Connections made by press-fit insertion

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H05K2201/1059

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/1059Connections made by press-fit insertion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical circuit device, electrical drive device and motor vehicle
- Patent number 12,185,504
- Issue date Dec 31, 2024
- Audi AG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor fan and guard for directing coolant air
- Patent number 12,160,158
- Issue date Dec 3, 2024
- Nidec Motor Corporation
- Richard L. Eason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,027,444
- Issue date Jul 2, 2024
- Lenovo (Singapore) Pte. Ltd.
- Seiji Yamasaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module
- Patent number 12,021,323
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Mayumi Shiohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit including a circuit board and a waveguide st...
- Patent number 12,010,790
- Issue date Jun 11, 2024
- Robert Bosch GmbH
- Christian Hollaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing method of a flexible printed circuit board and a substrate
- Patent number 11,991,834
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jae Uk Cho
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Power electronics unit comprising a circuit board and a power modul...
- Patent number 11,990,697
- Issue date May 21, 2024
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for retaining fastening element solder
- Patent number 11,951,556
- Issue date Apr 9, 2024
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module, spacer component, and method for producing camera mo...
- Patent number 11,930,258
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Owaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting printed circuit boards
- Patent number 11,901,654
- Issue date Feb 13, 2024
- Amphenol Corporation
- Michael A. Hoyack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for low loss interconnection system
- Patent number 11,824,311
- Issue date Nov 21, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastening structure
- Patent number 11,800,634
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Juhyeok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Human-machine interface assemblies
- Patent number 11,792,935
- Issue date Oct 17, 2023
- Whirlpool Corporation
- Matthew P. Ebrom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection assembly and pin with a welding section
- Patent number 11,641,071
- Issue date May 2, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Yiyang Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for retaining fastening element solder
- Patent number 11,638,963
- Issue date May 2, 2023
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable connector for high speed in interconnects
- Patent number 11,637,401
- Issue date Apr 25, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement, in particular for an electrically driven motor...
- Patent number 11,617,271
- Issue date Mar 28, 2023
- VALEO SIEMENS EAUTOMOTIVE GERMANY GMBH
- Markus Eichner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Mounting devices for semiconductor packages with a fixation mechanism
- Patent number 11,605,575
- Issue date Mar 14, 2023
- Mahle International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipoint contact conduction cooling of a removable device
- Patent number 11,579,668
- Issue date Feb 14, 2023
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Press-fit connection
- Patent number 11,563,283
- Issue date Jan 24, 2023
- ZF Friedrichshafen AG
- Christoph Schikora
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...
- Publication number 20240388019
- Publication date Nov 21, 2024
- HARTING ELECTRONICS GMBH
- Markus FRIESEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly
- Publication number 20240347939
- Publication date Oct 17, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVER ACTUATED LOCKING MECHANISM
- Publication number 20240080987
- Publication date Mar 7, 2024
- Eaton Intelligent Power Limited
- Adarsh MISHRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240074042
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Yulong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240064893
- Publication date Feb 22, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Exerting-Pressure Device and Electronic Apparatus Comprising the Same
- Publication number 20240064905
- Publication date Feb 22, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HUMAN-MACHINE INTERFACE ASSEMBLIES
- Publication number 20230413445
- Publication date Dec 21, 2023
- Whirlpool Corporation
- MATTHEW P. EBROM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONNECTOR, MANUFACTURING METHOD, AND CONNECTOR ASSEMBLY...
- Publication number 20230387615
- Publication date Nov 30, 2023
- LUXSHARE PRECISION INDUSTRY COMPANY LIMITED
- Liang YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS
- Publication number 20230380064
- Publication date Nov 23, 2023
- ROBERT BOSCH GmbH
- Joerg Offterdinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20230354525
- Publication date Nov 2, 2023
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT DEVICE, ELECTRICAL DRIVE DEVICE AND MOTOR VEHICLE
- Publication number 20230262943
- Publication date Aug 17, 2023
- Audi AG
- Daniel RUPPERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MODULE ARRANGEMENT
- Publication number 20230230905
- Publication date Jul 20, 2023
- Peter Luniewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE JUMPER WITH A MOUNTING FRAME
- Publication number 20230209714
- Publication date Jun 29, 2023
- Interplex Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Press-in machine for pressing components into a substrate, in parti...
- Publication number 20230137203
- Publication date May 4, 2023
- ERSA GMBH
- Kevin Friedrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)
- Publication number 20230120513
- Publication date Apr 20, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLUG-IN CONNECTOR DEVICE AND METHOD FOR PRODUCING A PLUG-IN CONNECT...
- Publication number 20230029329
- Publication date Jan 26, 2023
- Vitesco Technologies GMBH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20230015176
- Publication date Jan 19, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, SPACER COMPONENT, AND METHOD FOR PRODUCING CAMERA MO...
- Publication number 20230008374
- Publication date Jan 12, 2023
- Sony Semiconductor Solutions Corporation
- Hirofumi OWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
- Publication number 20220375821
- Publication date Nov 24, 2022
- Huawei Technologies Co., Ltd
- Zhaokuan LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board
- Publication number 20220271453
- Publication date Aug 25, 2022
- Hitachi Astemo, Ltd.
- Shinya KAWAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220140508
- Publication date May 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- XIAO-FENG ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer For Printed Circuit Boards
- Publication number 20220104361
- Publication date Mar 31, 2022
- SoftIron Limited
- Robert Drury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE
- Publication number 20220091642
- Publication date Mar 24, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HUMAN-MACHINE INTERFACE ASSEMBLIES
- Publication number 20220046799
- Publication date Feb 10, 2022
- Whirlpool Corporation
- MATTHEW P. EBROM
- G06 - COMPUTING CALCULATING COUNTING

Connections made by press-fit insertion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical circuit device, electrical drive device and motor vehicle

Plug-in connector device and method for producing a plug-in connect...

Motor fan and guard for directing coolant air

Heatsink clamp for multiple electronic components

Press-fit power module and related methods

Flexible jumper with a mounting frame

Circuit board assembly

Electronic device

Semiconductor module

High-frequency circuit including a circuit board and a waveguide st...

Pressing method of a flexible printed circuit board and a substrate

Power electronics unit comprising a circuit board and a power modul...

Circuit carrier arrangement and method for producing such a circuit...

Method for retaining fastening element solder

Camera module, spacer component, and method for producing camera mo...

Method of interconnecting printed circuit boards

Connector for low loss interconnection system

Power electronics assembly

Solderless BGA interconnect

Heat sink fastening structure

Human-machine interface assemblies

Reliability enhancement of press fit connectors

Circuit carrier arrangement and method for producing such a circuit...

Connection assembly and pin with a welding section

Structure for retaining fastening element solder

Cable connector for high speed in interconnects

Circuit arrangement, in particular for an electrically driven motor...

Mounting devices for semiconductor packages with a fixation mechanism

Multipoint contact conduction cooling of a removable device

Press-fit connection

Patents Applicationslast 30 patents

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...

Electronic Assembly

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

PRESS APPARATUS AND PRESSING METHOD THEREOF

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

COMPRESSION STRUCTURES FOR IC PACKAGES

LEVER ACTUATED LOCKING MECHANISM

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Exerting-Pressure Device and Electronic Apparatus Comprising the Same

HUMAN-MACHINE INTERFACE ASSEMBLIES

ELECTRICAL CONNECTOR, MANUFACTURING METHOD, AND CONNECTOR ASSEMBLY...

CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS

NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

ELECTRICAL CIRCUIT DEVICE, ELECTRICAL DRIVE DEVICE AND MOTOR VEHICLE

STACKED MODULE ARRANGEMENT

FLEXIBLE JUMPER WITH A MOUNTING FRAME

Press-in machine for pressing components into a substrate, in parti...

FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)

PLUG-IN CONNECTOR DEVICE AND METHOD FOR PRODUCING A PLUG-IN CONNECT...

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

CAMERA MODULE, SPACER COMPONENT, AND METHOD FOR PRODUCING CAMERA MO...

BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD

Circuit Board

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

Interposer For Printed Circuit Boards

MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE

HUMAN-MACHINE INTERFACE ASSEMBLIES