Connecting bonding areas at different heights

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H01L2224/48105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48105Connecting bonding areas at different heights

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,027,545
- Issue date Jul 2, 2024
- Tong Hsing Electronic Industries, Ltd.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatuses and systems having ball grid arrays and associated micr...
- Patent number 11,942,404
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Matthew B. Leslie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 11,923,344
- Issue date Mar 5, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,923,825
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,848,299
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 11,830,849
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Saurabh Nilkanth Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with interconnected modules
- Patent number 11,817,438
- Issue date Nov 14, 2023
- Intel Corporationd
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,581,260
- Issue date Feb 14, 2023
- Kore Semiconductor Co., Ltd.
- Chi-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,482,504
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,410,974
- Issue date Aug 9, 2022
- Kioxia Corporation
- Masahiro Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package structure and manufacturing method the...
- Patent number 11,404,613
- Issue date Aug 2, 2022
- Wistron Corporation
- Zhiyi Liang
- G02 - OPTICS
Information Patent Grant
Multi-sided cooling semiconductor package and method of manufacturi...
- Patent number 11,380,646
- Issue date Jul 5, 2022
- Life-On Semiconductor Corporation
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,251,156
- Issue date Feb 15, 2022
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PACKAGE DATA STORAGE DEVICE
- Publication number 20240407180
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20240363655
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...
- Publication number 20240321653
- Publication date Sep 26, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...
- Publication number 20240297096
- Publication date Sep 5, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240274578
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20240274584
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240266335
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Huan-Shiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203900
- Publication date Jun 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120300
- Publication date Apr 11, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105573
- Publication date Mar 28, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE
- Publication number 20240105616
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Ki Bum KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
- Publication number 20240105557
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER,...
- Publication number 20240096850
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS

Connecting bonding areas at different heights

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with pre-applied filler material

Light emitting device and method of manufacturing the same

Sensor package structure

Sensor package and manufacturing method thereof

Apparatuses and systems having ball grid arrays and associated micr...

Compact power module

Semiconductor device and method for manufacturing the same

Die attached leveling control by metal stopper bumps

Semiconductor memory device

Edge-notched substrate packaging and associated systems and methods

Semiconductor package structure with heat sink and method preparing...

Semiconductor device and manufacturing method thereof

Semiconductor device package

Semiconductor device with unbalanced die stackup

System in package with interconnected modules

Wire bond wires for interference shielding

Integrated circuit and electronic device comprising a plurality of...

Sensor package and manufacturing method thereof

Fabrication and use of through silicon vias on double sided interco...

Package structure and manufacturing method thereof

Semiconductor package

Semiconductor package structure with heat sink and method preparing...

Edge-notched substrate packaging and associated systems and methods

Lead frame-based semiconductor package

Wire bond wires for interference shielding

Semiconductor memory device

Light emitting diode package structure and manufacturing method the...

Multi-sided cooling semiconductor package and method of manufacturi...

Chip package structure and manufacturing method thereof

Fabrication and use of through silicon vias on double sided interco...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

SINGLE PACKAGE DATA STORAGE DEVICE

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

IMAGE SENSOR MODULE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

STACK PACKAGES

LEAD FRAME AND SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

CHIP PACKAGE STRUCTURE

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...

STACKED SEMICONDUCTOR DEVICE

COMPACT POWER MODULE

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Making a Semiconductor Package w...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

CHIP PACKAGE

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME

POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...

HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER,...