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  • H01L31/0203
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L31/0203Containers Encapsulations
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
    • Publication number 20240250221
    • Publication date Jul 25, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Fa Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL ELEMENT DEVICE
    • Publication number 20240243208
    • Publication date Jul 18, 2024
    • Rohm Co., Ltd.
    • Eiji KUWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE PACKAGE
    • Publication number 20240243207
    • Publication date Jul 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Hsiang-Cheng TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL ELEMENT DEVICE
    • Publication number 20240234595
    • Publication date Jul 11, 2024
    • Rohm Co., Ltd.
    • Eiji KUWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRAVIOLET SENSOR
    • Publication number 20240234614
    • Publication date Jul 11, 2024
    • HYPER MATERIALS, INC.
    • Jae Hyuk PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE
    • Publication number 20240222543
    • Publication date Jul 4, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Ying-Chung CHEN
    • G01 - MEASURING TESTING
  • Information Patent Application

    IN-SITU CAP FOR GERMANIUM PHOTODETECTOR
    • Publication number 20240204120
    • Publication date Jun 20, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hao Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
    • Publication number 20240194660
    • Publication date Jun 13, 2024
    • ROHM CO., LTD.
    • Yoshizo OSUMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BIOMEDICAL DETECTION PHOTOELECTRIC MODULE AND MANUFACTURING METHOD...
    • Publication number 20240188857
    • Publication date Jun 13, 2024
    • Taiwan-Asia Semiconductor Corporation
    • Sheng-Wei CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS
    • Publication number 20240178329
    • Publication date May 30, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Masamitsu MATSUURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TWO-PART MOLDING OF DEVICE PACKAGES WITH SPACERS
    • Publication number 20240170357
    • Publication date May 23, 2024
    • NXP USA, Inc.
    • Ankur Shah
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    OPTOCOUPLER
    • Publication number 20240154054
    • Publication date May 9, 2024
    • Taiwan-Asia Semiconductor Corporation
    • Di-Bao WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR DEVICE
    • Publication number 20240145615
    • Publication date May 2, 2024
    • ams-OSRAM International GmbH
    • Tim BOESCKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Light Receiving Device
    • Publication number 20240128385
    • Publication date Apr 18, 2024
    • KYOTO SEMICONDUCTOR CO., LTD.
    • Takatomo ISOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATION MODULE
    • Publication number 20240113239
    • Publication date Apr 4, 2024
    • ROHM CO., LTD.
    • Masahiko ARIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATION MODULE
    • Publication number 20240113238
    • Publication date Apr 4, 2024
    • ROHM CO., LTD.
    • Masahiko ARIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL SENSOR DEVICE AND PACKAGING METHOD THEREOF
    • Publication number 20240113248
    • Publication date Apr 4, 2024
    • OIP Technology Pte Ltd
    • Deze YU
    • G01 - MEASURING TESTING
  • Information Patent Application

    OPTICAL SYSTEM PACKAGING
    • Publication number 20240105861
    • Publication date Mar 28, 2024
    • ams International AG
    • Tiao ZHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING A CAP SUBSTRATE, METHOD FOR MANUFACTURING...
    • Publication number 20240105883
    • Publication date Mar 28, 2024
    • FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
    • Wolfgang REINERT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240096862
    • Publication date Mar 21, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Ying-Chung CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
    • Publication number 20240088307
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT EMITTING DEVICE
    • Publication number 20240079513
    • Publication date Mar 7, 2024
    • Nichia Corporation.
    • Takuya HASHIMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20240072214
    • Publication date Feb 29, 2024
    • STMicroelectronics (Grenoble 2) SAS
    • Olivier ZANELLATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Optical Sensing Apparatus
    • Publication number 20240063322
    • Publication date Feb 22, 2024
    • Artilux, Inc.
    • Huei-Hsiung Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT-EMITTING PHOTOSENSITIVE SENSOR STRUCTURE AND MANUFACTURING ME...
    • Publication number 20240021740
    • Publication date Jan 18, 2024
    • Zhuhai ACCESS Semiconductor Co., Ltd
    • Xianming CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT DETECTION DEVICE
    • Publication number 20240019304
    • Publication date Jan 18, 2024
    • HAMAMATSU PHOTONICS K. K.
    • Masaki HIROSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR COLLECTIVE BENDING OF MICROELECTRONIC COMPONENTS INCLUDI...
    • Publication number 20240021744
    • Publication date Jan 18, 2024
    • Commissariat A L'Energie Atomique et Aux Energies Alternatives
    • David HENRY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOFT SPACERS FOR SHINGLED SOLAR CELL PANELS
    • Publication number 20230402968
    • Publication date Dec 14, 2023
    • Maxeon Solar Pte. Ltd
    • Ruihua LI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PHOTOVOLTAIC CELL AND LAMINATE METALLIZATION
    • Publication number 20230361231
    • Publication date Nov 9, 2023
    • Maxeon Solar Pte. Ltd
    • Gabriel HARLEY
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    OPTOELECTRONIC SEMICONDUCTOR COMPONENT
    • Publication number 20230352617
    • Publication date Nov 2, 2023
    • Osram Opto Semiconductors GmbH
    • Karl Weidner
    • H01 - BASIC ELECTRIC ELEMENTS