Conformal deposition

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CPC
H01L2224/11466

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11466Conformal deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,276,657
- Issue date Mar 15, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable component structure with electrical contact
- Patent number 10,777,521
- Issue date Sep 15, 2020
- X Display Company Technology Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 10,468,363
- Issue date Nov 5, 2019
- X-CELEPRINT LIMITED
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,217,687
- Issue date Feb 26, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 10,115,695
- Issue date Oct 30, 2018
- TOHOKU-MICROTEC CO., LTD
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,929,069
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with a double metal contact and related...
- Patent number 9,761,550
- Issue date Sep 12, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing integrated circuit chip attach in three dimensional st...
- Patent number 9,299,591
- Issue date Mar 29, 2016
- International Business Machines Corporation
- Phillip V. Mann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 9,263,378
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for fabricating fine-pitch micro-bumps
- Patent number 9,177,929
- Issue date Nov 3, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,093,313
- Issue date Jul 28, 2015
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 8,835,217
- Issue date Sep 16, 2014
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device including a double metal contact
- Patent number 8,791,525
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...
- Publication number 20240297135
- Publication date Sep 5, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220310550
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...
- Publication number 20220068873
- Publication date Mar 3, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangcai YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20190229045
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20180315727
- Publication date Nov 1, 2018
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180211895
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TIEN-CHUNG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170098588
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- TIEN-CHUNG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20170048976
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact and Related...
- Publication number 20160233185
- Publication date Aug 11, 2016
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20160035659
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Fabricating Fine-Pitch Micro-Bumps
- Publication number 20140342545
- Publication date Nov 20, 2014
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact
- Publication number 20140327057
- Publication date Nov 6, 2014
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT
- Publication number 20090212435
- Publication date Aug 27, 2009
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS

Conformal deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal bonding structure and manufacturing method thereof

Chiplets with connection posts

Chiplets with connection posts

Chiplets with connection posts

Chiplets with connection posts

Printable component structure with electrical contact

Ball grid array and land grid array assemblies fabricated using tem...

Chiplets with connection posts

Ball grid array and land grid array assemblies fabricated using tem...

Semiconductor device and manufacturing method thereof

Solid-state imaging device

Semiconductor device and manufacturing method thereof

Power semiconductor device with a double metal contact and related...

Semiconductor device and method of forming patterned repassivation...

Device packaging with substrates having embedded lines and metal de...

Implementing integrated circuit chip attach in three dimensional st...

Ball grid array and land grid array assemblies fabricated using tem...

Techniques for fabricating fine-pitch micro-bumps

Device packaging with substrates having embedded lines and metal de...

Semiconductor device and method of forming patterned repassivation...

Device packaging with substrates having embedded lines and metal de...

Power semiconductor device including a double metal contact

Patents Applicationslast 30 patents

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...

CHIPLETS WITH CONNECTION POSTS

ELECTRONIC DEVICE

ELECTRONIC DEVICE

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...

CHIPLETS WITH CONNECTION POSTS

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

SOLID-STATE IMAGING DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIPLETS WITH CONNECTION POSTS

Power Semiconductor Device with a Double Metal Contact and Related...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

Semiconductor Device and Method of Forming Patterned Repassivation...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

Techniques for Fabricating Fine-Pitch Micro-Bumps

Power Semiconductor Device with a Double Metal Contact

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

Semiconductor Device and Method of Forming Patterned Repassivation...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT