Connecting the strap to a die pad of the item

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  • Information Patent Application

    INTEGRATED CIRCUIT CHIP PACKAGING

    • Publication number 20200168524
    • Publication date May 28, 2020
    • International Business Machines Corporation
    • Young Hoon Kwark
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT CHIP PACKAGING

    • Publication number 20200168525
    • Publication date May 28, 2020
    • International Business Machines Corporation
    • Young Hoon Kwark
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT CHIP PACKAGING

    • Publication number 20170243816
    • Publication date Aug 24, 2017
    • International Business Machines Corporation
    • Young Hoon Kwark
    • H01 - BASIC ELECTRIC ELEMENTS