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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising transistor
- Patent number 12,364,041
- Issue date Jul 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diodes and methods
- Patent number 12,364,074
- Issue date Jul 15, 2025
- CreeLED, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,341,090
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,322,605
- Issue date Jun 3, 2025
- Mitsubishi Electric Corporation
- Motoru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor element mounting package and optical semicond...
- Patent number 12,317,657
- Issue date May 27, 2025
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,315,789
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor package manufacturing method,...
- Patent number 12,310,132
- Issue date May 20, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond capillary design
- Patent number 12,308,341
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,556
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including recognition marks
- Patent number 12,278,193
- Issue date Apr 15, 2025
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage-controlled switching device with resistive path
- Patent number 12,266,680
- Issue date Apr 1, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated shielding in a current sensor
- Patent number 12,210,040
- Issue date Jan 28, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,191,435
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250239549
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Pierre-Yves PICHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233100
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Youn Jo MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...
- Publication number 20250219008
- Publication date Jul 3, 2025
- Heraeus Electronics GmbH & Co. KG
- Marcel NEUBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LIGHT SOURCE USING A LASER DIODE
- Publication number 20250219351
- Publication date Jul 3, 2025
- KYOCERA SLD Laser, Inc.
- James W. Raring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TABLET ULTRASOUND SYSTEM
- Publication number 20250213221
- Publication date Jul 3, 2025
- TeraTech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE
- Publication number 20250210470
- Publication date Jun 26, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20250210539
- Publication date Jun 26, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210555
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WIRE BOND CONFIGURATION FOR A LIGHT EMITTING DIODE PACKAGE
- Publication number 20250212573
- Publication date Jun 26, 2025
- DOMINANT Opto Technologies Sdn Bhd
- LOW TEK BENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...
- Publication number 20250201752
- Publication date Jun 19, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192094
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT
- Publication number 20250183220
- Publication date Jun 5, 2025
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR
- Publication number 20250174507
- Publication date May 29, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167164
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jiyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250167145
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...
- Publication number 20250158007
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES
- Publication number 20250140620
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas KRONENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
- Publication number 20250140735
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari AUSTRIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20250131953
- Publication date Apr 24, 2025
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Connecting portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device comprising transistor

Integrated circuit (IC) and electronic apparatus

Light emitting diodes and methods

Semiconductor device and method for manufacturing the same

Window ball grid array (WBGA) package and method for manufacturing...

Semiconductor device comprising PN junction diode and Schottky barr...

Inverted leads for packaged isolation devices

Semiconductor device and method of manufacturing semiconductor device

Optical semiconductor element mounting package and optical semicond...

Window ball grid array (WBGA) package and method for manufacturing...

Semiconductor package, semiconductor package manufacturing method,...

Wire bond capillary design

Solder material

Siliconized heterogeneous optical engine

Semiconductor device and method for manufacturing the same

Semiconductor packages

Package structure

Semiconductor devices including recognition marks

Ball bond impedance matching

Voltage-controlled switching device with resistive path

Package-on-package type semiconductor package

Electronic devices in semiconductor package cavities

Wire bond wires for interference shielding

Palladium-coated copper bonding wire, manufacturing method of palla...

Systems and methods for integrated shielding in a current sensor

Transient liquid phase bonding compositions and power electronics a...

Semiconductor light-emitting device

Semiconductor device

Semiconductor device

Low cost package warpage solution

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

INTEGRATED LIGHT SOURCE USING A LASER DIODE

TABLET ULTRASOUND SYSTEM

POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ENHANCED WIRE BOND CONFIGURATION FOR A LIGHT EMITTING DIODE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP

METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

CHIP PACKAGE