connecting the wire to a pin of the item

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H01L2224/4816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4816connecting the wire to a pin of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 11,282,772
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 10,672,676
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electric power conversion device having re...
- Patent number 10,121,732
- Issue date Nov 6, 2018
- Mitsubishi Electric Corporation
- Yoshitaka Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,984,947
- Issue date May 29, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 9,875,911
- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,728,476
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,263,332
- Issue date Feb 16, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-exposed-pad quad flat no-lead (QFN) packaging structure and meth...
- Patent number 9,209,117
- Issue date Dec 8, 2015
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,048,306
- Issue date Jun 2, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 8,853,001
- Issue date Oct 7, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,378,230
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 8,143,097
- Issue date Mar 27, 2012
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3361943
- Patent number 3,361,943
- Issue date Jan 2, 1968
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
- Publication number 20240387461
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Rajitha Indla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
- Publication number 20220216193
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20210134711
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190148349
- Publication date May 16, 2019
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180269121
- Publication date Sep 20, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
- Publication number 20180226324
- Publication date Aug 9, 2018
- Mitsubishi Electric Corporation
- Yoshitaka KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170338163
- Publication date Nov 23, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SNUBBER CIRCUIT
- Publication number 20160277017
- Publication date Sep 22, 2016
- FSP TECHNOLOGY INC.
- Kuo-Fan Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METH...
- Publication number 20140264795
- Publication date Sep 18, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20130299974
- Publication date Nov 14, 2013
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer with Opening...
- Publication number 20130299982
- Publication date Nov 14, 2013
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20120168916
- Publication date Jul 5, 2012
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110233598
- Publication date Sep 29, 2011
- HON HAI Precision Industry CO., LTD.
- CHIH-CHEN LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20110074047
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20110068444
- Publication date Mar 24, 2011
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer with Opening...
- Publication number 20110068459
- Publication date Mar 24, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110067913
- Publication date Mar 24, 2011
- IBIDEN CO., LTD.
- Masahiro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

connecting the wire to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor package and manufacturing method thereof

Semiconductor device and method of forming interposer with opening...

Sensor package and manufacturing method thereof

Semiconductor package including processor chip and memory chip

Package structure, assembly structure and method for manufacturing...

Sensor package and manufacturing method thereof

Sensor package and manufacturing method thereof

Fan-out semiconductor package

Semiconductor device and electric power conversion device having re...

Fingerprint sensor and manufacturing method thereof

Semiconductor device and method of forming interposer with opening...

Semiconductor device and method of forming pad layout for flipchip...

Fingerprint sensor and manufacturing method thereof

Contact arrangements for stackable microelectronic package structur...

Semiconductor device and method of forming open cavity in TSV inter...

No-exposed-pad quad flat no-lead (QFN) packaging structure and meth...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming pad layout for flipchip...

Printed wiring board and method for manufacturing the same

Semiconductor device and method of forming open cavity in TSV inter...

3361943

Patents Applicationslast 30 patents

Semiconductor Device Package with Die Stackup and Connection Platform

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SNUBBER CIRCUIT

NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METH...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME