consisting of layered constructions comprising conductive layers and insulating layers

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H01L23/485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/485consisting of layered constructions comprising conductive layers and insulating layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 12,362,187
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 12,349,344
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having vertical routing to bond pads
- Patent number 12,349,475
- Issue date Jul 1, 2025
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through vias using amorphization to adjust...
- Patent number 12,341,060
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source/drain contact having height b...
- Patent number 12,336,296
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Charles Chew-Yuen Young
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,261,088
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED array and method of forming a LED array
- Patent number 12,255,222
- Issue date Mar 18, 2025
- Plessey Semiconductors Limited
- Andrea Pinos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including epitaxial region
- Patent number 12,249,505
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Gyeom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure havbing an enhanced E-fuse and a method mak...
- Patent number 12,243,816
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Jiao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor
- Patent number 12,230,626
- Issue date Feb 18, 2025
- Japan Display Inc.
- Toshinari Sasaki
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package with dummy pattern not electrically connected...
- Patent number 12,211,806
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,211,816
- Issue date Jan 28, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kuk Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,846
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FINFETS having step sided contact plugs and methods of manufacturin...
- Patent number 12,206,022
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Sun Hom Paak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250210551
- Publication date Jun 26, 2025
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201640
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169048
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jeewoong Kim
- G11 - INFORMATION STORAGE
Information Patent Application
BURIED METAL LINER IN SOURCE/DRAIN EPITAXIAL MATERIAL
- Publication number 20250157891
- Publication date May 15, 2025
- International Business Machines Corporation
- Tsung-Sheng KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20250151207
- Publication date May 8, 2025
- Shanghai AVIC Optoelectronics Co., Ltd.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT WITH A...
- Publication number 20250118633
- Publication date Apr 10, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Alexander Hensel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT
- Publication number 20250118674
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250113597
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- Sung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250095996
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Takeyoshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP HAVING A BURIED POWER RAIL
- Publication number 20250079318
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Marcus Johannes Henricus VAN DAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029897
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jun Ki PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014977
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS LASER DIRECT STRUCTURING (LDS) PACKAGE
- Publication number 20240421041
- Publication date Dec 19, 2024
- STMicroelectronics S.r.l.
- Luca GRANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379550
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Heeseop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240355803
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
- Publication number 20240355766
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355820
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240332298
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS

consisting of layered constructions comprising conductive layers and insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Semiconductor device and method of manufacturing the same

Semiconductor device having a uniform and thin silicide layer on an...

Contact structure for semiconductor device

Semiconductor device and method of manufacturing

Semiconductor packages

Integrated circuit having vertical routing to bond pads

Method for manufacturing through vias using amorphization to adjust...

Semiconductor device including source/drain contact having height b...

Methods of resistance and capacitance reduction to circuit output n...

Method and structure for semiconductor device having gate spacer pr...

Semiconductor device with source/drain contact

3D semiconductor device and structure with metal layers

Package structure and method of forming the same

Structure and method for a low-k dielectric with pillar-type air-gaps

LED array and method of forming a LED array

Semiconductor device including epitaxial region

Semiconductor structure havbing an enhanced E-fuse and a method mak...

Semiconductor devices including parallel electrically conductive la...

Semiconductor structures including middle-of-line (MOL) capacitance...

Reducing RC delay in semiconductor devices

Transistor

Semiconductor package with dummy pattern not electrically connected...

Standard-cell layout structure with horn power and smart metal cut

Printed circuit board and electronic component package including th...

Semiconductor device

FINFETS having step sided contact plugs and methods of manufacturin...

Semiconductor device including bonding pad metal layer structure

Embedded chip package and manufacturing method thereof

Semiconductor device and a method for fabricating the same

Patents Applicationslast 30 patents

Contact Structure For Semiconductor Device

ELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

BURIED METAL LINER IN SOURCE/DRAIN EPITAXIAL MATERIAL

WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT WITH A...

STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CHIP HAVING A BURIED POWER RAIL

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR DEVICE

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LEADFRAME-LESS LASER DIRECT STRUCTURING (LDS) PACKAGE

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR DEVICES

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SOURCE/DRAIN CONTACTS