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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/494Connecting portions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, efficient SiC power module
- Patent number 12,046,998
- Issue date Jul 23, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,471
- Issue date Jul 9, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with detection conductor
- Patent number 11,955,440
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,901,340
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, efficient sic power module
- Patent number 11,888,392
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,783,879
- Issue date Oct 10, 2023
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,728,298
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,600,602
- Issue date Mar 7, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die-skipping wire bonds
- Patent number 11,362,063
- Issue date Jun 14, 2022
- Western Digital Technologies, Inc.
- Xinzhi Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,211,105
- Issue date Dec 28, 2021
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,183,444
- Issue date Nov 23, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,133,276
- Issue date Sep 28, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device fabrication method
- Patent number 11,075,190
- Issue date Jul 27, 2021
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 10,976,011
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Tomoharu Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 10,950,582
- Issue date Mar 16, 2021
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with recessed outer and inner lead surfaces
- Patent number 10,886,203
- Issue date Jan 5, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide power module
- Patent number 10,784,235
- Issue date Sep 22, 2020
- Cree Fayetteville, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 10,770,124
- Issue date Sep 8, 2020
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258248
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240234380
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
- Publication number 20230395566
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
- Publication number 20230395565
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253298
- Publication date Aug 10, 2023
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20230187416
- Publication date Jun 15, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20220172760
- Publication date Jun 2, 2022
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20220140082
- Publication date May 5, 2022
- Fuji Electric Co., Ltd.
- Masanori INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20220132662
- Publication date Apr 28, 2022
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407893
- Publication date Dec 30, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210391287
- Publication date Dec 16, 2021
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210193592
- Publication date Jun 24, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20210175213
- Publication date Jun 10, 2021
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210090978
- Publication date Mar 25, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20210050043
- Publication date Feb 18, 2021
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE

Connecting portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device comprising programmable command-and-address and/or da...

High speed, efficient SiC power module

Packaging of a semiconductor device with a plurality of leads

Circuit structure

Packages with electrical fuses

Semiconductor device with detection conductor

Semiconductor power module

High speed, efficient sic power module

Wire bond wires for interference shielding

Memory device comprising programmable command-and-address and/or da...

Semiconductor device and method for manufacturing the same

Packaging of a semiconductor device with a plurality of leads

Semiconductor power module

Multichip package manufacturing process

Decoupling capacitor mounted on an integrated circuit die, and meth...

Wire bond wires for interference shielding

Semiconductor device with die-skipping wire bonds

Semiconductor device and method of manufacturing semiconductor device

Memory device comprising programmable command-and-address and/or da...

Packaging of a semiconductor device with a plurality of leads

Semiconductor device and method for manufacturing the same

Semiconductor device and semiconductor device fabrication method

Semiconductor package

LED lighting apparatus

Semiconductor power module

Packaging structure with recessed outer and inner lead surfaces

CTE compensation for wafer-level and chip-scale packages and assemb...

Integrated circuit chip packaging including a heat sink topped cavity

Silicon carbide power module

Memory device comprising programmable command-and-address and/or da...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

SEMICONDUCTOR DEVICE

PACKAGES WITH ELECTRICAL FUSES

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR POWER MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR PACKAGE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR APPARATUS

CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...