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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
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H01L2224/214
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Patents Grants
last 30 patents
Information
Patent Grant
Printed circuit board assembly
Patent number
11,985,757
Issue date
May 14, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Won Wook So
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,973,042
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jingu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,973,039
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chia-Hao Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and fabricating method thereof
Patent number
11,961,867
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Antenna apparatus and method
Patent number
11,961,809
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
11,955,467
Issue date
Apr 9, 2024
STATS ChipPAC Pte. Ltd.
Junghwan Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,942,433
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package
Patent number
11,942,434
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Sangkyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including seed structure and method of manufa...
Patent number
11,935,858
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Seungmin Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with an antenna substrate
Patent number
11,935,849
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package
Patent number
11,929,333
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patternable die attach materials and processes for patterning
Patent number
11,923,312
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
Patent number
11,923,313
Issue date
Mar 5, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,923,315
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
11,923,318
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package including a trench in a passivation layer
Patent number
11,923,314
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Ik Kyu Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device
Patent number
11,916,059
Issue date
Feb 27, 2024
Infineon Technologies AG
Andre Schmenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
InFO-POP structures with TIVs having cavities
Patent number
11,901,302
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,901,301
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Jeongho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integrated heat distribution and manufact...
Patent number
11,901,343
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package
Patent number
11,894,310
Issue date
Feb 6, 2024
Samsung Electronics Co., Ltd.
Myung Sam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System on integrated chips (SoIC) and semiconductor structures with...
Patent number
11,894,309
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and method of manufacture
Patent number
11,894,312
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,894,333
Issue date
Feb 6, 2024
Samsung Electronics Co., Ltd.
Dahee Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic device package and method of manufacturing the same
Patent number
11,894,354
Issue date
Feb 6, 2024
Advanced Semiconductor Engineering, Inc.
Chi-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,887,963
Issue date
Jan 30, 2024
Kioxia Corporation
Kazuma Hasegawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
Publication number
20240153921
Publication date
May 9, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Randy Yach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System on Integrated Chips (SoIC) and Semiconductor Structures with...
Publication number
20240153881
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240153882
Publication date
May 9, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Khim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145397
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jeongho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
Publication number
20240128222
Publication date
Apr 18, 2024
Neuralink Corp.
Supin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
Publication number
20240113062
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
Publication number
20240105660
Publication date
Mar 28, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-Dimensional Semiconductor Device and Method
Publication number
20240105631
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jeng-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
Publication number
20240105659
Publication date
Mar 28, 2024
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
Publication number
20240105658
Publication date
Mar 28, 2024
NXP B.V.
Tsung Nan Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
Publication number
20240105548
Publication date
Mar 28, 2024
ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
Uwe WALTRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
Publication number
20240088056
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088124
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
HSIANG-TAI LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Publication number
20240088052
Publication date
Mar 14, 2024
Intel Corporation
Bai NIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240087903
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
Publication number
20240088068
Publication date
Mar 14, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240079392
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079364
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240071952
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
Publication number
20240061195
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20240055360
Publication date
Feb 15, 2024
FARADAY SEMI, INC.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240047403
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240047404
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240047446
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038674
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS