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H01L25/165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/165Containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,368,112
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,355,018
- Issue date Jul 8, 2025
- AUO Corporation
- Yi-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor component and arrangement
- Patent number 12,327,803
- Issue date Jun 10, 2025
- Osram Opto Semiconductors GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 12,313,891
- Issue date May 27, 2025
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method of manufacturing the light-emittin...
- Patent number 12,295,190
- Issue date May 6, 2025
- Nichia Corporation
- Shogo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with piezoelectric actuator
- Patent number 12,266,643
- Issue date Apr 1, 2025
- LG Display Co., Ltd.
- Jaeho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,262,519
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system with multiple wiring boards with multiple projecting...
- Patent number 12,243,612
- Issue date Mar 4, 2025
- Kioxia Corporation
- Kenta Iwasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Rigid micro-modules with iLED and light conductor
- Patent number 12,240,262
- Issue date Mar 4, 2025
- X Display Company Technology Limited
- Mark Willner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,205,858
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for attaching optical sensor to image forming apparatus
- Patent number 12,204,265
- Issue date Jan 21, 2025
- Canon Kabushiki Kaisha
- Masayuki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with recessed molding region disposed below h...
- Patent number 12,191,290
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- In-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including bank structures
- Patent number 12,183,726
- Issue date Dec 31, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with at least one light channel and method fo...
- Patent number 12,176,330
- Issue date Dec 24, 2024
- Osram Opto Semiconductors GmbH
- Claus Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233098
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE WITH PIEZOELECTRIC ACTUATOR
- Publication number 20250203296
- Publication date Jun 19, 2025
- LG Display Co., Ltd.
- Jaeho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES
- Publication number 20250201485
- Publication date Jun 19, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS HAVING PIXEL DRIVING CIRCUIT
- Publication number 20250192123
- Publication date Jun 12, 2025
- LG Display Co., Ltd.
- Sung Ju CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250192122
- Publication date Jun 12, 2025
- TXC Corporation
- Shih-Yung Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20250167131
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...
- Publication number 20250167188
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Shougo MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149519
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE
- Publication number 20250140682
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- JIYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY
- Publication number 20250140699
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MODULE, A POWER SUPPLY
- Publication number 20250112555
- Publication date Apr 3, 2025
- LAPIS Technology Co., Ltd.
- Yoshinori YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20250113454
- Publication date Apr 3, 2025
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for manufacturing electronic device
- Publication number 20250107253
- Publication date Mar 27, 2025
- InnoLux Corporation
- Yu-Tsung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20250105121
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Mihoko MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barriers for Selective Exposed Molding of Variable Height Components
- Publication number 20250105228
- Publication date Mar 27, 2025
- Apple Inc.
- Kyusang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...
- Publication number 20250096212
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079421
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250079308
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20250069901
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Tung Yao LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING
- Publication number 20250070042
- Publication date Feb 27, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...
- Publication number 20250070104
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Tomas Reiter
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component and manufacturing method thereof

Double side integration semiconductor package and method of forming...

Semiconductor device and method of making double shielding layers o...

Semiconductor devices and methods of manufacturing

Display panel and display device

Power amplifier module with transistor dies for multiple amplifier...

Optoelectronic semiconductor component and arrangement

Semiconductor device

Thermal management system for multi-chip-module and associated methods

Electronic device

Electronic component module

Capacitor structure and method for forming the same

Semiconductor EMI shielding component, semiconductor package struct...

Light-emitting device and method of manufacturing the light-emittin...

Semiconductor package and method of fabricating same

Semiconductor device and method of manufacturing the same

Display device with piezoelectric actuator

Module

Memory system with multiple wiring boards with multiple projecting...

Rigid micro-modules with iLED and light conductor

Electronic component module

Assembly structure

Electronic component module and method for manufacturing electronic...

Technique for attaching optical sensor to image forming apparatus

Semiconductor package with recessed molding region disposed below h...

Display panel including bank structures

Optoelectronic device with at least one light channel and method fo...

Semiconductor devices and methods of manufacturing

Semiconductor devices and methods of manufacturing semiconductor de...

Sidewall connections and button interconnects for molded SiPs

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

DISPLAY DEVICE WITH PIEZOELECTRIC ACTUATOR

VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES

DISPLAY APPARATUS HAVING PIXEL DRIVING CIRCUIT

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

OPTICAL PACKAGE STRUCTURE

OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...

SEMICONDUCTOR PACKAGE

STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE

INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY

MULTI-DIE MODULE, A POWER SUPPLY

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

ASSEMBLY STRUCTURE

Method for manufacturing electronic device

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...

Barriers for Selective Exposed Molding of Variable Height Components

POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING

POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...