Containers Encapsulations

Industry

CPC
H01L31/0203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L31/0203Containers Encapsulations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and electronic device
- Patent number 12,293,963
- Issue date May 6, 2025
- Kyocera Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a transparent encapsulation structure...
- Patent number 12,288,961
- Issue date Apr 29, 2025
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy harvesting systems for providing autonomous electrical power...
- Patent number 12,280,576
- Issue date Apr 22, 2025
- Face International Corporation
- Clark D Boyd
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic devices with optical sensor isolation
- Patent number 12,265,248
- Issue date Apr 1, 2025
- Apple Inc.
- Erik G. de Jong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow-profile optical elements for photonics receivers
- Patent number 12,253,723
- Issue date Mar 18, 2025
- Intel Corporation
- Alexander Krichevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based light sensor
- Patent number 12,249,663
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Llen Linus Lu
- G08 - SIGNALLING
Information Patent Grant
Optical sensor, and method for manufacturing optical sensor
- Patent number 12,230,618
- Issue date Feb 18, 2025
- Rohm Co., Ltd.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 12,224,359
- Issue date Feb 11, 2025
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement, package and package arrangement, as well as...
- Patent number 12,224,388
- Issue date Feb 11, 2025
- MSG LITHOGLAS GMBH
- Oliver Gyenge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,218,287
- Issue date Feb 4, 2025
- STMicroelectronics (Grenoble 2) SAS
- Olivier Zanellato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband back-illuminated electromagnetic radiation detectors
- Patent number 12,206,032
- Issue date Jan 21, 2025
- Apple Inc.
- Mark Alan Arbore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor and detector for an optical detection
- Patent number 12,199,209
- Issue date Jan 14, 2025
- trinamiX GmbH
- Wilfried Hermes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base, package for storing semiconductor element, and semicon...
- Patent number 12,199,194
- Issue date Jan 14, 2025
- Kyocera Corporation
- Makoto Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked filter assembly for optical integrated circuit package with...
- Patent number 12,189,064
- Issue date Jan 7, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Colin Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and miniaturized endoscope having a scattering...
- Patent number 12,178,407
- Issue date Dec 31, 2024
- Medimaging Integrated Solution, Inc.
- Shangyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation detection element, radiation detector and radiation detec...
- Patent number 12,183,844
- Issue date Dec 31, 2024
- Horiba, Ltd.
- Daisuke Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with at least one light channel and method fo...
- Patent number 12,176,330
- Issue date Dec 24, 2024
- Osram Opto Semiconductors GmbH
- Claus Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing same
- Patent number 12,176,444
- Issue date Dec 24, 2024
- Osram Opto Semiconductors GmbH
- Zeljko Pajkic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sensor devices and methods of manufacturing electronic s...
- Patent number 12,176,443
- Issue date Dec 24, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Prism, optical device, method for manufacturing prism, and method f...
- Patent number 12,153,282
- Issue date Nov 26, 2024
- Yoshimasa Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic module
- Patent number 12,148,850
- Issue date Nov 19, 2024
- Jinko Solar (Shangrao) Co., Ltd
- Wusong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor arrangement, device and method of manufacturing an o...
- Patent number 12,140,699
- Issue date Nov 12, 2024
- ams AG
- Harald Etschmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating a dispensable light transmissible aperture i...
- Patent number 12,125,935
- Issue date Oct 22, 2024
- STMicroelectronics Asia Pacific Ptd Ltd
- Jaspreet Singh Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distance measuring device
- Patent number 12,123,744
- Issue date Oct 22, 2024
- Sony Group Corporation
- Sho Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated component with improved spati...
- Patent number 12,113,140
- Issue date Oct 8, 2024
- STMicroelectronics S.r.l.
- Luca Seghizzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell, method for preparing solar cell, and photovoltaic module
- Patent number 12,100,771
- Issue date Sep 24, 2024
- JINKO SOLAR (HAINING) CO., LTD.
- Bike Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for a semiconductor photonic component
- Patent number 12,087,869
- Issue date Sep 10, 2024
- SIGNIFY HOLDING B.V.
- Peter Johannes Martinus Bukkems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic cell and laminate metallization
- Patent number 12,080,817
- Issue date Sep 3, 2024
- Maxeon Solar Pte. Ltd.
- Gabriel Harley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physiological monitoring system for measuring oxygen saturation
- Patent number 12,076,142
- Issue date Sep 3, 2024
- Apple Inc.
- Vivek Venugopal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022991
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF WAVEGUIDE AND ACTIVE COMPONENT AND MANUFACT...
- Publication number 20250015210
- Publication date Jan 9, 2025
- National Tsing Hua University
- Ming-Chang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Sensing Device Packaging Structure and Packaging Method thereof
- Publication number 20250015206
- Publication date Jan 9, 2025
- SensorTek technology Corp.
- Wen-Chieh Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND METHOD OF MANUFACTURING A SENSOR PACKAGE
- Publication number 20250004107
- Publication date Jan 2, 2025
- ams-OSRAM Asia Pacific Pte. Ltd.
- Tiao ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
- Publication number 20240421556
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Hironobu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20240405130
- Publication date Dec 5, 2024
- Kyocera Corporation
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING DEVICE, DISTANCE MEASUREMENT APPARATUS, DISTANCE ME...
- Publication number 20240405149
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- HIIZU OHTORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC BARRIER FOR REFLECTIVE BACKPLANE OF TUNABLE OPTICAL META...
- Publication number 20240405132
- Publication date Dec 5, 2024
- Lumotive, Inc.
- Erik Edward Josberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSIOLOGICAL MONITORING SYSTEM FOR MEASURING OXYGEN SATURATION
- Publication number 20240389901
- Publication date Nov 28, 2024
- Apple Inc.
- Vivek Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR ELECTRONIC DEVICES
- Publication number 20240387755
- Publication date Nov 21, 2024
- JCET GROUP CO., LTD.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CONDUCTIVE ENCAPSULANT FOR PHOTOELECTROCHEMICAL APPLICA...
- Publication number 20240387756
- Publication date Nov 21, 2024
- ALLIANCE FOR SUSTAINABLE ENERGY, LLC
- Ann London GREENAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED LIGHT SENSOR
- Publication number 20240387753
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- G08 - SIGNALLING
Information Patent Application
POLYETHYLENE RESIN COMPOSITION, FILM, SHEET, AND SOLAR CELL SEALING...
- Publication number 20240360258
- Publication date Oct 31, 2024
- Sumitomo Chemical Company, Limited
- Hidekazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240363788
- Publication date Oct 31, 2024
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Sensor Device
- Publication number 20240355939
- Publication date Oct 24, 2024
- Artilux, Inc.
- Chih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20240347666
- Publication date Oct 17, 2024
- Lite-On Technology Corporation
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FILTER ASSEMBLY FOR OPTICAL INTEGRATED CIRCUIT PACKAGE WITH...
- Publication number 20240345229
- Publication date Oct 17, 2024
- STMicroelectronics International N.V.
- Colin CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240347648
- Publication date Oct 17, 2024
- JCET Group Co. Ltd.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240339572
- Publication date Oct 10, 2024
- Lextar Electronics Corporation
- Yu-Jing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON DRIFT DETECTION ELEMENT, SILICON DRIFT DETECTOR, AND RADIAT...
- Publication number 20240337765
- Publication date Oct 10, 2024
- HORIBA, Ltd.
- Daisuke MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20240332210
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Patrick LAURENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER MEMBER AND SOLAR CELL
- Publication number 20240332435
- Publication date Oct 3, 2024
- AGC Inc.
- Shimpei MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332436
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Yiying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332445
- Publication date Oct 3, 2024
- AOI ELECTRONICS CO., LTD.
- Atsushi KUROHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photodiodes
- Publication number 20240322053
- Publication date Sep 26, 2024
- X-FAB Global Services GmbH
- Daniel Gäbler
- H01 - BASIC ELECTRIC ELEMENTS

Containers Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and electronic device

Electronic device comprising a transparent encapsulation structure...

Energy harvesting systems for providing autonomous electrical power...

Electronic devices with optical sensor isolation

Shallow-profile optical elements for photonics receivers

Thin film transistor based light sensor

Optical sensor, and method for manufacturing optical sensor

Sensor package structure having solder mask frame

Component arrangement, package and package arrangement, as well as...

Electronic package

Wideband back-illuminated electromagnetic radiation detectors

Optical sensor and detector for an optical detection

Wiring base, package for storing semiconductor element, and semicon...

Stacked filter assembly for optical integrated circuit package with...

Image sensor package and miniaturized endoscope having a scattering...

Radiation detection element, radiation detector and radiation detec...

Optoelectronic device with at least one light channel and method fo...

Optoelectronic component and method for producing same

Electronic sensor devices and methods of manufacturing electronic s...

Prism, optical device, method for manufacturing prism, and method f...

Photovoltaic module

Optical sensor arrangement, device and method of manufacturing an o...

Method for integrating a dispensable light transmissible aperture i...

Distance measuring device

Method of manufacturing an integrated component with improved spati...

Solar cell, method for preparing solar cell, and photovoltaic module

Assembly for a semiconductor photonic component

Sensing die encapsulated by an encapsulant with a roughness surface...

Photovoltaic cell and laminate metallization

Physiological monitoring system for measuring oxygen saturation

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

INTEGRATED STRUCTURE OF WAVEGUIDE AND ACTIVE COMPONENT AND MANUFACT...

Light Sensing Device Packaging Structure and Packaging Method thereof

SENSOR PACKAGE AND METHOD OF MANUFACTURING A SENSOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

LIGHT RECEIVING DEVICE, DISTANCE MEASUREMENT APPARATUS, DISTANCE ME...

DIELECTRIC BARRIER FOR REFLECTIVE BACKPLANE OF TUNABLE OPTICAL META...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PHYSIOLOGICAL MONITORING SYSTEM FOR MEASURING OXYGEN SATURATION

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

PACKAGING STRUCTURE FOR ELECTRONIC DEVICES

TRANSPARENT CONDUCTIVE ENCAPSULANT FOR PHOTOELECTROCHEMICAL APPLICA...

THIN FILM TRANSISTOR BASED LIGHT SENSOR

POLYETHYLENE RESIN COMPOSITION, FILM, SHEET, AND SOLAR CELL SEALING...

LIGHT EMITTING DEVICE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

Optical Sensor Device

OPTOELECTRONIC DEVICE

STACKED FILTER ASSEMBLY FOR OPTICAL INTEGRATED CIRCUIT PACKAGE WITH...

PACKAGE STRUCTURE AND PACKAGING METHOD

DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICON DRIFT DETECTION ELEMENT, SILICON DRIFT DETECTOR, AND RADIAT...

OPTICAL PACKAGE WITH ELECTROMAGNETIC SHIELDING

COVER MEMBER AND SOLAR CELL

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Photodiodes