consisting of layered constructions comprising conductive layers and insulating layers

Industry

CPC
H01L23/485

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/485consisting of layered constructions comprising conductive layers and insulating layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device
- Patent number 12,142,546
- Issue date Nov 12, 2024
- DB HiTek, Co., Ltd.
- Yang Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,547
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuki Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,136,590
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Yun-Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,132,001
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Yong Kong Siew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone pedestal heater without vias
- Patent number 12,127,310
- Issue date Oct 22, 2024
- Watlow Electric Manufacturing Company
- Kevin Ptasienski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,112,999
- Issue date Oct 8, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and manufacturing methods thereof
- Patent number 12,094,880
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ali Keshavarzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-less laser direct structuring (LDS) package
- Patent number 12,080,631
- Issue date Sep 3, 2024
- STMicroelectronics S.r.l.
- Luca Grandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System formed through package-in-package formation
- Patent number 12,074,140
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 12,068,195
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integrated circuit having transistor gates ov...
- Patent number 12,062,658
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,057,344
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,057,374
- Issue date Aug 6, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,051,683
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with separate communication and heat dissipation paths
- Patent number 12,040,249
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Sreenivasan Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including chip pads of different surface areas,...
- Patent number 12,021,515
- Issue date Jun 25, 2024
- SK hynix Inc.
- Ju Il Eom
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,020,981
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME-LESS LASER DIRECT STRUCTURING (LDS) PACKAGE
- Publication number 20240421041
- Publication date Dec 19, 2024
- STMicroelectronics S.r.l.
- Luca GRANDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379550
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Heeseop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240355803
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
- Publication number 20240355766
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355820
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240332298
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MECHANICAL STOPPER FOR THERMAL SENSOR DEVICE
- Publication number 20240302219
- Publication date Sep 12, 2024
- STMicroelectronics International N.V.
- Federico VERCESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304524
- Publication date Sep 12, 2024
- RENESAS ELECTRONICS CORPORATION
- Tohru KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER
- Publication number 20240297076
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chan Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND-SIGNAL-GROUND DEVICE STRUCTURE
- Publication number 20240264224
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
- Publication number 20240258162
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240222333
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT
- Publication number 20240213242
- Publication date Jun 27, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Tzu-Chieh WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240213122
- Publication date Jun 27, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRO...
- Publication number 20240203880
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SUBSTRATE USING A LATTICE MATCH...
- Publication number 20240194602
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods, Structures and Devices for Intra-Connection Structures
- Publication number 20240196585
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

consisting of layered constructions comprising conductive layers and insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including bonding pad metal layer structure

Embedded chip package and manufacturing method thereof

Semiconductor device and a method for fabricating the same

Method of forming stacked trench contacts and structures formed the...

High voltage semiconductor device

Semiconductor device

Semiconductor package and method of manufacturing the same

Electronic apparatus including antennas and directors

Semiconductor structure with heat dissipation structure and method...

Semiconductor devices and methods of manufacturing semiconductor de...

Multi-zone pedestal heater without vias

RF devices with enhanced performance and methods of forming the same

Integrated circuits and manufacturing methods thereof

Leadframe-less laser direct structuring (LDS) package

System formed through package-in-package formation

Semiconductor die contact structure and method

Methods for forming contact plugs with reduced corrosion

Metal loss prevention using implantation

Method for forming an integrated circuit having transistor gates ov...

Low resistance contacts including intermetallic alloy of nickel, pl...

Prevention of contact bottom void in semiconductor fabrication

Semiconductor device and method of fabricating the same

RF devices with enhanced performance and methods of forming the same

3D semiconductor device and structure with metal layers

Semiconductor packages and methods for forming the same

Packages with separate communication and heat dissipation paths

Electronic package and method for fabricating the same

Open cavity bridge power delivery architectures and processes

Semiconductor chip including chip pads of different surface areas,...

Conductive feature formation and structure

Patents Applicationslast 30 patents

LEADFRAME-LESS LASER DIRECT STRUCTURING (LDS) PACKAGE

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR DEVICES

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METHOD FOR FABRICATING ELECTRONIC PACKAGE

EMBEDDED MECHANICAL STOPPER FOR THERMAL SENSOR DEVICE

SEMICONDUCTOR DEVICE

SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER

Conductive Feature Formation and Structure

GROUND-SIGNAL-GROUND DEVICE STRUCTURE

INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRO...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

BACKSIDE POWER DISTRIBUTION NETWORK SUBSTRATE USING A LATTICE MATCH...

Methods, Structures and Devices for Intra-Connection Structures