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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated shielding in a current sensor
- Patent number 12,210,040
- Issue date Jan 28, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,191,435
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, semiconductor device, and joining method
- Patent number 12,168,262
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and a package on package type semiconductor...
- Patent number 12,166,013
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,159,857
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungseok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 12,115,023
- Issue date Oct 15, 2024
- Teratech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
- Publication number 20250107305
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...
- Publication number 20250105217
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087622
- Publication date Mar 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuaki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION
- Publication number 20250079388
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOHN CARLO CRUZ MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079389
- Publication date Mar 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Integrated Shielding in a Current Sensor
- Publication number 20250067778
- Publication date Feb 27, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070076
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE DEVICES FORMED ON GALLIUM AND NITROGEN MATERIAL
- Publication number 20250070536
- Publication date Feb 27, 2025
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND JOINING METHOD
- Publication number 20250065440
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069997
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
- Publication number 20250054902
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20250046699
- Publication date Feb 6, 2025
- Shanghai Avic Opto Electronics Co., Ltd.
- Huijun JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20250014951
- Publication date Jan 9, 2025
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
- Publication number 20240413107
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Connecting portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package type semiconductor package

Electronic devices in semiconductor package cavities

Wire bond wires for interference shielding

Palladium-coated copper bonding wire, manufacturing method of palla...

Systems and methods for integrated shielding in a current sensor

Transient liquid phase bonding compositions and power electronics a...

Semiconductor light-emitting device

Semiconductor device

Semiconductor device

Low cost package warpage solution

Method for processing memory device

Semiconductor device

Joint structure, semiconductor device, and joining method

Semiconductor device

Semiconductor package, and a package on package type semiconductor...

Image pickup device and electronic apparatus

Semiconductor package

Semiconductor package with nickel-silver pre-plated leadframe

Memory device comprising programmable command-and-address and/or da...

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor package including stacked semiconductor chips

Printed circuit board and method of producing printed circuit board

Semiconductor device

Extendable inner lead for leaded package

Tablet ultrasound system

Methods and apparatus for an improved integrated circuit package

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Offset interposers for large-bottom packages and large-die package-...

Leadframe package with pre-applied filler material

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

LOW COST PACKAGE WARPAGE SOLUTION

DAM LAMINATE ISOLATION SUBSTRATE

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Systems and Methods for Integrated Shielding in a Current Sensor

SEMICONDUCTOR DEVICE

DUAL SWITCHING POWER DEVICE

MANUFACTURABLE DEVICES FORMED ON GALLIUM AND NITROGEN MATERIAL

JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND JOINING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

BALL-BOND ARRANGEMENT

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR