connecting to a via connection in the semiconductor or solid-state body

Industry

CPC
H01L2224/02372

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02372connecting to a via connection in the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,087,668
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with ring-shaped substrates
- Patent number 12,074,104
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,074,136
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 12,046,558
- Issue date Jul 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having bonding layers
- Patent number 12,046,579
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device interface configurations, and associated met...
- Patent number 12,033,945
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Hayato Oishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout integration for stacked silicon package assembly
- Patent number 12,027,493
- Issue date Jul 2, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,021,045
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die
- Patent number 12,009,327
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,996,400
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,452
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379567
- Publication date Nov 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240369765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240363496
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240304572
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE
- Publication number 20240297137
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20240282620
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240274589
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240264369
- Publication date Aug 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240250002
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213192
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- KYONGSOON CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION
- Publication number 20240215270
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194569
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240186201
- Publication date Jun 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240162173
- Publication date May 16, 2024
- Sony Semiconductor Solutions Corporation
- Yoshiaki YANAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
- Publication number 20240153893
- Publication date May 9, 2024
- Qorvo US, Inc.
- Michael Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS

connecting to a via connection in the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Integrated chip for standard logic performance improvement having a...

Integrated fan-out package and the methods of manufacturing

Method of fabricating a semiconductor device

Semiconductor package and manufacturing method thereof

Chip package structure with bump

Bonding structure and method of forming same

Method for fabricating semiconductor device with redistribution plugs

Semiconductor device assembly with surface-mount die support struct...

Semiconductor package and method for manufacturing the same

Integrated circuit packages with ring-shaped substrates

Package structure and method of manufacturing the same

Contact and die attach metallization for silicon carbide based devi...

Electronic device package and method for manufacturing the same

Package having bonding layers

Redistribution layer metallic structure and method

Semiconductor package having a through intervia through the molding...

Microelectronic device interface configurations, and associated met...

Chip package structure

Fanout integration for stacked silicon package assembly

Semiconductor devices having a conductive pillar and methods of man...

Semiconductor device and method of manufacture

Semiconductor die

Advanced device assembly structures and methods

Semiconductor device with composite conductive features and method...

Manufacturing method of package on package structure

Semiconductor package

Semiconductor package

Semiconductor with through-substrate interconnect

Package

Patents Applicationslast 30 patents

Chip Package Structure with Bump

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

EMBEDDED METAL INSULATOR METAL STRUCTURE

PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE

OPTOELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...