Connecting between the body and an opposite side of the item with respect to the body

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H01L2224/4826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4826Connecting between the body and an opposite side of the item with respect to the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,595
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Shunsuke Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant material at locations of high fields
- Patent number 11,749,712
- Issue date Sep 5, 2023
- Skyworks Solutions, Inc.
- Dan B. Kasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,442
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Atsushi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chip and capacitor
- Patent number 11,450,627
- Issue date Sep 20, 2022
- SK hynix Inc.
- Dae Hyeok Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,351
- Issue date Sep 6, 2022
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant material at locations of high fields
- Patent number 11,205,696
- Issue date Dec 21, 2021
- Skyworks Solutions, Inc.
- Dan B. Kasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 11,183,489
- Issue date Nov 23, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,127,671
- Issue date Sep 21, 2021
- ABB Power Grids Switzerland AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microphone package structure
- Patent number 10,943,870
- Issue date Mar 9, 2021
- Merry Electronics (Shenzhen) Co., Ltd.
- Chao-Sen Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packaging structure, chip module and electronic terminal
- Patent number 10,854,526
- Issue date Dec 1, 2020
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 10,763,201
- Issue date Sep 1, 2020
- Littelfuse, Inc.
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,672,762
- Issue date Jun 2, 2020
- Fuji Electric Co., Ltd.
- Akio Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including miniature antenna
- Patent number 10,644,405
- Issue date May 5, 2020
- Fractus, S.A.
- Jordi Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip-on-board module with edge connector
- Patent number 10,622,289
- Issue date Apr 14, 2020
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Grant
Resonator device, electronic apparatus, and vehicle
- Patent number 10,594,295
- Issue date Mar 17, 2020
- Seiko Epson Corporation
- Akio Tsutsumi
- G04 - HOROLOGY
Information Patent Grant
IGBT die structure with auxiliary P well terminal
- Patent number 10,535,760
- Issue date Jan 14, 2020
- Littelfuse, Inc.
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with passive device
- Patent number 10,497,678
- Issue date Dec 3, 2019
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,497,664
- Issue date Dec 3, 2019
- Automated Assembly Corporation
- Robert Neuman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cross-connected multi-chip modules coupled by silicon bent-bridge i...
- Patent number 10,431,545
- Issue date Oct 1, 2019
- Intel IP Corporation
- Georg Seidemann
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for encasing an electric unit and electrical structural element
- Patent number 10,390,435
- Issue date Aug 20, 2019
- Continental Teves AG & Co. oHG
- Jakob Schillinger
- G01 - MEASURING TESTING
Information Patent Grant
Methods for magnetic sensor having non-conductive die paddle
- Patent number 10,333,055
- Issue date Jun 25, 2019
- Allegro MicroSystems, LLC
- Shaun D. Milano
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package including miniature antenna
- Patent number 10,320,079
- Issue date Jun 11, 2019
- Fractus, S.A.
- Jordi Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin leadframe QFN package design of RF front-ends for mobile wirel...
- Patent number 10,271,448
- Issue date Apr 23, 2019
- INVESTAR CORPORATION
- Cindy Yuen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of battery protection circuit module package coupled with...
- Patent number 10,193,193
- Issue date Jan 29, 2019
- ITM SEMICONDUCTOR CO., LTD.
- Hyeokhwi Na
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device, package, and vehicle
- Patent number 10,186,479
- Issue date Jan 22, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidenori Katsumura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package structure based on cascade circuits
- Patent number 10,163,811
- Issue date Dec 25, 2018
- Gpower Semiconductor, Inc.
- Shufeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall effect sensing element
- Patent number 10,162,020
- Issue date Dec 25, 2018
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensorless temperature compensation for power switching devices
- Patent number 10,122,357
- Issue date Nov 6, 2018
- Ford Global Technologies, LLC
- Xi Lu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component, semiconductor package, and electronic device...
- Patent number 10,083,136
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Nam-ho Song
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128248
- Publication date Apr 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411366
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS
- Publication number 20230097808
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Keisuke FUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230089615
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichi AGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MEMORY DEVICE INCLUDING THE SAME
- Publication number 20230076865
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Hyunjin KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301984
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Shunsuke MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIELECTRIC CONSTANT MATERIAL AT LOCATIONS OF HIGH FIELDS
- Publication number 20220115497
- Publication date Apr 14, 2022
- Skyworks Solutions, Inc.
- Dan B. Kasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077115
- Publication date Mar 10, 2022
- KIOXIA Corporation
- Yasuo OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20210305203
- Publication date Sep 30, 2021
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIELECTRIC CONSTANT MATERIAL AT LOCATIONS OF HIGH FIELDS
- Publication number 20210193791
- Publication date Jun 24, 2021
- Silicon Laboratories Inc.
- Dan B. Kasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200295462
- Publication date Sep 17, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPHONE PACKAGE STRUCTURE
- Publication number 20200267479
- Publication date Aug 20, 2020
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Chao-Sen CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200028264
- Publication date Jan 23, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-CONNECTED MULTI-CHIP MODULES COUPLED BY SILICON BENT-BRIDGE I...
- Publication number 20190006281
- Publication date Jan 3, 2019
- Georg Seidemann
- G11 - INFORMATION STORAGE
Information Patent Application
RESONATOR DEVICE, ELECTRONIC APPARATUS, AND VEHICLE
- Publication number 20190007027
- Publication date Jan 3, 2019
- SEIKO EPSON CORPORATION
- Akio TSUTSUMI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20180331427
- Publication date Nov 15, 2018
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Die Structure With Auxiliary P Well Terminal
- Publication number 20180145162
- Publication date May 24, 2018
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSORLESS TEMPERATURE COMPENSATION FOR POWER SWITCHING DEVICES
- Publication number 20180138902
- Publication date May 17, 2018
- FORD GLOBAL TECHNOLOGIES, L.L.C.
- XI LU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Lead And Lead Frame For Power Package
- Publication number 20180096918
- Publication date Apr 5, 2018
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL EFFECT SENSING ELEMENT
- Publication number 20180074137
- Publication date Mar 15, 2018
- Allegro Microsystems, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20170358862
- Publication date Dec 14, 2017
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ANTENNA STRUCTURE
- Publication number 20170278807
- Publication date Sep 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
- Publication number 20170263540
- Publication date Sep 14, 2017
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Application
SIGNAL TRANSMISSION DEVICE USING ELECTROMAGNETIC RESONANCE COUPLER
- Publication number 20170256507
- Publication date Sep 7, 2017
- Panasonic Intellectual Property Management Co., Lt
- SONGBAEK CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE, AND VEHICLE
- Publication number 20170162490
- Publication date Jun 8, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- HIDENORI KATSUMURA
- B60 - VEHICLES IN GENERAL
Information Patent Application
OUTPUT IMPEDANCE MATCHING CIRCUIT FOR RF AMPLIFIER DEVICES, AND MET...
- Publication number 20170117239
- Publication date Apr 27, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Olivier Lembeye
- H01 - BASIC ELECTRIC ELEMENTS

Connecting between the body and an opposite side of the item with respect to the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and corresponding method of manufacture

Semiconductor device

High dielectric constant material at locations of high fields

Semiconductor device

Semiconductor package including semiconductor chip and capacitor

Semiconductor device

High dielectric constant material at locations of high fields

Power electronics module

Power semiconductor module

Microphone package structure

Chip packaging structure, chip module and electronic terminal

Lead and lead frame for power package

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit package including miniature antenna

Stacked chip-on-board module with edge connector

Resonator device, electronic apparatus, and vehicle

IGBT die structure with auxiliary P well terminal

Semiconductor package assembly with passive device

Wire bonded electronic devices to round wire

Cross-connected multi-chip modules coupled by silicon bent-bridge i...

Method for encasing an electric unit and electrical structural element

Methods for magnetic sensor having non-conductive die paddle

Integrated circuit package including miniature antenna

Thin leadframe QFN package design of RF front-ends for mobile wirel...

Structure of battery protection circuit module package coupled with...

Semiconductor device, package, and vehicle

Semiconductor package structure based on cascade circuits

Hall effect sensing element

Sensorless temperature compensation for power switching devices

Electronic component, semiconductor package, and electronic device...

Patents Applicationslast 30 patents

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CHIP PARTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MEMORY DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

HIGH DIELECTRIC CONSTANT MATERIAL AT LOCATIONS OF HIGH FIELDS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

HIGH DIELECTRIC CONSTANT MATERIAL AT LOCATIONS OF HIGH FIELDS

Integrated Circuit Package Including Miniature Antenna

MICROPHONE PACKAGE STRUCTURE

Integrated Circuit Package Including Miniature Antenna

CROSS-CONNECTED MULTI-CHIP MODULES COUPLED BY SILICON BENT-BRIDGE I...

RESONATOR DEVICE, ELECTRONIC APPARATUS, AND VEHICLE

Integrated Circuit Package Including Miniature Antenna

IGBT Die Structure With Auxiliary P Well Terminal

SENSORLESS TEMPERATURE COMPENSATION FOR POWER SWITCHING DEVICES

Lead And Lead Frame For Power Package

HALL EFFECT SENSING ELEMENT

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

Integrated Circuit Package Including Miniature Antenna

ELECTRONIC PACKAGE WITH ANTENNA STRUCTURE

STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

SIGNAL TRANSMISSION DEVICE USING ELECTROMAGNETIC RESONANCE COUPLER

SEMICONDUCTOR DEVICE, PACKAGE, AND VEHICLE

OUTPUT IMPEDANCE MATCHING CIRCUIT FOR RF AMPLIFIER DEVICES, AND MET...