Conformal with the semiconductor or solid-state device

Industry

CPC
H01L2224/24051

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24051Conformal with the semiconductor or solid-state device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,901,374
- Issue date Feb 13, 2024
- Samsung Display Co., Ltd.
- Hang Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 11,848,335
- Issue date Dec 19, 2023
- Samsung Display Co., Ltd.
- Won Sik Oh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display panel, display device and control method
- Patent number 11,811,004
- Issue date Nov 7, 2023
- Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd.
- Liang Xing
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device
- Patent number 11,791,447
- Issue date Oct 17, 2023
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an optoelectronic semiconductor chip and optoel...
- Patent number 10,535,515
- Issue date Jan 14, 2020
- Osram Opto Semiconductors GmbH
- Joachim Hertkorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,510,729
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating at least one 3D interconnection for the manu...
- Patent number 10,438,923
- Issue date Oct 8, 2019
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with three-dimensional conductive planes, and m...
- Patent number 10,418,344
- Issue date Sep 17, 2019
- Micross Advanced Interconnect Technology LLC
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,157,891
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 9,754,925
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device and wafer level method of fabricati...
- Patent number 9,691,725
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,633,973
- Issue date Apr 25, 2017
- Samsung Electronics Co., Ltd.
- Kilsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component with a wireless contacting
- Patent number 9,537,070
- Issue date Jan 3, 2017
- Osram Opto Semiconductors GmbH
- Ewald Karl Michael Guenther
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240162406
- Publication date May 16, 2024
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021593
- Publication date Jan 18, 2024
- UNITED MICROELECTRONICS CORP.
- ZHIBIAO ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230260980
- Publication date Aug 17, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myeong Su SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
- Publication number 20230245992
- Publication date Aug 3, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230207543
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230163138
- Publication date May 25, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hee SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...
- Publication number 20230125730
- Publication date Apr 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byung Kyu SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230070620
- Publication date Mar 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230058776
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20230029503
- Publication date Feb 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- SEUNG-YEON CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230027391
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Na Hyeon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20230006095
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hoo Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230005962
- Publication date Jan 5, 2023
- LG Display Co., Ltd.
- Chang Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220406763
- Publication date Dec 22, 2022
- SAMSUNG DISPLAY CO., LTD.
- Eun A YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220392922
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367768
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sung Geun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220367433
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jeong Nyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20220320055
- Publication date Oct 6, 2022
- LG Display Co., Ltd.
- Jae Yong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220262827
- Publication date Aug 18, 2022
- SAMSUNG DISPLAY CO., LTD.
- Hang Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...
- Publication number 20220254753
- Publication date Aug 11, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220108973
- Publication date Apr 7, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210336108
- Publication date Oct 28, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hyun Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Conductive Tracks, and Electronic Module
- Publication number 20210202434
- Publication date Jul 1, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS

Conformal with the semiconductor or solid-state device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Display device

Display device

Display panel, display device and control method

Display device

Semiconductor device assembly and method therefor

Systems, methods, and apparatuses for implementing reduced height s...

Bare die integration with printed components on flexible substrate...

Semiconductor package and method of fabricating semiconductor package

Method of producing an optoelectronic semiconductor chip and optoel...

3DIC interconnect apparatus and method

Method for integrating at least one 3D interconnection for the manu...

Electronic packages with three-dimensional conductive planes, and m...

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Bare die integration with printed components on flexible substrate...

3DIC interconnect apparatus and method

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Semiconductor device having a sealant layer including carbon direct...

Method and apparatus for printing integrated circuit bond connections

Redistribution layer system in package

Apparatus, system, and method for wireless connection in integrated...

Integrated circuit with printed bond connections

Method of mounting semiconductor chips, semiconductor device obtain...

Wafer stack protection seal

3DIC interconnect apparatus and method

Integrated semiconductor device and wafer level method of fabricati...

Semiconductor package

Optoelectronic component with a wireless contacting

Patents Applicationslast 30 patents

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY PANEL

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

DISPLAY DEVICE

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

DISPLAY DEVICE

PIXEL AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

LIGHT EMITTING DIODE DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

DISPLAY DEVICE

Method for Producing Conductive Tracks, and Electronic Module

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...