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H01L2223/54433

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54433containing identification or tracking information

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Patents Grantslast 30 patents

Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package module comprising shield film on semiconductor device and m...
- Patent number 12,087,701
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable and wire bondable part marking
- Patent number 12,021,038
- Issue date Jun 25, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,955,435
- Issue date Apr 9, 2024
- SK hynix Inc.
- Ki Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 11,908,727
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with fluorescent material, and related...
- Patent number 11,901,304
- Issue date Feb 13, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,804,411
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method of manufacturing the same
- Patent number 11,756,895
- Issue date Sep 12, 2023
- Samsung Display Co., Ltd.
- Dong Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,699,670
- Issue date Jul 11, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure chips with serial numbers
- Patent number 11,688,694
- Issue date Jun 27, 2023
- ASML Netherlands B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure inspection and marking of semiconductor wafers for trusted m...
- Patent number 11,652,009
- Issue date May 16, 2023
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 11,631,608
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchip charge patterning
- Patent number 11,574,876
- Issue date Feb 7, 2023
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for lithographically forming wafer identification marks a...
- Patent number 11,562,968
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with indications of die-specific information
- Patent number 11,532,490
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing laser-marked silicon wafer and laser-marked sil...
- Patent number 11,515,263
- Issue date Nov 29, 2022
- Sumco Corporation
- Yoichiro Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,476,233
- Issue date Oct 18, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 11,398,434
- Issue date Jul 26, 2022
- Mitsubishi Electric Corporation
- Koichiro Kisu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic semiconductor component and method for producing an elec...
- Patent number 11,367,691
- Issue date Jun 21, 2022
- OSRAM OLED GmbH
- Matthias Kiessling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip identification formed by directed self-assembly
- Patent number 11,329,001
- Issue date May 10, 2022
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES
- Publication number 20240324248
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213174
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METH...
- Publication number 20240213176
- Publication date Jun 27, 2024
- Canon Kabushiki Kaisha
- YOSHIHITO TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240194612
- Publication date Jun 13, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sun Kwun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20240186292
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20240178152
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE CHIP STRUCTURE AND METHOD AND SYSTEM FOR DESIGNING THE...
- Publication number 20240105633
- Publication date Mar 28, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Osamu Samuel Nakagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105636
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Kanggyune LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DEVICES AND M...
- Publication number 20240063102
- Publication date Feb 22, 2024
- Samsung Electronics Co.,Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF
- Publication number 20240047369
- Publication date Feb 8, 2024
- AZUREWAVE TECHNOLOGIES, INC.
- CHIH-HAO LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING P...
- Publication number 20240047373
- Publication date Feb 8, 2024
- AZUREWAVE TECHNOLOGIES, INC.
- CHIH-HAO LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND METHOD OF ID...
- Publication number 20240006334
- Publication date Jan 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kazuki WADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230420385
- Publication date Dec 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT...
- Publication number 20230378085
- Publication date Nov 23, 2023
- Exagan SAS
- Matthieu NONGAILLARD
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SECURE CHIPS WITH SERIAL NUMBERS
- Publication number 20230369237
- Publication date Nov 16, 2023
- ASML NETHERLANDS B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20230352422
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Hwee Yin Low
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20230343656
- Publication date Oct 26, 2023
- Changxin Memory Technologies, Inc.
- Qilong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DYNAMICALLY PROVISIONING CYBER TRAINING ENVIRONMENTS
- Publication number 20230335425
- Publication date Oct 19, 2023
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH OVERLAY MARK
- Publication number 20230326868
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- CHUN-YEN WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC CELL, METHOD FOR FORMING SAME, AND PHOTOVOLTAIC MODULE
- Publication number 20230282754
- Publication date Sep 7, 2023
- JINKO SOLAR (HAINING) CO., LTD.
- Nannan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230230933
- Publication date Jul 20, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE TARGETS ON SUBSTRATE LAYERS FOR LAYER ALIGNMENT
- Publication number 20230205104
- Publication date Jun 29, 2023
- Shakul TANDON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCHIP CHARGE PATTERNING
- Publication number 20230187373
- Publication date Jun 15, 2023
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178471
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Takuya SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION
- Publication number 20230121141
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING
- Publication number 20230104665
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

containing identification or tracking information

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aligner apparatus

Method of printing laser mark and method of producing laser-marked...

Package module comprising shield film on semiconductor device and m...

Solderable and wire bondable part marking

Semiconductor packages

Display device having information code on a lateral side of display...

Support substrates, methods of fabricating semiconductor packages u...

Integrated circuit structure with fluorescent material, and related...

Semiconductor device and manufacturing method thereof

Semiconductor package using a coreless signal distribution structure

Chip scale package semiconductor device and method of manufacture

Secure inspection and marking of semiconductor wafers for trusted m...

Electronic apparatus and method of manufacturing the same

Alignment mark design for packages

High-frequency module

Secure chips with serial numbers

Secure inspection and marking of semiconductor wafers for trusted m...

Support substrates, methods of fabricating semiconductor packages u...

Microchip charge patterning

Systems for direct transfer of semiconductor device die

Apparatus for lithographically forming wafer identification marks a...

Semiconductor packages with indications of die-specific information

Direct transfer of semiconductor devices from a substrate

Silicon wafer forming method

Method of producing laser-marked silicon wafer and laser-marked sil...

Method for transfer of semiconductor devices onto glass substrates

Semiconductor package using a coreless signal distribution structure

Semiconductor device, and method for manufacturing semiconductor de...

Electronic semiconductor component and method for producing an elec...

Embedded chip identification formed by directed self-assembly

Patents Applicationslast 30 patents

ENCLOSURE

ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES

SOLDERABLE AND WIRE BONDABLE PART MARKING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METH...

DISPLAY DEVICE

Semiconductor Package Using A Coreless Signal Distribution Structure

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...

WAFER-SCALE CHIP STRUCTURE AND METHOD AND SYSTEM FOR DESIGNING THE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DEVICES AND M...

CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF

CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING P...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND METHOD OF ID...

ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT...

SECURE CHIPS WITH SERIAL NUMBERS

SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

SYSTEM FOR DYNAMICALLY PROVISIONING CYBER TRAINING ENVIRONMENTS

SEMICONDUCTOR DEVICE STRUCTURE WITH OVERLAY MARK

PHOTOVOLTAIC CELL, METHOD FOR FORMING SAME, AND PHOTOVOLTAIC MODULE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MULTIPLE TARGETS ON SUBSTRATE LAYERS FOR LAYER ALIGNMENT

MODULE

MICROCHIP CHARGE PATTERNING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION

SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING