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Connecting the strap to a die pad of the item
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CPC
H01L2224/40237
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/40237
Connecting the strap to a die pad of the item
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
10,930,524
Issue date
Feb 23, 2021
Semiconductor Components Industries, LLC
Chun-Li Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
Patent number
10,818,572
Issue date
Oct 27, 2020
International Business Machines Corporation
Young Hoon Kwark
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit chip packaging
Patent number
10,600,715
Issue date
Mar 24, 2020
International Business Machines Corporation
Young Hoon Kwark
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor module
Patent number
10,325,895
Issue date
Jun 18, 2019
Mitsubishi Electric Corporation
Kenta Nakahara
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
Publication number
20200168524
Publication date
May 28, 2020
International Business Machines Corporation
Young Hoon Kwark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
Publication number
20200168525
Publication date
May 28, 2020
International Business Machines Corporation
Young Hoon Kwark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
Publication number
20170243816
Publication date
Aug 24, 2017
International Business Machines Corporation
Young Hoon Kwark
H01 - BASIC ELECTRIC ELEMENTS