Connecting the strap to a bond pad of the item

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H01L2224/40247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40247Connecting the strap to a bond pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,224,230
- Issue date Feb 11, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yasuaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,072
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 11,367,654
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 11,355,470
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,273
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated shunt resistor
- Patent number 10,950,509
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 10,763,201
- Issue date Sep 1, 2020
- Littelfuse, Inc.
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with grounding device and related methods
- Patent number 10,699,989
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a heat spreader and method of manufactur...
- Patent number 10,658,277
- Issue date May 19, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive semiconductor device and manufacturing method...
- Patent number 10,490,490
- Issue date Nov 26, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame
- Patent number 10,438,872
- Issue date Oct 8, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 10,186,458
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film, method for its production, and method for producing semicondu...
- Patent number 10,141,204
- Issue date Nov 27, 2018
- AGC Inc.
- Seigo Kotera
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 9,842,795
- Issue date Dec 12, 2017
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,824,957
- Issue date Nov 21, 2017
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter using the same
- Patent number 9,806,009
- Issue date Oct 31, 2017
- Hitachi Automotive Systems, Ltd.
- Shinichi Fujino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,793,265
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20250192093
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20250079386
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282678
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282677
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Masaaki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240071780
- Publication date Feb 29, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378013
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230369183
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Yoshihiko KAWAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20220262762
- Publication date Aug 18, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20210272923
- Publication date Sep 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210175198
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
- Publication number 20200365553
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20200185323
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20190148233
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20190051585
- Publication date Feb 14, 2019
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan DIMAANO JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME
- Publication number 20180277469
- Publication date Sep 27, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead And Lead Frame For Power Package
- Publication number 20180096918
- Publication date Apr 5, 2018
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS

Connecting the strap to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and methods of manufacturing semiconductor dev...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device and method of manufacturing the same

Semiconductor devices and methods of making the same

Component and method of manufacturing a component using an ultrathi...

Semiconductor device and methods of manufacturing semiconductor dev...

Electronic module

Batch manufacture of packages by sheet separated into carriers afte...

Semiconductor device with integrated shunt resistor

Lead and lead frame for power package

Packaged semiconductor system having unidirectional connections to...

Method of manufacturing a package having a power semiconductor chip

Semiconductor devices and methods of making the same

Semiconductor package with grounding device and related methods

Semiconductor package with a heat spreader and method of manufactur...

Power semiconductor device with small contact footprint and the pre...

Thermally conductive semiconductor device and manufacturing method...

Semiconductor device and lead frame

Semiconductor devices with improved thermal and electrical performance

Dual lead frame semiconductor package and method of manufacture

Semiconductor device with first and second chips and connections th...

Component and method of manufacturing a component using an ultrathi...

Film, method for its production, and method for producing semicondu...

Semiconductor device

Lead and lead frame for power package

Semiconductor device

Semiconductor device having low on resistance

Semiconductor device and method for manufacturing the same

Semiconductor device and power converter using the same

Semiconductor device including Schottky barrier diode and power MOS...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

POWER CIRCUIT MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

ELECTRONIC MODULE

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Component and Method of Manufacturing a Component Using an Ultrathi...

THERMALLY ENHANCED LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SEMICONDUCTOR DEVICE AND LEAD FRAME

Lead And Lead Frame For Power Package

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

SEMICONDUCTOR DEVICE