connecting the wire to a bond pad of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48177connecting the wire to a bond pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit lead frame and semiconductor device thereof
- Patent number 12,062,598
- Issue date Aug 13, 2024
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,057,356
- Issue date Aug 6, 2024
- Kyocera Corporation
- Eiji Kukita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device isolation package
- Patent number 12,027,572
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier trapping region including cry...
- Patent number 12,027,579
- Issue date Jul 2, 2024
- Rohm Co., Ltd.
- Seigo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and electronic device mounting structure
- Patent number 12,027,450
- Issue date Jul 2, 2024
- Rohm Co., Ltd.
- Toshiro Tsuchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,990,392
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 11,973,008
- Issue date Apr 30, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die pad cavity
- Patent number 11,942,448
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor package with continuous insulation
- Patent number 11,895,930
- Issue date Feb 6, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced isolated power converter package
- Patent number 11,791,249
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging leadframe assembly and method therefor
- Patent number 11,676,885
- Issue date Jun 13, 2023
- NXP B.V.
- Yeou Chian Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,640,926
- Issue date May 2, 2023
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,621,216
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Kensuke Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated outward and inward bent leads for packaged electroni...
- Patent number 11,569,154
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from metal migration on IC packages
- Patent number 11,417,541
- Issue date Aug 16, 2022
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for coupling a waveguide structure to an in...
- Patent number 11,380,634
- Issue date Jul 5, 2022
- NXP B.V.
- Antonius Johannes Matheus de Graauw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor die on a plated conduc...
- Patent number 11,348,863
- Issue date May 31, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die integrated circuit packages and methods of manufacturing...
- Patent number 11,328,984
- Issue date May 10, 2022
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 11,322,432
- Issue date May 3, 2022
- Mitsubishi Electric Corporation
- Seiya Sugimachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 11,289,406
- Issue date Mar 29, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for fabricating the same, and power convers...
- Patent number 11,227,808
- Issue date Jan 18, 2022
- Mitsubishi Electric Corporation
- Haruko Hitomi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Current sensor package with continuous insulation
- Patent number 11,211,551
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount integrated circuit package with coated surfaces for i...
- Patent number 11,127,660
- Issue date Sep 21, 2021
- Microchip Technology Incorporated
- Rangsun Kitnarong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grounding lids in integrated circuit devices
- Patent number 11,127,645
- Issue date Sep 21, 2021
- NXP USA, INC.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount integrated circuit package with coated surfaces for i...
- Patent number 11,101,200
- Issue date Aug 24, 2021
- Microchip Technology Incorporated
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE
- Publication number 20240387334
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304526
- Publication date Sep 12, 2024
- RENESAS ELECTRONICS CORPORATION
- Masato NUMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240304588
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20240274569
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266261
- Publication date Aug 8, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258208
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
- Publication number 20240234257
- Publication date Jul 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
- Publication number 20240105557
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL
- Publication number 20230343721
- Publication date Oct 26, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS
- Publication number 20230335474
- Publication date Oct 19, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230260932
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230253299
- Publication date Aug 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...
- Publication number 20230223312
- Publication date Jul 13, 2023
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE CIRCUIT PACKAGE STRUCTURE
- Publication number 20230187394
- Publication date Jun 15, 2023
- Motor Semiconductor Co., Ltd.
- Kuo-Lun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED ISOLATED POWER CONVERTER PACKAGE
- Publication number 20230135932
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE
- Publication number 20230094556
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20230016577
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220415729
- Publication date Dec 29, 2022
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING LEADFRAME ASSEMBLY AND METHOD THEREFOR
- Publication number 20220359350
- Publication date Nov 10, 2022
- NXP B.V.
- Yeou Chian Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...
- Publication number 20220319963
- Publication date Oct 6, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC DEVICE MOUNTING STRUCTURE
- Publication number 20220310491
- Publication date Sep 29, 2022
- Rohm Co., Ltd.
- Toshiro TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301991
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power module

Integrated circuit lead frame and semiconductor device thereof

Electronic element mounting substrate and electronic device

Integrated semiconductor device isolation package

Semiconductor device having a carrier trapping region including cry...

Electronic device and electronic device mounting structure

Semiconductor device package with thermal pad

Semiconductor device

Signal isolator having enhanced creepage characteristics

Integrated circuit die pad cavity

Current sensor package with continuous insulation

Thermally enhanced isolated power converter package

Semiconductor device packaging leadframe assembly and method therefor

Semiconductor device manufacturing method and semiconductor device

Semiconductor module

Interdigitated outward and inward bent leads for packaged electroni...

Power amplifier systems with control interface and bias circuit

Protection from metal migration on IC packages

Apparatuses and methods for coupling a waveguide structure to an in...

Semiconductor package having a semiconductor die on a plated conduc...

Multi-die integrated circuit packages and methods of manufacturing...

Semiconductor module and power conversion apparatus

Signal isolator having enhanced creepage characteristics

Power module and method for fabricating the same, and power convers...

Current sensor package with continuous insulation

Surface-mount integrated circuit package with coated surfaces for i...

Grounding lids in integrated circuit devices

Surface-mount integrated circuit package with coated surfaces for i...

Bond wire support systems and methods

Patents Applicationslast 30 patents

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT DIE PAD CAVITY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...

SEMICONDUCTOR DEVICE

MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL

SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...

HALF-BRIDGE CIRCUIT PACKAGE STRUCTURE

THERMALLY ENHANCED ISOLATED POWER CONVERTER PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

INTEGRATED CIRCUIT DIE PAD CAVITY

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE PACKAGING LEADFRAME ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...

ELECTRONIC DEVICE AND ELECTRONIC DEVICE MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE