Membership
Tour
Register
Log in
Connecting the strap to a via metallisation of the item
Follow
Industry
CPC
H01L2224/40235
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/40235
Connecting the strap to a via metallisation of the item
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
Publication number
20230290765
Publication date
Sep 14, 2023
MICROCHIP TECHNOLOGY INCORPORATED
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS