connecting the wire to a die pad of the item

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H01L2224/48257

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48257connecting the wire to a die pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 12,062,833
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite electro-magnetic interference (EMI) shield between an integ...
- Patent number 11,990,422
- Issue date May 21, 2024
- High Tech Technology Limited
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color stable red-emitting phosphors
- Patent number 11,851,595
- Issue date Dec 26, 2023
- CURRENT LIGHTING SOLUTIONS, LLC
- James Edward Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and nitride semiconductor package
- Patent number 11,769,825
- Issue date Sep 26, 2023
- Rohm Co., Ltd.
- Taketoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 11,677,135
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,562,957
- Issue date Jan 24, 2023
- Renesas Electronics Corporation
- Shinichi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground wing portion for electronic package device
- Patent number 11,482,475
- Issue date Oct 25, 2022
- ALi Corporation
- Chin-Sung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with exposed filter particles
- Patent number 11,430,928
- Issue date Aug 30, 2022
- Nichia Corporation
- Koji Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode module and a light apparatus
- Patent number 11,417,814
- Issue date Aug 16, 2022
- XIAMEN ECO LIGHTING CO. LTD.
- Liangliang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,404,358
- Issue date Aug 2, 2022
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Junyoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and backlight including light-emitting device
- Patent number 11,398,460
- Issue date Jul 26, 2022
- Nichia Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package and lighting apparatus having same
- Patent number RE49146
- Issue date Jul 19, 2022
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Chang Man Lim
Information Patent Grant
Method of packaging a semiconductor die
- Patent number 11,387,171
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communicating across galvanic isolation
- Patent number 11,381,111
- Issue date Jul 5, 2022
- Power Integrations, Inc.
- Matthias Peter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for sensor diagnostics
- Patent number 11,313,899
- Issue date Apr 26, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 11,257,732
- Issue date Feb 22, 2022
- Mitsubishi Electric Corporation
- Maki Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and nitride semiconductor package
- Patent number 11,233,144
- Issue date Jan 25, 2022
- Rohm Co., Ltd.
- Taketoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package having lead electrode with varying th...
- Patent number 11,233,177
- Issue date Jan 25, 2022
- Nichia Corporation
- Koji Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package and lighting apparatus having same
- Patent number RE48892
- Issue date Jan 11, 2022
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Chang Man Lim
Information Patent Grant
LED package with surface textures and methods of formation
- Patent number 11,217,735
- Issue date Jan 4, 2022
- Luminus, Inc.
- Saijin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing aluminate fluorescent material, aluminate fluor...
- Patent number 11,142,686
- Issue date Oct 12, 2021
- Nichia Corporation
- Shozo Taketomi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240379835
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047313
- Publication date Feb 8, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT
- Publication number 20230402352
- Publication date Dec 14, 2023
- TDK Corporation
- Kazuma YAMAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20230387808
- Publication date Nov 30, 2023
- Power Integrations, Inc.
- Balu Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20230335883
- Publication date Oct 19, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan MANGRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...
- Publication number 20230290735
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...
- Publication number 20230290736
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLOR STABLE RED-EMITTING PHOSPHORS
- Publication number 20210340443
- Publication date Nov 4, 2021
- CURRENT LIGHTING SOLUTIONS, LLC
- James Edward MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210343641
- Publication date Nov 4, 2021
- RENESAS ELECTRONICS CORPORATION
- Shinichi Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
- Publication number 20210336094
- Publication date Oct 28, 2021
- Nichia Corporation.
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING
- Publication number 20210287966
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20210151854
- Publication date May 20, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan MANGRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098617
- Publication date Apr 1, 2021
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20210006167
- Publication date Jan 7, 2021
- Power Integrations, Inc.
- Balu Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20200355525
- Publication date Nov 12, 2020
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
LED MODULE
- Publication number 20200343415
- Publication date Oct 29, 2020
- ROHM CO., LTD.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
- Publication number 20200287096
- Publication date Sep 10, 2020
- Nichia Corporation.
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200279796
- Publication date Sep 3, 2020
- Advanced Semiconductor Engineering Korea, Inc.
- Junyoung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE FLUORESCENT MATERIAL, METHOD FOR PRODUCING THE SAME, AND LI...
- Publication number 20200248072
- Publication date Aug 6, 2020
- Nichia Corporation.
- Kazuya NISHIMATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LEADFRAME FOR MULTICHIP DEVICES WITH THINNED DIE PAD PORTIONS
- Publication number 20200211934
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- CHANG-YEN KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME DIE PAD WITH PARTIALLY-ETCHED GROOVE BETWEEN THROUGH-HOLE...
- Publication number 20200211933
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- JOEL DE GUZMAN RAPOSAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LEAD FRAME, METHOD FOR PRODUCING PACKAGE AND M...
- Publication number 20200185583
- Publication date Jun 11, 2020
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a die pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Packaged electronic device having integrated antenna and locking st...

Ferrite electro-magnetic interference (EMI) shield between an integ...

Color stable red-emitting phosphors

Semiconductor device with sealed semiconductor chip

Semiconductor device having reduced capacitance between source and...

Nitride semiconductor device and nitride semiconductor package

Semiconductor device

Packaged electronic device having integrated antenna and locking st...

Semiconductor device and method of manufacturing the same

Ground wing portion for electronic package device

Light-emitting device with exposed filter particles

Semiconductor device with sealed semiconductor chip

Light-emitting diode module and a light apparatus

Semiconductor package device and method of manufacturing the same

Light-emitting device and backlight including light-emitting device

Light emitting device package and lighting apparatus having same

Method of packaging a semiconductor die

Semiconductor device, electronic component and method

Communicating across galvanic isolation

Light emitting device and method of manufacturing the light emittin...

Methods and apparatus for sensor diagnostics

Semiconductor module and semiconductor device

Nitride semiconductor device and nitride semiconductor package

Light emitting device package having lead electrode with varying th...

Light emitting device package and lighting apparatus having same

LED package with surface textures and methods of formation

Plurality of lead frames electrically connected to inductor chip

Method of producing aluminate fluorescent material, aluminate fluor...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

LEAD FRAME AND ELECTRONIC COMPONENT

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...

Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

COLOR STABLE RED-EMITTING PHOSPHORS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

LED MODULE

LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

NITRIDE FLUORESCENT MATERIAL, METHOD FOR PRODUCING THE SAME, AND LI...

LEADFRAME FOR MULTICHIP DEVICES WITH THINNED DIE PAD PORTIONS

LEADFRAME DIE PAD WITH PARTIALLY-ETCHED GROOVE BETWEEN THROUGH-HOLE...

METHOD FOR PRODUCING LEAD FRAME, METHOD FOR PRODUCING PACKAGE AND M...