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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/183Connection portion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,315,821
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor package manufacturing method,...
- Patent number 12,310,132
- Issue date May 20, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Mitsuhito Kanatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with re-fill layer
- Patent number 12,100,634
- Issue date Sep 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, manufacturing method for semiconductor app...
- Patent number 11,942,400
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Hodaka Rokubuichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring designs supporting efficient die to die routing
- Patent number 11,862,481
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,823,980
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 11,776,880
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,710,705
- Issue date Jul 25, 2023
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with re-fill layer
- Patent number 11,646,292
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,476,297
- Issue date Oct 18, 2022
- Samsung Display Co., Ltd.
- Haeyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor chip connected with...
- Patent number 11,456,238
- Issue date Sep 27, 2022
- Denso Corporation
- Kosuke Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,348,853
- Issue date May 31, 2022
- Kabushiki Kaisha Toshiba
- Yuuichi Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of formation
- Patent number 11,335,658
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with a groove and press hole on the surface of a...
- Patent number 11,227,810
- Issue date Jan 18, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,183,444
- Issue date Nov 23, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,145,576
- Issue date Oct 12, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167164
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jiyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION
- Publication number 20250132231
- Publication date Apr 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250125207
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
- Publication number 20250126909
- Publication date Apr 17, 2025
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
- Publication number 20250087544
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429147
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421018
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kazuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME
- Publication number 20240363586
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240297100
- Publication date Sep 5, 2024
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178192
- Publication date May 30, 2024
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145258
- Publication date May 2, 2024
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20240096648
- Publication date Mar 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...
- Publication number 20240063029
- Publication date Feb 22, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063096
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240055366
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038712
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE
- Publication number 20240014099
- Publication date Jan 11, 2024
- Marvell Asia Pte Ltd.
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS

Connection portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package, semiconductor package manufacturing method,...

Molded product for semiconductor strip and method of manufacturing...

Semiconductor module and method for manufacturing semiconductor module

Semiconductor manufacturing apparatus and method of manufacturing s...

Reliable semiconductor packages

Semiconductor device

Semiconductor device

Semiconductor device with re-fill layer

Semiconductor device and manufacturing method therefor

Packaging of a semiconductor device with a plurality of leads

Semiconductor device package comprising a pin in the form of a dril...

Semiconductor module and method for manufacturing semiconductor module

Semiconductor apparatus, manufacturing method for semiconductor app...

Stacked die modules for semiconductor device assemblies and methods...

Seal ring designs supporting efficient die to die routing

Semiconductor device with a semiconductor chip connected in a flip...

Package structure and manufacturing method thereof

Surface treatment method and apparatus for semiconductor packaging

Semiconductor device and method for manufacturing semiconductor device

Packaging of a semiconductor device with a plurality of leads

Method for fabricating semiconductor device with re-fill layer

Display apparatus

Semiconductor device including a semiconductor chip connected with...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device

Multi-chip package and method of formation

Electronic module with a groove and press hole on the surface of a...

Packaging of a semiconductor device with a plurality of leads

Electronic module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

RELIABLE SEMICONDUCTORS PACKAGES

SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Seal Ring Designs Supporting Efficient Die to Die Routing

DIE PACKAGE WITH SEALED DIE ENCLOSURES

PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

INTEGRATED CIRCUIT DEVICE EXPOSED DIE PACKAGE STRUCTURE WITH ADHESIVE