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H01L25/165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/165Containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 12,313,891
- Issue date May 27, 2025
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method of manufacturing the light-emittin...
- Patent number 12,295,190
- Issue date May 6, 2025
- Nichia Corporation
- Shogo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with piezoelectric actuator
- Patent number 12,266,643
- Issue date Apr 1, 2025
- LG Display Co., Ltd.
- Jaeho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,262,519
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system with multiple wiring boards with multiple projecting...
- Patent number 12,243,612
- Issue date Mar 4, 2025
- Kioxia Corporation
- Kenta Iwasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Rigid micro-modules with iLED and light conductor
- Patent number 12,240,262
- Issue date Mar 4, 2025
- X Display Company Technology Limited
- Mark Willner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,205,858
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for attaching optical sensor to image forming apparatus
- Patent number 12,204,265
- Issue date Jan 21, 2025
- Canon Kabushiki Kaisha
- Masayuki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with recessed molding region disposed below h...
- Patent number 12,191,290
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- In-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including bank structures
- Patent number 12,183,726
- Issue date Dec 31, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with at least one light channel and method fo...
- Patent number 12,176,330
- Issue date Dec 24, 2024
- Osram Opto Semiconductors GmbH
- Claus Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting structure
- Patent number 12,094,864
- Issue date Sep 17, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device
- Patent number 12,080,813
- Issue date Sep 3, 2024
- Hamamatsu Photonics K.K.
- Fumitaka Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,051,654
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulating device
- Patent number 12,051,681
- Issue date Jul 30, 2024
- STMicroelectronics (Grenoble 2) SAS
- Deborah Cogoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, package using the same, and method of manufactur...
- Patent number 12,040,266
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hungen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit module having an exposed semiconduc...
- Patent number 12,021,065
- Issue date Jun 25, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20250167131
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...
- Publication number 20250167188
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Shougo MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149519
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE
- Publication number 20250140682
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- JIYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY
- Publication number 20250140699
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MODULE, A POWER SUPPLY
- Publication number 20250112555
- Publication date Apr 3, 2025
- LAPIS Technology Co., Ltd.
- Yoshinori YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20250113454
- Publication date Apr 3, 2025
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for manufacturing electronic device
- Publication number 20250107253
- Publication date Mar 27, 2025
- InnoLux Corporation
- Yu-Tsung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20250105121
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Mihoko MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barriers for Selective Exposed Molding of Variable Height Components
- Publication number 20250105228
- Publication date Mar 27, 2025
- Apple Inc.
- Kyusang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...
- Publication number 20250096212
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079421
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250079308
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20250069901
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Tung Yao LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING
- Publication number 20250070042
- Publication date Feb 27, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...
- Publication number 20250070104
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Tomas Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046769
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015065
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014974
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND
- Publication number 20250006575
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...
- Publication number 20240421139
- Publication date Dec 19, 2024
- Transphorm Technology, Inc.
- Davide Bisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal management system for multi-chip-module and associated methods

Electronic device

Electronic component module

Semiconductor EMI shielding component, semiconductor package struct...

Capacitor structure and method for forming the same

Light-emitting device and method of manufacturing the light-emittin...

Semiconductor package and method of fabricating same

Semiconductor device and method of manufacturing the same

Display device with piezoelectric actuator

Module

Memory system with multiple wiring boards with multiple projecting...

Rigid micro-modules with iLED and light conductor

Electronic component module

Assembly structure

Electronic component module and method for manufacturing electronic...

Technique for attaching optical sensor to image forming apparatus

Semiconductor package with recessed molding region disposed below h...

Display panel including bank structures

Optoelectronic device with at least one light channel and method fo...

Semiconductor devices and methods of manufacturing

Semiconductor devices and methods of manufacturing semiconductor de...

Sidewall connections and button interconnects for molded SiPs

Electronic package with interposer between integrated circuit dies

Light emitting structure

Optical semiconductor device

Semiconductor package aligning interposer and substrate

Package structure and method of fabricating the same

Voltage regulating device

Package substrate, package using the same, and method of manufactur...

Double-sided integrated circuit module having an exposed semiconduc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

OPTICAL PACKAGE STRUCTURE

OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...

SEMICONDUCTOR PACKAGE

STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE

INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY

MULTI-DIE MODULE, A POWER SUPPLY

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

ASSEMBLY STRUCTURE

Method for manufacturing electronic device

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...

Barriers for Selective Exposed Molding of Variable Height Components

POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING

POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...

SEMICONDUCTOR DIE SHIELDING STRUCTURE

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...