Containers Encapsulations

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CPC
H01L31/0203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L31/0203Containers Encapsulations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Prism, optical device, method for manufacturing prism, and method f...
- Patent number 12,153,282
- Issue date Nov 26, 2024
- Yoshimasa Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic module
- Patent number 12,148,850
- Issue date Nov 19, 2024
- Jinko Solar (Shangrao) Co., Ltd
- Wusong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor arrangement, device and method of manufacturing an o...
- Patent number 12,140,699
- Issue date Nov 12, 2024
- ams AG
- Harald Etschmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating a dispensable light transmissible aperture i...
- Patent number 12,125,935
- Issue date Oct 22, 2024
- STMicroelectronics Asia Pacific Ptd Ltd
- Jaspreet Singh Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distance measuring device
- Patent number 12,123,744
- Issue date Oct 22, 2024
- Sony Group Corporation
- Sho Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated component with improved spati...
- Patent number 12,113,140
- Issue date Oct 8, 2024
- STMicroelectronics S.r.l.
- Luca Seghizzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell, method for preparing solar cell, and photovoltaic module
- Patent number 12,100,771
- Issue date Sep 24, 2024
- JINKO SOLAR (HAINING) CO., LTD.
- Bike Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for a semiconductor photonic component
- Patent number 12,087,869
- Issue date Sep 10, 2024
- SIGNIFY HOLDING B.V.
- Peter Johannes Martinus Bukkems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic cell and laminate metallization
- Patent number 12,080,817
- Issue date Sep 3, 2024
- Maxeon Solar Pte. Ltd.
- Gabriel Harley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physiological monitoring system for measuring oxygen saturation
- Patent number 12,076,142
- Issue date Sep 3, 2024
- Apple Inc.
- Vivek Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device
- Patent number 12,080,813
- Issue date Sep 3, 2024
- Hamamatsu Photonics K.K.
- Fumitaka Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package having a light blocking member
- Patent number 12,068,345
- Issue date Aug 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component package, and electronic apparatus
- Patent number 12,068,420
- Issue date Aug 20, 2024
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,068,427
- Issue date Aug 20, 2024
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an electronic device comprising an optical chip
- Patent number 12,066,678
- Issue date Aug 20, 2024
- STMicroelectronics (Grenoble 2) SAS
- Nicolas Mastromauro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water purification, sterilization and disinfection lamp
- Patent number 12,049,768
- Issue date Jul 30, 2024
- SHEN ZHEN LAMHO PHOTOELECTRICITY & TECHNOLOGY CO., LTD
- Yelin Gong
- E04 - BUILDING
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Far-infrared sensor packaging structure
- Patent number 12,040,416
- Issue date Jul 16, 2024
- PixArt Imaging Inc.
- Yi-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,040,434
- Issue date Jul 16, 2024
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowed wafer assemblies having interposers
- Patent number 12,021,156
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit module having an exposed semiconduc...
- Patent number 12,021,065
- Issue date Jun 25, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetection apparatus
- Patent number 12,015,098
- Issue date Jun 18, 2024
- Asahi Kasei Microdevices Corporation
- Koji Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 12,014,968
- Issue date Jun 18, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichirou Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensor and endoscope
- Patent number 12,004,720
- Issue date Jun 11, 2024
- Medimaging Integrated Solution, Inc.
- Chu-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode and method for operating a photodiode
- Patent number 12,009,439
- Issue date Jun 11, 2024
- AMS-OSRAM INTERNATIONAL GMBH
- Massimo Cataldo Mazzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor component
- Patent number 12,002,901
- Issue date Jun 4, 2024
- Osram Opto Semiconductors GmbH
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level optical sensor packaging
- Patent number 12,002,898
- Issue date Jun 4, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized optical sensor package and manufacturing method thereof
- Patent number 11,990,557
- Issue date May 21, 2024
- PixArt Imaging Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having ring-shaped solder mask frame
- Patent number 11,984,516
- Issue date May 14, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
- Publication number 20240421556
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Hironobu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20240405130
- Publication date Dec 5, 2024
- Kyocera Corporation
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING DEVICE, DISTANCE MEASUREMENT APPARATUS, DISTANCE ME...
- Publication number 20240405149
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- HIIZU OHTORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC BARRIER FOR REFLECTIVE BACKPLANE OF TUNABLE OPTICAL META...
- Publication number 20240405132
- Publication date Dec 5, 2024
- Lumotive, Inc.
- Erik Edward Josberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSIOLOGICAL MONITORING SYSTEM FOR MEASURING OXYGEN SATURATION
- Publication number 20240389901
- Publication date Nov 28, 2024
- Apple Inc.
- Vivek Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR ELECTRONIC DEVICES
- Publication number 20240387755
- Publication date Nov 21, 2024
- JCET GROUP CO., LTD.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CONDUCTIVE ENCAPSULANT FOR PHOTOELECTROCHEMICAL APPLICA...
- Publication number 20240387756
- Publication date Nov 21, 2024
- ALLIANCE FOR SUSTAINABLE ENERGY, LLC
- Ann London GREENAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED LIGHT SENSOR
- Publication number 20240387753
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- G08 - SIGNALLING
Information Patent Application
POLYETHYLENE RESIN COMPOSITION, FILM, SHEET, AND SOLAR CELL SEALING...
- Publication number 20240360258
- Publication date Oct 31, 2024
- Sumitomo Chemical Company, Limited
- Hidekazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240363788
- Publication date Oct 31, 2024
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Sensor Device
- Publication number 20240355939
- Publication date Oct 24, 2024
- Artilux, Inc.
- Chih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20240347666
- Publication date Oct 17, 2024
- Lite-On Technology Corporation
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FILTER ASSEMBLY FOR OPTICAL INTEGRATED CIRCUIT PACKAGE WITH...
- Publication number 20240345229
- Publication date Oct 17, 2024
- STMicroelectronics International N.V.
- Colin CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240347648
- Publication date Oct 17, 2024
- JCET Group Co. Ltd.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240339572
- Publication date Oct 10, 2024
- Lextar Electronics Corporation
- Yu-Jing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON DRIFT DETECTION ELEMENT, SILICON DRIFT DETECTOR, AND RADIAT...
- Publication number 20240337765
- Publication date Oct 10, 2024
- HORIBA, Ltd.
- Daisuke MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER MEMBER AND SOLAR CELL
- Publication number 20240332435
- Publication date Oct 3, 2024
- AGC Inc.
- Shimpei MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332436
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Yiying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20240332210
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Patrick LAURENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332445
- Publication date Oct 3, 2024
- AOI ELECTRONICS CO., LTD.
- Atsushi KUROHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photodiodes
- Publication number 20240322053
- Publication date Sep 26, 2024
- X-FAB Global Services GmbH
- Daniel Gäbler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240322102
- Publication date Sep 26, 2024
- ASAHI KASEI MICRODEVICES CORPORATION
- Yoshiki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING TH...
- Publication number 20240304735
- Publication date Sep 12, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE
- Publication number 20240297260
- Publication date Sep 5, 2024
- MELEXIS TECHNOLOGIES NV
- Rachel GLEESON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION SOLAR CELL AND PREPERATION METHOD THEREOF
- Publication number 20240297262
- Publication date Sep 5, 2024
- ANHUI HUASUN ENERGY CO., LTD.
- Ke XIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-DETECTING DEVICE
- Publication number 20240290902
- Publication date Aug 29, 2024
- EPISTAR CORPORATION
- Chang Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Containers Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Prism, optical device, method for manufacturing prism, and method f...

Photovoltaic module

Optical sensor arrangement, device and method of manufacturing an o...

Method for integrating a dispensable light transmissible aperture i...

Distance measuring device

Method of manufacturing an integrated component with improved spati...

Solar cell, method for preparing solar cell, and photovoltaic module

Assembly for a semiconductor photonic component

Sensing die encapsulated by an encapsulant with a roughness surface...

Photovoltaic cell and laminate metallization

Physiological monitoring system for measuring oxygen saturation

Optical semiconductor device

Image sensor package having a light blocking member

Wiring board, electronic component package, and electronic apparatus

Light emitting device

Method of fabricating an electronic device comprising an optical chip

Water purification, sterilization and disinfection lamp

Systems of applying materials to components

Far-infrared sensor packaging structure

Diode package structure and manufacturing method thereof

Windowed wafer assemblies having interposers

Double-sided integrated circuit module having an exposed semiconduc...

Photodetection apparatus

Semiconductor device, manufacturing method of semiconductor device,...

Packaged image sensor and endoscope

Photodiode and method for operating a photodiode

Optoelectronic semiconductor component

Embedded wafer level optical sensor packaging

Miniaturized optical sensor package and manufacturing method thereof

Sensor package structure having ring-shaped solder mask frame

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

LIGHT RECEIVING DEVICE, DISTANCE MEASUREMENT APPARATUS, DISTANCE ME...

DIELECTRIC BARRIER FOR REFLECTIVE BACKPLANE OF TUNABLE OPTICAL META...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PHYSIOLOGICAL MONITORING SYSTEM FOR MEASURING OXYGEN SATURATION

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

PACKAGING STRUCTURE FOR ELECTRONIC DEVICES

TRANSPARENT CONDUCTIVE ENCAPSULANT FOR PHOTOELECTROCHEMICAL APPLICA...

THIN FILM TRANSISTOR BASED LIGHT SENSOR

POLYETHYLENE RESIN COMPOSITION, FILM, SHEET, AND SOLAR CELL SEALING...

LIGHT EMITTING DEVICE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

Optical Sensor Device

OPTOELECTRONIC DEVICE

STACKED FILTER ASSEMBLY FOR OPTICAL INTEGRATED CIRCUIT PACKAGE WITH...

PACKAGE STRUCTURE AND PACKAGING METHOD

DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICON DRIFT DETECTION ELEMENT, SILICON DRIFT DETECTOR, AND RADIAT...

COVER MEMBER AND SOLAR CELL

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

OPTICAL PACKAGE WITH ELECTROMAGNETIC SHIELDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Photodiodes

OPTICAL DEVICE

OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING TH...

METHOD OF MANUFACTURING A SENSOR DEVICE

HETEROJUNCTION SOLAR CELL AND PREPERATION METHOD THEREOF

PHOTO-DETECTING DEVICE