Connecting bonding areas at the same height

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H01L2224/48101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48101Connecting bonding areas at the same height

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement comprising a semiconductor element, a sub...
- Patent number 12,136,603
- Issue date Nov 5, 2024
- Siemens Aktiengesellschaft
- Bernd Kürten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
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- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Kenta Nakahara
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Information Patent Grant
Sensor package structure
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- Issue date Jul 2, 2024
- Tong Hsing Electronic Industries, Ltd.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
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- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,676,871
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device and method of manufacture
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- Issue date Mar 7, 2023
- Melexis Technologies NV
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
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- Issue date Aug 16, 2022
- Rohm Co., Ltd.
- Dai Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 11,309,275
- Issue date Apr 19, 2022
- KINGPAK TECHNOLOGY INC.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, semiconductor device and IGBT module
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- Issue date Feb 22, 2022
- Infineon Technologies AG
- Vera Van Treek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,244,875
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
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- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic module via compression molding
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- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,133,398
- Issue date Sep 28, 2021
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high thermal conductivity die attach
- Patent number 10,957,635
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 10,861,760
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure, chip module and electronic terminal
- Patent number 10,854,526
- Issue date Dec 1, 2020
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,253
- Issue date Oct 13, 2020
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for communication across a capacitively coupled channel
- Patent number 10,804,845
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Subhashish Mukherjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including multiple semiconductor chips and me...
- Patent number 10,784,244
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED filament and LED light bulb
- Patent number 10,784,428
- Issue date Sep 22, 2020
- ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.
- Tao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging power semiconductor module including power tran...
- Patent number 10,566,258
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard bond wires in an integrated circuit package
- Patent number 10,553,543
- Issue date Feb 4, 2020
- Ampleon Netherlands B.V.
- Vittorio Cuoco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 10,546,806
- Issue date Jan 28, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure of semiconductor device
- Patent number 10,535,813
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Shinsei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...
- Publication number 20240266312
- Publication date Aug 8, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047313
- Publication date Feb 8, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR
- Publication number 20230369198
- Publication date Nov 16, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Elizabeth Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361012
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230223331
- Publication date Jul 13, 2023
- MTAL GMBH
- Munaf RAHIMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Electronic Device Comprising the Same
- Publication number 20230178464
- Publication date Jun 8, 2023
- Ampleon Netherlands B.V.
- Jurgen Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT MODULE AND LIDAR APPARATUS HAVING AT LEAST ONE LIGHT MODULE O...
- Publication number 20230023489
- Publication date Jan 26, 2023
- Elmos Semiconductor SE
- Andre SROWIG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
- Publication number 20220328453
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220302008
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220044977
- Publication date Feb 10, 2022
- Mitsubishi Electric Corporation
- Yasutaka SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210398934
- Publication date Dec 23, 2021
- Kingpak Technology Inc.
- CHUNG-HSIEN HSIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR
- Publication number 20210391445
- Publication date Dec 16, 2021
- Rohm Co., Ltd.
- Akihiro HIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Semiconductor Device and IGBT Module
- Publication number 20210119003
- Publication date Apr 22, 2021
- Vera Van Treek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20210098670
- Publication date Apr 1, 2021
- Rohm Co., Ltd.
- Dai MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH
- Publication number 20200303285
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic Module with Improved Heat Dissipation and Fabrication Th...
- Publication number 20200266121
- Publication date Aug 20, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20200185287
- Publication date Jun 11, 2020
- Mitsubishi Electric Corporation
- Yasutaka SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS

Connecting bonding areas at the same height

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement comprising a semiconductor element, a sub...

Power module

Sensor package structure

Semiconductor package including a dummy pad

Semiconductor device including sense insulated-gate bipolar transistor

Semiconductor device package

Ribbon bond solution for reducing thermal stress on an intermittent...

Semiconductor device and manufacturing method for semiconductor device

Sensor device and method of manufacture

Semiconductor light emitting device

Sensor package structure

Semiconductor die, semiconductor device and IGBT module

Semiconductor device and manufacturing method for semiconductor device

Microfluidic manufactured mesoscopic microelectronics interconnect

Method for fabricating an electronic module via compression molding

Semiconductor device including sense insulated-gate bipolar transistor

Method of manufacturing semiconductor module and semiconductor module

Multi-chip package with high thermal conductivity die attach

Semiconductor device

Method of manufacturing semiconductor devices and corresponding sem...

Chip packaging structure, chip module and electronic terminal

Semiconductor device

Apparatus for communication across a capacitively coupled channel

Semiconductor package including multiple semiconductor chips and me...

LED filament and LED light bulb

Semiconductor module with temperature detecting element

Method of packaging power semiconductor module including power tran...

Guard bond wires in an integrated circuit package

Semiconductor apparatus

Semiconductor device and mounting structure of semiconductor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

LEAD FRAME AND SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

DOCUMENT STRUCTURE FORMATION

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

WINDOW BALL GRID ARRAY (WBGA) PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

Electronic Package and Electronic Device Comprising the Same

SEMICONDUCTOR DEVICE

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

LIGHT MODULE AND LIDAR APPARATUS HAVING AT LEAST ONE LIGHT MODULE O...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SENSOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR

Semiconductor Die, Semiconductor Device and IGBT Module

SEMICONDUCTOR LIGHT EMITTING DEVICE

MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH

Electronic Module with Improved Heat Dissipation and Fabrication Th...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE