yung CHIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION
- Publication number 20110241221
- Publication date Oct 6, 2011
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20110164391
- Publication date Jul 7, 2011
- Yee Na SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEM...
- Publication number 20110042828
- Publication date Feb 24, 2011
- Yoshiki Sota
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUSPENSION DESIGN FOR HIGH SHOCK PERFORMANCE SOLDERING BALL BONDING
- Publication number 20100214697
- Publication date Aug 26, 2010
- Minggao Yao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT STRUCTURE, ILLUMINATION APPARATUS AND LIQUID CRYSTAL APPARATUS
- Publication number 20100182529
- Publication date Jul 22, 2010
- EPSON IMAGING DEVICES CORPORATION
- Daisuke NAKANISHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100181101
- Publication date Jul 22, 2010
- Samsung Electronics Co., Ltd.
- Jang Soon HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION
- Publication number 20100090327
- Publication date Apr 15, 2010
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100046185
- Publication date Feb 25, 2010
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME
- Publication number 20100038117
- Publication date Feb 18, 2010
- Yechung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE THEREOF
- Publication number 20090229871
- Publication date Sep 17, 2009
- TDK Corporation
- Masaaki Togashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOA...
- Publication number 20090218121
- Publication date Sep 3, 2009
- Kabushiki Kaisha Toshiba
- Norihiro ISHII
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20090179335
- Publication date Jul 16, 2009
- Samsung Electronics Co., Ltd.
- Yun-Jin OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD AND FILTER USING THE SAME
- Publication number 20090174502
- Publication date Jul 9, 2009
- Junichi Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPAC...
- Publication number 20090059469
- Publication date Mar 5, 2009
- Samsung Electro-Mechanics CO., LTD.
- Byoung Hwa LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080277803
- Publication date Nov 13, 2008
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEV...
- Publication number 20080236879
- Publication date Oct 2, 2008
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20080223608
- Publication date Sep 18, 2008
- Fujitsu Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Conductors directly under a component but not electrically connected to the component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board connector footprint

Semiconductor substrate and method for manufacturing the same

Semiconductor component, and contacting assembly having a semicondu...

Computer system and motherboard thereof

Electronic device having a plated antenna and/or trace, and methods...

Semiconductor substrate mitigating bridging

High-frequency module

Method for manufacturing printed wiring board with conductive post...

Printed wiring board, printed circuit board, and printed circuit bo...

Electronic control device including interrupt wire

Printed circuit board

Semiconductor device and method of forming thermally conductive lay...

Electronic control device including interrupt wire

Printed circuit board

Circuit board circuit apparatus and light source apparatus

Printed circuit board unit having routing unit mounted thereon and...

Printed circuit board

Wiring board, semiconductor device and method for manufacturing sem...

Semiconductor device with improved resin configuration

Tape wiring substrates and packages including the same

Circuit board and circuit device

Semiconductor device and method of forming thermally conductive lay...

Mount structure, illumination apparatus and liquid crystal apparatus

Wiring substrate and electronic device

Method for manufacturing printed circuit board, printed circuit boa...

Printed circuit board and semiconductor package including the same

Feedthrough capacitor and mounted structure thereof

Semiconductor device with improved resin configuration

Mounting substrate and semiconductor device

Flexible circuit board, display unit having the same and display de...

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT, AND CONTACTING ASSEMBLY HAVING A SEMICONDU...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Electronic Device Having a Plated Antenna and/or Trace, and Methods...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BO...

Circuit Board Circuit Apparatus and Light Source Apparatus

SIGNAL TRANSFER CIRCUIT

Semiconductor Device and Method of Forming Thermally Conductive Lay...

ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE

ELECTRONIC CONTROL DEVICE INCLUDING INTERRRUPT WIRE

PRINTED CIRCUIT BOARD UNIT AND COMPUTER DEVICE HAVING THE SAME

Semiconductor Device and Method of Forming Thermally Conductive Lay...

PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEM...

SUSPENSION DESIGN FOR HIGH SHOCK PERFORMANCE SOLDERING BALL BONDING

MOUNT STRUCTURE, ILLUMINATION APPARATUS AND LIQUID CRYSTAL APPARATUS

PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION

PRINTED CIRCUIT BOARD

TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME

FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE THEREOF

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOA...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED BOARD AND FILTER USING THE SAME

MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPAC...

SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEV...

WIRING SUBSTRATE AND ELECTRONIC DEVICE