TREA

Connecting portions

Follow

Industry

  • CPC
  • H01L2224/494
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/494Connecting portions
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250006621
    • Publication date Jan 2, 2025
    • ROHM CO., LTD.
    • Ryohei UMENO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240387495
    • Publication date Nov 21, 2024
    • Samsung Electronics Co., Ltd.
    • Minwoo LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH SPEED, EFFICIENT SIC POWER MODULE
    • Publication number 20240380320
    • Publication date Nov 14, 2024
    • Wolfspeed, Inc.
    • Mrinal K. DAS
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
    • Publication number 20240363503
    • Publication date Oct 31, 2024
    • Avago Technologies International Sales Pte. Limited
    • Dingyou Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240347426
    • Publication date Oct 17, 2024
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGES WITH ELECTRICAL FUSES
    • Publication number 20240332243
    • Publication date Oct 3, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Mahmud Halim CHOWDHURY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
    • Publication number 20240258212
    • Publication date Aug 1, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Rajen MURUGAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240258248
    • Publication date Aug 1, 2024
    • ROHM CO., LTD.
    • Katsuhiko YOSHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20240234380
    • Publication date Jul 11, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20240136335
    • Publication date Apr 25, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
    • Publication number 20240096387
    • Publication date Mar 21, 2024
    • Rambus Inc.
    • Ian Shaeffer
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20240047376
    • Publication date Feb 8, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
    • Publication number 20230395566
    • Publication date Dec 7, 2023
    • Micron Technology, Inc.
    • Vijayakrishna J. Vankayala
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
    • Publication number 20230395565
    • Publication date Dec 7, 2023
    • Micron Technology, Inc.
    • Vijayakrishna J. Vankayala
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230378018
    • Publication date Nov 23, 2023
    • Rohm Co., Ltd.
    • Hajime OKUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230343735
    • Publication date Oct 26, 2023
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230253298
    • Publication date Aug 10, 2023
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20230187416
    • Publication date Jun 15, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
    • Publication number 20230187348
    • Publication date Jun 15, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Enis TUNCER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230178518
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Raehyung DO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20230059375
    • Publication date Feb 23, 2023
    • Invensas LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20220246542
    • Publication date Aug 4, 2022
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Ji Young CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
    • Publication number 20220172760
    • Publication date Jun 2, 2022
    • Rambus Inc.
    • Ian Shaeffer
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    SEMICONDUCTOR APPARATUS
    • Publication number 20220140082
    • Publication date May 5, 2022
    • Fuji Electric Co., Ltd.
    • Masanori INOUE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT STRUCTURE
    • Publication number 20220132662
    • Publication date Apr 28, 2022
    • GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
    • Andu Zhou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210407893
    • Publication date Dec 30, 2021
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20210391287
    • Publication date Dec 16, 2021
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210193592
    • Publication date Jun 24, 2021
    • Rohm Co., Ltd.
    • Katsuhiko YOSHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20210175213
    • Publication date Jun 10, 2021
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210090978
    • Publication date Mar 25, 2021
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS