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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2224/2413
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Patents Grants
last 30 patents
Information
Patent Grant
Embedded package with electrically isolating dielectric liner
Patent number
12,255,114
Issue date
Mar 18, 2025
Infineon Technologies AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component embedded substrate and circuit module using th...
Patent number
12,243,841
Issue date
Mar 4, 2025
TDK Corporation
Toshiyuki Abe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display with embedded pixel driver chips
Patent number
12,243,863
Issue date
Mar 4, 2025
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having topside power delivery structures
Patent number
12,243,828
Issue date
Mar 4, 2025
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power overlay module with thermal storage
Patent number
12,237,243
Issue date
Feb 25, 2025
GE Aviation Systems LLC
Rinaldo Luigi Miorini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers for microelectronic devices
Patent number
12,230,583
Issue date
Feb 18, 2025
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional integrated circuit structures and methods of form...
Patent number
12,230,549
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Min Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image display device manufacturing method and image display device
Patent number
12,224,273
Issue date
Feb 11, 2025
Nichia Corporation
Hajime Akimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and method of forming same
Patent number
12,222,545
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,218,070
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Hae-Jung Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
12,218,098
Issue date
Feb 4, 2025
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Panel level packaging for multi-die products interconnected with ve...
Patent number
12,218,071
Issue date
Feb 4, 2025
Intel Corporation
Srinivas V. Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
Patent number
12,205,919
Issue date
Jan 21, 2025
Infineon Technologies AG
Chuan Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices using microchannels for interconnections
Patent number
12,205,882
Issue date
Jan 21, 2025
3M Innovative Properties Company
Kayla C. Niccum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of transferring micro-light emitting diode for LED display
Patent number
12,205,931
Issue date
Jan 21, 2025
Samsung Electronics Co., Ltd.
Kyungwook Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,205,959
Issue date
Jan 21, 2025
Samsung Display Co., Ltd.
Jong Chan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing a multi-chip assembly
Patent number
12,191,296
Issue date
Jan 7, 2025
Infineon Technologies AG
Ling Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing
Patent number
12,176,337
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic drive based on standard commodity FPGA IC chips
Patent number
12,153,865
Issue date
Nov 26, 2024
iCometrue Company Ltd.
Mou-Shiung Lin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Display device and method for manufacturing display device
Patent number
12,155,022
Issue date
Nov 26, 2024
Samsung Display Co., Ltd.
Young Rag Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,147,159
Issue date
Nov 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sih-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and antenna module comprising the same
Patent number
12,148,708
Issue date
Nov 19, 2024
Samsung Electronics Co., Ltd.
Yong Koon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and manufacturing method thereof
Patent number
12,100,665
Issue date
Sep 24, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods for forming the same
Patent number
12,094,848
Issue date
Sep 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting array structure and display
Patent number
12,094,861
Issue date
Sep 17, 2024
Lextar Electronics Corporation
Chih-Hao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
Patent number
12,087,717
Issue date
Sep 10, 2024
Infineon Technologies Austria AG
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
Patent number
12,080,615
Issue date
Sep 3, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging method and package structure
Patent number
12,080,565
Issue date
Sep 3, 2024
Pep Innovation PTE Ltd.
Jimmy Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible package architecture concept in fanout
Patent number
12,074,077
Issue date
Aug 27, 2024
Apple Inc.
Karthik Shanmugam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic circuit device
Patent number
12,074,130
Issue date
Aug 27, 2024
RISING TECHNOLOGIES CO., LTD.
Shuzo Akejima
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
POWER MODULES AND PANEL-LEVEL METHODS OF MAKING THE SAME
Publication number
20250096182
Publication date
Mar 20, 2025
PEP INNOVATION PTE LTD.
Hwee Seng CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED CORE SUBSTRATE FOR EMBEDDING COMPONENTS
Publication number
20250079328
Publication date
Mar 6, 2025
ADVANCED MICRO DEVICES, INC.
Deepak Vasant KULKARNI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
Publication number
20250079263
Publication date
Mar 6, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
Publication number
20250077754
Publication date
Mar 6, 2025
iCometrue Company Ltd.
Mou-Shiung LIN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
Publication number
20250079354
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company Limited
Steven Sze Hang Poon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacturing
Publication number
20250079428
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
Publication number
20250062267
Publication date
Feb 20, 2025
SILICON BOX PTE. LTD.
Sehat SUTARDJA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
Publication number
20250015036
Publication date
Jan 9, 2025
LINGSEN PRECISION INDUSTRIES, LTD.
Yu-Chia CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC SYSTEM
Publication number
20240421266
Publication date
Dec 19, 2024
EPISTAR CORPORATION
Min-Hsun HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
Publication number
20240421115
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company Limited
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Publication number
20240404977
Publication date
Dec 5, 2024
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240404904
Publication date
Dec 5, 2024
InnoLux Corporation
Ker-Yih KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
Publication number
20240405005
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240404908
Publication date
Dec 5, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Ki Yeul Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20240385519
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Sih-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
Publication number
20240387435
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240387457
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and Method
Publication number
20240371726
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Rong Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
Publication number
20240363575
Publication date
Oct 31, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jihwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
Publication number
20240362386
Publication date
Oct 31, 2024
iCometrue Company Ltd.
Mou-Shiung LIN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
Publication number
20240363463
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
Publication number
20240339427
Publication date
Oct 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
Publication number
20240332155
Publication date
Oct 3, 2024
Intel Corporation
Jianyong Mo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240297153
Publication date
Sep 5, 2024
Kabushiki Kaisha Toshiba
Satoshi YOSHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
Publication number
20240282740
Publication date
Aug 22, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Matthew Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR
Publication number
20240283132
Publication date
Aug 22, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
Publication number
20240266296
Publication date
Aug 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
Publication number
20240258268
Publication date
Aug 1, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inpil YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Routing for 2.5D or 3D Integrated Circuits Including a Buried...
Publication number
20240258206
Publication date
Aug 1, 2024
Synopsys, Inc.
Xi-Wei LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
Publication number
20240258261
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS