Connecting between the body and an opposite side of the item with respect to the body

Industry

CPC
H01L2224/4824

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4824Connecting between the body and an opposite side of the item with respect to the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor laser device
- Patent number 12,142,892
- Issue date Nov 12, 2024
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having lead frame with semiconductor die and...
- Patent number 12,125,771
- Issue date Oct 22, 2024
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 12,115,023
- Issue date Oct 15, 2024
- Teratech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,808
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,084,609
- Issue date Sep 10, 2024
- Citizen Electronics Co., Ltd.
- Byungchul Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing si...
- Patent number 12,080,762
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Naoyuki Ohse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device
- Patent number 12,078,308
- Issue date Sep 3, 2024
- LG Innotek Co., Ltd
- Kwang Ho Park
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,068,230
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,235
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masaaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain-induced shift mitigation in semiconductor packages
- Patent number 12,068,261
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240387333
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gi Jeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
- Publication number 20240387443
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronics Assembly
- Publication number 20240379508
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Christian Radüge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240376380
- Publication date Nov 14, 2024
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379574
- Publication date Nov 14, 2024
- Rohm Co., Ltd.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240371735
- Publication date Nov 7, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME
- Publication number 20240371658
- Publication date Nov 7, 2024
- TOWA CORPORATION
- Syuho HANASAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Therefor
- Publication number 20240371740
- Publication date Nov 7, 2024
- Nippon Telegraph and Telephone Corporation
- Yusuke Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY
- Publication number 20240363466
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion Solas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363606
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
- Publication number 20240363499
- Publication date Oct 31, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...
- Publication number 20240363504
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CONTROL SYSTEM
- Publication number 20240363500
- Publication date Oct 31, 2024
- RENESAS ELECTRONICS CORPORATION
- Yoshimasa UCHINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240355715
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Shuhei YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...
- Publication number 20240355719
- Publication date Oct 24, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347472
- Publication date Oct 17, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH BACK-SIDE TRANSFO...
- Publication number 20240347473
- Publication date Oct 17, 2024
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332171
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS
- Publication number 20240332135
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS

Connecting between the body and an opposite side of the item with respect to the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor laser device

Semiconductor device

Heat sink, semiconductor package and semiconductor module

Memory bandwidth aggregation using simultaneous access of stacked s...

Semiconductor device

Semiconductor package having lead frame with semiconductor die and...

Semiconductor module with a first substrate, a second substrate and...

Methods and apparatus for an improved integrated circuit package

Tablet ultrasound system

Semiconductor device with sense terminal

Low pressure sintering powder

Semiconductor chip package including lead frame and manufacturing m...

Offset interposers for large-bottom packages and large-die package-...

Semiconductor device

Leadframe package with pre-applied filler material

Semiconductor device

QFN device having a mechanism that enables an inspectable solder jo...

Spring bar leadframe, method and packaged electronic device with ze...

Light emitting device

Semiconductor package and methods of manufacturing a semiconductor...

Silicon carbide semiconductor device and method of manufacturing si...

Package with different types of semiconductor dies attached to a fl...

Semiconductor package with releasable isolation layer protection

Lighting device

Flat no-lead package with surface mounted structure

Three-dimensional functional integration

Semiconductor module

Semiconductor device

Strain-induced shift mitigation in semiconductor packages

Semiconductor device and corresponding method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

Power Electronics Assembly

LIGHT EMITTING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

Semiconductor Device and Manufacturing Method Therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY

SEMICONDUCTOR DEVICE

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...

ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...

DIE ISOLATION WITH CONFORMAL COATING

SEMICONDUCTOR DEVICE AND CONTROL SYSTEM

SEMICONDUCTOR APPARATUS

THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...

Power Semiconductor Devices Including Beryllium Metallization

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH BACK-SIDE TRANSFO...

ELECTRONIC DEVICE

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

LEAD FRAME AND SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS