Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

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H01L2224/48151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contactless card and method of assembly
- Patent number 12,124,906
- Issue date Oct 22, 2024
- CAPITAL ONE SERVICES, LLC
- Kevin Osborn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic molded package
- Patent number 12,087,678
- Issue date Sep 10, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a metal plate
- Patent number 11,569,148
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Koki Hayakashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,515,220
- Issue date Nov 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,482,460
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contactless card and method of assembly
- Patent number 11,341,390
- Issue date May 24, 2022
- CAPITAL ONE SERVICES, LLC
- Kevin Osborn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contactless card and method of assembly
- Patent number 10,860,914
- Issue date Dec 8, 2020
- CAPITAL ONE SERVICES, LLC
- Kevin Osborn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module
- Patent number 10,832,994
- Issue date Nov 10, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of a folding magnetic coupling isolator, leadfram...
- Patent number 10,748,839
- Issue date Aug 18, 2020
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of folding magnetic coupling isolator and leadfra...
- Patent number 10,529,657
- Issue date Jan 7, 2020
- Lite-On Singapore Pte. Ltd.
- You-Fa Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 9,406,637
- Issue date Aug 2, 2016
- Aoi Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier
- Patent number 8,610,507
- Issue date Dec 17, 2013
- Kabushiki Kaisha Toshiba
- Choon Yong Ng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 8,525,335
- Issue date Sep 3, 2013
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH WIRE BOND
- Publication number 20240162121
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- STANLEY CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145295
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jihyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Molded Heat Dissipation Plate
- Publication number 20240145325
- Publication date May 2, 2024
- Infineon Technologies Austria AG
- Joon Seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AN...
- Publication number 20230307326
- Publication date Sep 28, 2023
- Mitsubishi Electric Corporation
- Takatoshi YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230207392
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230197544
- Publication date Jun 22, 2023
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230101079
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Tomonori TANIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20230093554
- Publication date Mar 23, 2023
- DENSO CORPORATION
- SEIGO OOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, PACKAGING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20230028628
- Publication date Jan 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20230005827
- Publication date Jan 5, 2023
- Shinko Electric Industries Co., Ltd.
- Jun Izuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS CARD AND METHOD OF ASSEMBLY
- Publication number 20220253663
- Publication date Aug 11, 2022
- Capital One Services, LLC
- Kevin OSBORN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Molded Package
- Publication number 20220157699
- Publication date May 19, 2022
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220139803
- Publication date May 5, 2022
- Mitsubishi Electric Corporation
- Koki HAYAKASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210242176
- Publication date Aug 5, 2021
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS CARD AND METHOD OF ASSEMBLY
- Publication number 20210201104
- Publication date Jul 1, 2021
- Capital One Services, LLC
- Kevin OSBORN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210175135
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chia Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20200243425
- Publication date Jul 30, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF A FOLDING MAGNETIC COUPLING ISOLATOR, LEADFRAM...
- Publication number 20200091049
- Publication date Mar 19, 2020
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF FOLDING MAGNETIC COUPLING ISOLATOR AND LEADFRA...
- Publication number 20190122971
- Publication date Apr 25, 2019
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...
- Publication number 20160093587
- Publication date Mar 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20150097302
- Publication date Apr 9, 2015
- TERA PROBE, INC.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140225276
- Publication date Aug 14, 2014
- Xintec Inc.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20130320526
- Publication date Dec 5, 2013
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contactless card and method of assembly

Electronic molded package

Bonding wire for semiconductor devices

Semiconductor device with a metal plate

Semiconductor package structures and methods of manufacturing the same

Semiconductor package structures and methods of manufacturing the same

Contactless card and method of assembly

Contactless card and method of assembly

Electronic module

Package structure of a folding magnetic coupling isolator, leadfram...

Method of manufacturing multi-chip package

Package structure of folding magnetic coupling isolator and leadfra...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor device including a polymer disposed on a carrier

Power amplifier

Semiconductor construct and manufacturing method thereof as well as...

Patents Applicationslast 30 patents

PACKAGE WITH MOLDING CAVITY

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION

INTEGRATED CIRCUIT PACKAGE WITH WIRE BOND

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Package with Molded Heat Dissipation Plate

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AN...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

PACKAGE STRUCTURE, PACKAGING METHOD AND SEMICONDUCTOR DEVICE

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

CONTACTLESS CARD AND METHOD OF ASSEMBLY

Electronic Molded Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

CONTACTLESS CARD AND METHOD OF ASSEMBLY

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC MODULE

PACKAGE STRUCTURE OF A FOLDING MAGNETIC COUPLING ISOLATOR, LEADFRAM...

PACKAGE STRUCTURE OF FOLDING MAGNETIC COUPLING ISOLATOR AND LEADFRA...

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

CHIP PACKAGE

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...