3361943

Information

• Patent Grant
• 3361943

• References
• Source

• Patent Number

  3,361,943

• Date Filed

  Not available

• Date Issued

  Tuesday, January 2, 1968
  57 years ago

• CPC

  • H01L24/26 - Layer connectors
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/304 - Mechanical treatment
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L24/83 - using a layer connector
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L29/0661 - specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/4816 - connecting the wire to a pin of the item
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/83801 - Soldering or alloying
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/00011 - Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01051 - Antimony [Sb]
  • H01L2924/01058 - Cerium [Ce]
  • H01L2924/01068 - Erbium [Er]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12036 - PN diode
  • H01L2924/13034 - Silicon Controlled Rectifier [SCR]

• US Classifications

  • 257 - Active solid-state devices