Connection portion

Industry

CPC
H01L2924/173

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/173Connection portion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for plating with selective molding
- Patent number 11,764,075
- Issue date Sep 19, 2023
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacturing semiconductor pa...
- Patent number 11,569,563
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for plating with selective molding
- Patent number 11,393,699
- Issue date Jul 19, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having a dissipative package, in parti...
- Patent number 10,964,627
- Issue date Mar 30, 2021
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having a dissipative package, in parti...
- Patent number 10,535,587
- Issue date Jan 14, 2020
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with notched main lead
- Patent number 10,431,532
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Kota Ise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar inductive electrical elements in semiconductor package l...
- Patent number 9,704,639
- Issue date Jul 11, 2017
- SOLANTRO SEMICONDUCTOR CORP.
- Raymond Kenneth Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 9,356,002
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,209,099
- Issue date Dec 8, 2015
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and high frequency terminal structure for the same
- Patent number 8,637,873
- Issue date Jan 28, 2014
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and high frequency terminal structure for the same
- Patent number 8,471,382
- Issue date Jun 25, 2013
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
- Publication number 20240038619
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230005801
- Publication date Jan 5, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR PLATING WITH SELECTIVE MOLDING
- Publication number 20220319869
- Publication date Oct 6, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220006173
- Publication date Jan 6, 2022
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING
- Publication number 20210375641
- Publication date Dec 2, 2021
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...
- Publication number 20200098670
- Publication date Mar 26, 2020
- STMicroelectronics S.r.l.
- Concetto PRIVITERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...
- Publication number 20160225699
- Publication date Aug 4, 2016
- STMicroelectronics S.r.l.
- Concetto PRIVITERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR INDUCTIVE ELECTRICAL ELEMENTS IN SEMICONDUCTOR PACKAGE L...
- Publication number 20160133373
- Publication date May 12, 2016
- Solantro Semiconductor Corp.
- Raymond Kenneth Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150357269
- Publication date Dec 10, 2015
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150340297
- Publication date Nov 26, 2015
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150325504
- Publication date Nov 12, 2015
- ROHM CO., LTD.
- Kota ISE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME
- Publication number 20120234592
- Publication date Sep 20, 2012
- KABUSHIKI KAISHA TOSHIBA
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME
- Publication number 20120126246
- Publication date May 24, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS

Connection portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Thermal transfer structures for semiconductor die assemblies

Package assembly for plating with selective molding

Semiconductor packages and method of manufacturing semiconductor pa...

Packaging process for plating with selective molding

Thermal transfer structures for semiconductor die assemblies

Integrated electronic device having a dissipative package, in parti...

Integrated electronic device having a dissipative package, in parti...

Semiconductor device with notched main lead

Non-planar inductive electrical elements in semiconductor package l...

Semiconductor package and method for manufacturing the same

Power semiconductor module

Package and high frequency terminal structure for the same

Package and high frequency terminal structure for the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

PACKAGE ASSEMBLY FOR PLATING WITH SELECTIVE MOLDING

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...

PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING

INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...

INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTI...

NON-PLANAR INDUCTIVE ELECTRICAL ELEMENTS IN SEMICONDUCTOR PACKAGE L...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME

PACKAGE AND HIGH FREQUENCY TERMINAL STRUCTURE FOR THE SAME