Contacting devices

Industry

CPC
C25D17/005

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Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/005Contacting devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coating apparatus for coating components
- Patent number 12,134,832
- Issue date Nov 5, 2024
- Robert Bosch GmbH
- Christoph Roland Hoelzl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and process for producing lithium
- Patent number 12,018,397
- Issue date Jun 25, 2024
- ALPHA-EN CORPORATION
- Lawrence Ralph Swonger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation method for metallic coating and film formation devic...
- Patent number 11,913,129
- Issue date Feb 27, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and film thickness measuring method for substrate
- Patent number 11,906,299
- Issue date Feb 20, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating of tubular workpiece
- Patent number 11,905,612
- Issue date Feb 20, 2024
- Japan Aviation Electronics Industry, Limited
- Takeharu Naito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Maintenance member, substrate holding module, plating apparatus, an...
- Patent number 11,905,611
- Issue date Feb 20, 2024
- Ebara Corporation
- Masayuki Satake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,903,141
- Issue date Feb 13, 2024
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device manufacturing jig and method for manufacturing...
- Patent number 11,891,713
- Issue date Feb 6, 2024
- Kabushiki Kaisha Toshiba
- Takeyuki Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Short circuit detection method in plating apparatus, control method...
- Patent number 11,866,842
- Issue date Jan 9, 2024
- Ebara Corporation
- Hideki Wakabayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive plating apparatus, plating system and plating method for...
- Patent number 11,821,100
- Issue date Nov 21, 2023
- Xiamen Hithium Energy Storage Technology Co., Ltd.
- Wancai Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder
- Patent number 11,697,886
- Issue date Jul 11, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Contact structure, substrate holder, apparatus for plating, and met...
- Patent number 11,668,018
- Issue date Jun 6, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a chromium-plated surface with a matte finish
- Patent number 11,643,747
- Issue date May 9, 2023
- Kings Mountain International, Inc
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,629,427
- Issue date Apr 18, 2023
- Mitsubishi Electric Corporation
- Yohei Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for controlling electrochemical deposition to avoid defects...
- Patent number 11,603,602
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical plating system and method of using
- Patent number 11,598,016
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate locking system, device and procedure for chemical and/or...
- Patent number 11,566,337
- Issue date Jan 31, 2023
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 11,542,630
- Issue date Jan 3, 2023
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,535,947
- Issue date Dec 27, 2022
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 11,535,950
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 11,512,408
- Issue date Nov 29, 2022
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and cleaning method in electroplating appa...
- Patent number 11,492,721
- Issue date Nov 8, 2022
- Ebara Corporation
- Kazuhito Tsuji
- B08 - CLEANING
Information Patent Grant
Film forming apparatus for forming metal film
- Patent number 11,459,667
- Issue date Oct 4, 2022
- Toyota Jidosha Kabushiki Kaisha
- Yuki Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming apparatus for forming metal film
- Patent number 11,427,922
- Issue date Aug 30, 2022
- Toyota Jidosha Kabushiki Kaisha
- Yuki Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrode frame
- Patent number 11,293,112
- Issue date Apr 5, 2022
- U-Pro Machines Co., Ltd.
- Hsin-Chi Iou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tubular articles with electrodeposited coatings, and systems and me...
- Patent number 11,286,575
- Issue date Mar 29, 2022
- Modumetal, Inc.
- Christina A. Lomasney
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Non-permeable substrate carrier for electroplating
- Patent number 11,280,019
- Issue date Mar 22, 2022
- SunPower Corporation
- Emmanuel Chua Abas
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Seal apparatus for an electroplating system
- Patent number 11,274,377
- Issue date Mar 15, 2022
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
NOVEL CATHODE CONDUCTIVE ROLLER DEVICE FOR SHEET-TYPE PLATING OR SH...
- Publication number 20240360583
- Publication date Oct 31, 2024
- Wenzhong Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND PROCESS FOR PRODUCING LITHIUM
- Publication number 20240301579
- Publication date Sep 12, 2024
- ALPHA-EN CORPORATION
- Lawrence Ralph Swonger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING CONDUCTIVE FIXTURE
- Publication number 20240254647
- Publication date Aug 1, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Jisheng HUO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CONTACT CLEANING METHOD
- Publication number 20240218552
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Kentaro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...
- Publication number 20240218551
- Publication date Jul 4, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATHODE CONDUCTION MECHANISM AND ELECTROPLATING SYSTEM
- Publication number 20240150921
- Publication date May 9, 2024
- Chongqing JIMAT New Material Technology Co., Ltd.
- Shiwei ZANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES
- Publication number 20240150923
- Publication date May 9, 2024
- MTI GmbH
- Markus HACKSTEINER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING
- Publication number 20240003038
- Publication date Jan 4, 2024
- EBARA CORPORATION
- NAOTO TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
- Publication number 20230295830
- Publication date Sep 21, 2023
- Kings Mountain International, Inc.
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE...
- Publication number 20230175161
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
- Publication number 20230152077
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20230076493
- Publication date Mar 9, 2023
- Novellus Systems, Inc.
- Jingbin FENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COATING SYSTEM AND ELECTRODE RACK
- Publication number 20230024157
- Publication date Jan 26, 2023
- SST SYSTEMS, INC.
- Tim Splingaire
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TUBULAR ARTICLES WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND ME...
- Publication number 20220396893
- Publication date Dec 15, 2022
- Modumetal, Inc.
- Christina A. LOMASNEY
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20220380922
- Publication date Dec 1, 2022
- University of South Florida
- Arash Takshi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, SUBSTRATE PLATING DEVICE EQUIPPED THEREWITH, AND...
- Publication number 20220372647
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Masaya SEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING JIG AND METHOD FOR MANUFACTURING...
- Publication number 20220267920
- Publication date Aug 25, 2022
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHORT CIRCUIT DETECTION METHOD IN PLATING APPARATUS, CONTROL METHOD...
- Publication number 20220228286
- Publication date Jul 21, 2022
- EBARA CORPORATION
- Hideki Wakabayashi
- G01 - MEASURING TESTING
Information Patent Application
COATING APPARATUS FOR COATING COMPONENTS
- Publication number 20220220626
- Publication date Jul 14, 2022
- ROBERT BOSCH GmbH
- Christoph Roland Hoelzl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EQUIPMENT FOR OXIDATION OF PLANAR METALLIC SURFACES, SUCH AS SHEET,...
- Publication number 20220186396
- Publication date Jun 16, 2022
- METALY S.R.L.
- STEFANO MURATORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTACT STRUCTURE, SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND MET...
- Publication number 20220098749
- Publication date Mar 31, 2022
- EBARA CORPORATION
- Matsutaro MIYAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD FOR METALLIC COATING AND FILM FORMATION DEVIC...
- Publication number 20220098753
- Publication date Mar 31, 2022
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220061165
- Publication date Feb 24, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji KURODA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
- Publication number 20220042197
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND PROCESS FOR PRODUCING LITHIUM
- Publication number 20220010447
- Publication date Jan 13, 2022
- ALPHA-EN CORPORATION
- Lawrence Ralph Swonger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DAMAGED PORTION TREATMENT METHOD AND DAMAGED PORTION TREATMENT DEVI...
- Publication number 20210395914
- Publication date Dec 23, 2021
- MAZDA MOTOR CORPORATION
- Teruaki ASADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Contacting devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus and cleaning method of contact member of plating...

Coating apparatus for coating components

System and process for producing lithium

Systems and methods for shielding features of a workpiece during el...

Film formation method for metallic coating and film formation devic...

Plating apparatus and film thickness measuring method for substrate

Method for plating of tubular workpiece

Maintenance member, substrate holding module, plating apparatus, an...

Method for manufacturing wiring board

Semiconductor device manufacturing jig and method for manufacturing...

Short circuit detection method in plating apparatus, control method...

Conductive plating apparatus, plating system and plating method for...

Substrate holder

Contact structure, substrate holder, apparatus for plating, and met...

Method for creating a chromium-plated surface with a matte finish

Plating apparatus and plating method

Method for controlling electrochemical deposition to avoid defects...

Electrochemical plating system and method of using

Substrate locking system, device and procedure for chemical and/or...

Cleaning electroplating substrate holders using reverse current dep...

Electrochemical three-dimensional printing and soldering

Electro-plating and apparatus for performing the same

Lipseals and contact elements for semiconductor electroplating appa...

Electroplating apparatus and cleaning method in electroplating appa...

Film forming apparatus for forming metal film

Film forming apparatus for forming metal film

Electrode frame

Tubular articles with electrodeposited coatings, and systems and me...

Non-permeable substrate carrier for electroplating

Seal apparatus for an electroplating system

Patents Applicationslast 30 patents

NOVEL CATHODE CONDUCTIVE ROLLER DEVICE FOR SHEET-TYPE PLATING OR SH...

SYSTEM AND PROCESS FOR PRODUCING LITHIUM

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

ELECTROPLATING CONDUCTIVE FIXTURE

PLATING APPARATUS AND CONTACT CLEANING METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...

CATHODE CONDUCTION MECHANISM AND ELECTROPLATING SYSTEM

METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES

SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH

BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE...

PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

COATING SYSTEM AND ELECTRODE RACK

TUBULAR ARTICLES WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND ME...

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

SUBSTRATE HOLDER, SUBSTRATE PLATING DEVICE EQUIPPED THEREWITH, AND...

SEMICONDUCTOR DEVICE MANUFACTURING JIG AND METHOD FOR MANUFACTURING...

SHORT CIRCUIT DETECTION METHOD IN PLATING APPARATUS, CONTROL METHOD...

COATING APPARATUS FOR COATING COMPONENTS

EQUIPMENT FOR OXIDATION OF PLANAR METALLIC SURFACES, SUCH AS SHEET,...

CONTACT STRUCTURE, SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND MET...

FILM FORMATION METHOD FOR METALLIC COATING AND FILM FORMATION DEVIC...

METHOD FOR MANUFACTURING WIRING BOARD

ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING

SYSTEM AND PROCESS FOR PRODUCING LITHIUM

DAMAGED PORTION TREATMENT METHOD AND DAMAGED PORTION TREATMENT DEVI...