Containers Encapsulations

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CPC
H01L31/0203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L31/0203Containers Encapsulations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Image sensor
- Patent number 11,658,193
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Kang Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic devices with non-rectangular die shapes
- Patent number 11,646,384
- Issue date May 9, 2023
- Apple Inc.
- Mathieu Charbonneau-Lefort
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically clear thermal spreader for status indication within an el...
- Patent number 11,637,211
- Issue date Apr 25, 2023
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection method and wafer
- Patent number 11,624,902
- Issue date Apr 11, 2023
- Hamamatsu Photonics K.K.
- Yumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,626,525
- Issue date Apr 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun Yu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component having an optical element with different i...
- Patent number 11,621,255
- Issue date Apr 4, 2023
- OSRAM OLED GmbH
- Claus Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All-in-one integrated multifunctional triple power module
- Patent number 11,619,423
- Issue date Apr 4, 2023
- SAPHIRE SOLAR TECHNOLOGIES APS
- Yakov Safir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Earphone with proximity sensing function
- Patent number 11,611,821
- Issue date Mar 21, 2023
- LUXSENTEK MICROELECTRONICS CORP.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,611,009
- Issue date Mar 21, 2023
- Kabushiki Kaisha Toshiba
- Masahiko Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an optical chip and method of fabrication
- Patent number 11,609,402
- Issue date Mar 21, 2023
- STMicroelectronics (Grenoble 2) SAS
- Nicolas Mastromauro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for a sensor having a sealing layer
- Patent number 11,605,659
- Issue date Mar 14, 2023
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a detection device comprising a step of dire...
- Patent number 11,575,063
- Issue date Feb 7, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sébastien Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode package structure with shutters, forming method thereof,...
- Patent number 11,570,339
- Issue date Jan 31, 2023
- Lextar Electronics Corporation
- Kai-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package with optically transparent mold compound
- Patent number 11,569,396
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device with uneven structures and method for ma...
- Patent number 11,570,387
- Issue date Jan 31, 2023
- Sony Group Corporation
- Yoshiaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and manufacturing method thereof
- Patent number 11,569,217
- Issue date Jan 31, 2023
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically transparent electromagnetically shielding element compris...
- Patent number 11,563,128
- Issue date Jan 24, 2023
- SAFRAN ELECTRONICS & DEFENSE Boulogne
- Cyril Dupeyrat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods for managing heat in a photonic integrated circuit
- Patent number 11,563,136
- Issue date Jan 24, 2023
- Acacia Communications, Inc.
- John Heanue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,557,684
- Issue date Jan 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale sensor package structure
- Patent number 11,552,120
- Issue date Jan 10, 2023
- KINGPAK TECHNOLOGY INC.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 11,551,982
- Issue date Jan 10, 2023
- Kateeva, Inc.
- Eliyahu Vronsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical package assembly and mobile terminal
- Patent number 11,552,201
- Issue date Jan 10, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Wanglai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,545,604
- Issue date Jan 3, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Dong Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover for an electronic circuit package
- Patent number 11,546,059
- Issue date Jan 3, 2023
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, electronic device and method for preparing...
- Patent number 11,545,517
- Issue date Jan 3, 2023
- Shenzhen Goodix Technology Co., Ltd.
- Haoxiang Dong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capping structures for germanium-containing photovoltaic components...
- Patent number 11,532,759
- Issue date Dec 20, 2022
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including electronic substrate and circuit mem...
- Patent number 11,528,392
- Issue date Dec 13, 2022
- Canon Kabushiki Kaisha
- Jun Tsukano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 11,527,453
- Issue date Dec 13, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichirou Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetectors and terminators including a tapered thickness
- Patent number 11,520,113
- Issue date Dec 6, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Abdelsalam Aboketaf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Photodiode and Method for Operating a Photodiode
- Publication number 20230163223
- Publication date May 25, 2023
- ams-OSRAM International GmbH
- Massimo Cataldo Mazzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR MANAGING HEAT IN A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20230155053
- Publication date May 18, 2023
- Acacia Communications, Inc.
- John Heanue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES
- Publication number 20230141436
- Publication date May 11, 2023
- Infinera Corporation
- MINGZHI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES
- Publication number 20230141290
- Publication date May 11, 2023
- Infinera Corporation
- MINGZHI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES
- Publication number 20230142387
- Publication date May 11, 2023
- Infinera Corporation
- MINGZHI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE
- Publication number 20230147887
- Publication date May 11, 2023
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES
- Publication number 20230133616
- Publication date May 4, 2023
- Infinera Corporation
- MINGZHI LU
- G02 - OPTICS
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20230135105
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Bettina Schuster
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230123432
- Publication date Apr 20, 2023
- Kabushiki Kaisha Toshiba
- Mami FUJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230117746
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Dong Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND ENDOSCOPE
- Publication number 20230108867
- Publication date Apr 6, 2023
- Medimaging Integrated Solution, Inc.
- Shangyi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230104668
- Publication date Apr 6, 2023
- Che Yin Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20230090278
- Publication date Mar 23, 2023
- Sony Semiconductor Solutions Corporation
- Eiichirou KISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EARPHONE WITH PROXIMITY SENSING FUNCTION
- Publication number 20230061606
- Publication date Mar 2, 2023
- Luxsentek Microelectronics Corp.
- Chih-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED LIGHT SENSOR
- Publication number 20230063673
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Llen Linus LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEX SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20230059535
- Publication date Feb 23, 2023
- SENSORTEK TECHNOLOGY CORP.
- WEN-CHIEH TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT INCLUDING ELECTRONIC SUBSTRATE AND CIRCUIT MEM...
- Publication number 20230053757
- Publication date Feb 23, 2023
- Canon Kabushiki Kaisha
- Jun Tsukano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING MODULE
- Publication number 20230051355
- Publication date Feb 16, 2023
- Mitsubishi Electric Corporation
- Kazuki YAMAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230037713
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Tang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS GAMMA AND/OR HARD X-RAY RADIATION DETECTOR
- Publication number 20230041758
- Publication date Feb 9, 2023
- Henry Meyer Daghighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20230036239
- Publication date Feb 2, 2023
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR DEVICES AND OPTOE...
- Publication number 20230031493
- Publication date Feb 2, 2023
- OSRAM OLED GmbH
- Markus PINDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABR...
- Publication number 20230034445
- Publication date Feb 2, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20230024220
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20230025520
- Publication date Jan 26, 2023
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMPONENT PACKAGING STRUCTURE
- Publication number 20230020236
- Publication date Jan 19, 2023
- PIXART IMAGING Inc.
- YI-CHANG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION DEVICE
- Publication number 20230011488
- Publication date Jan 12, 2023
- Lextar Electronics Corporation
- Ke-Wei LIU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING BASE, PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND SEMICON...
- Publication number 20230009571
- Publication date Jan 12, 2023
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND APPLICATION THEREOF
- Publication number 20230005900
- Publication date Jan 5, 2023
- iReach Corporation
- Hsiu-Ju YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220404548
- Publication date Dec 22, 2022
- Lite-On Technology Corporation
- CHENG-HAN WANG
- H01 - BASIC ELECTRIC ELEMENTS

Containers Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensor

Optoelectronic devices with non-rectangular die shapes

Optically clear thermal spreader for status indication within an el...

Wafer inspection method and wafer

Package structure and method for manufacturing the same

Optoelectronic component having an optical element with different i...

All-in-one integrated multifunctional triple power module

Earphone with proximity sensing function

Semiconductor device

Electronic device comprising an optical chip and method of fabrication

Packaging structure for a sensor having a sealing layer

Image sensor having improved dicing properties

Method for fabricating a detection device comprising a step of dire...

Photodiode package structure with shutters, forming method thereof,...

Optical sensor package with optically transparent mold compound

Solid-state imaging device with uneven structures and method for ma...

Image sensor package and manufacturing method thereof

Optically transparent electromagnetically shielding element compris...

System and methods for managing heat in a photonic integrated circuit

Semiconductor device package and method of manufacturing the same

Chip-scale sensor package structure

Fabrication of thin-film encapsulation layer for light-emitting device

Optical package assembly and mobile terminal

Semiconductor devices and methods of manufacturing semiconductor de...

Cover for an electronic circuit package

Chip package structure, electronic device and method for preparing...

Capping structures for germanium-containing photovoltaic components...

Electronic component including electronic substrate and circuit mem...

Semiconductor device, manufacturing method of semiconductor device,...

Photodetectors and terminators including a tapered thickness

Patents Applicationslast 30 patents

Photodiode and Method for Operating a Photodiode

SYSTEM AND METHODS FOR MANAGING HEAT IN A PHOTONIC INTEGRATED CIRCUIT

WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES

WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES

WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES

FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE

WAVEGUIDE DUAL-DEPLETION REGION (DDR) PHOTODIODES

Component Embedded in Component Carrier and Having an Exposed Side...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

IMAGE SENSOR PACKAGE AND ENDOSCOPE

SENSOR AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...

EARPHONE WITH PROXIMITY SENSING FUNCTION

THIN FILM TRANSISTOR BASED LIGHT SENSOR

COMPLEX SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD

ELECTRONIC COMPONENT INCLUDING ELECTRONIC SUBSTRATE AND CIRCUIT MEM...

LIGHT RECEIVING MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

WIRELESS GAMMA AND/OR HARD X-RAY RADIATION DETECTOR

Semiconductor Device and Method of Making an Optical Semiconductor...

METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR DEVICES AND OPTOE...

ELECTRONIC DEVICE COMPRISING OPTICAL ELECTRONIC COMPONENTS AND FABR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

OPTICAL COMPONENT PACKAGING STRUCTURE

DETECTION DEVICE

WIRING BASE, PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND SEMICON...

CHIP PACKAGE STRUCTURE AND APPLICATION THEREOF

PACKAGE STRUCTURE