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consisting of layered constructions comprising conductive layers and insulating layers
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H01L23/485
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H01L23/485
consisting of layered constructions comprising conductive layers and insulating layers
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last 30 patents
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Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,967,583
Issue date
Apr 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,961,827
Issue date
Apr 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure with anti-adhesion layer
Patent number
11,948,835
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, structures and devices for intra-connection structures
Patent number
11,943,908
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Limited
Feng-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Hybrid microelectronic substrates
Patent number
11,923,257
Issue date
Mar 5, 2024
Intel Corporation
Robert Starkston
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,916,045
Issue date
Feb 27, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
Patent number
11,908,735
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,908,775
Issue date
Feb 20, 2024
Samsung Electronics Co., Ltd.
Jaewon Hwang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,908,858
Issue date
Feb 20, 2024
Samsung Electronics Co., Ltd.
Sung Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dielectric film for semiconductor fabrication
Patent number
11,901,295
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,903,192
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Josh Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,901,245
Issue date
Feb 13, 2024
Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-zone pedestal heater having a routing layer
Patent number
11,895,741
Issue date
Feb 6, 2024
Watlow Electric Manufacturing Company
Kevin Ptasienski
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Diode
Patent number
11,887,980
Issue date
Jan 30, 2024
Japan Display Inc.
Toshinari Sasaki
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Integrated circuit having contact jumper
Patent number
11,887,914
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Jung-Ho Do
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Isolated temperature sensor package with embedded spacer in dielect...
Patent number
11,879,790
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming integrated circuit package
Patent number
11,876,026
Issue date
Jan 16, 2024
Medtronic, Inc.
Chunho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contacts having a geometry to reduce resistance
Patent number
11,875,987
Issue date
Jan 16, 2024
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device including epitaxial region
Patent number
11,869,765
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Gyeom Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages
Patent number
11,869,775
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked transistors with contact last
Patent number
11,869,890
Issue date
Jan 9, 2024
Intel Corporation
Ravi Pillarisetty
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structures and methods of manufacturing the same
Patent number
11,862,585
Issue date
Jan 2, 2024
Advanced Semiconductor Engineering, Inc.
Syu-Tang Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact plugs and methods forming same
Patent number
11,862,708
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
Patent number
11,862,567
Issue date
Jan 2, 2024
International Business Machines Corporation
John Bruley
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device including source/drain contact having height b...
Patent number
11,862,623
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Charles Chew-Yuen Young
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Embedded chip package and manufacturing method thereof
Patent number
11,854,920
Issue date
Dec 26, 2023
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
FinFET device and method of forming
Patent number
11,854,811
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure of a semiconductor device
Patent number
11,854,875
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal contact structure and method of forming the same in a semicon...
Patent number
11,854,874
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
Patent number
11,854,945
Issue date
Dec 26, 2023
Tahoe Research, LTD.
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145322
Publication date
May 2, 2024
Medtronic, Inc.
Chunho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
Publication number
20240128237
Publication date
Apr 18, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20240128171
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Junwoo Myung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TRANSISTOR
Publication number
20240128259
Publication date
Apr 18, 2024
Japan Display Inc.
Toshinari SASAKI
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT B...
Publication number
20240096867
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Charles Chew-Yuen YOUNG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
Publication number
20240096697
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING EPITAXIAL REGION
Publication number
20240087884
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Gyeom Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240087972
Publication date
Mar 14, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT PLUGS AND METHODS FORMING SAME
Publication number
20240072155
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240072140
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Won Hyuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
Publication number
20240055466
Publication date
Feb 15, 2024
Raytheon Company
Eric Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240030140
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
YONG KONG SIEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20240021474
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Lid.
Yun-Yu HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
Publication number
20240021501
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Mrunal A. Khaderbad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH CONTACTS HAVING DIFFERENT DIMENSIONS AND...
Publication number
20240006227
Publication date
Jan 4, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE METALLIZATION OF FLIP-CHIP SEMICONDUCTOR DEVICES
Publication number
20230402347
Publication date
Dec 14, 2023
Raytheon Company
Nick Angelo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
Publication number
20230395539
Publication date
Dec 7, 2023
INFINEON TECHNOLOGIES AG
Evelyn Napetschnig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
Publication number
20230395572
Publication date
Dec 7, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230387064
Publication date
Nov 30, 2023
RENESAS ELECTRONICS CORPORATION
Kodai OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WRAP-AROUND TRENCH CONTACT STRUCTURE AND METHODS OF FABRICATION
Publication number
20230387121
Publication date
Nov 30, 2023
Intel Corporation
Joseph Steigerwald
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINFET STRUCTURE WITH CONTROLLED AIR GAPS
Publication number
20230386904
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Wen-Che Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System Formed Through Package-In-Package Formation
Publication number
20230387082
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINFETS HAVING STEP SIDED CONTACT PLUGS AND METHODS OF MANUFACTURIN...
Publication number
20230378356
Publication date
Nov 23, 2023
Samsung Electronics Co., Ltd.
Sun Hom PAAK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL TEST CHIP WITH STACKABLE METAL BASED HEATER AND SENSOR
Publication number
20230378023
Publication date
Nov 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Vinod Rai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Feature Formation and Structure
Publication number
20230369109
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu Shih Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for a Low-K Dielectric With Pillar-Type Air-Gaps
Publication number
20230369228
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih Wei Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR POWER OVERLAY DEVICE AND METHOD
Publication number
20230361049
Publication date
Nov 9, 2023
GE AVIATION SYSTEMS LLC
Liqiang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230352410
Publication date
Nov 2, 2023
Samsung Electronics Co., Ltd.
Jinnam Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230352371
Publication date
Nov 2, 2023
Rohm Co., Ltd.
Yuki NAKANO
H01 - BASIC ELECTRIC ELEMENTS