Continuous flow

Industry

CPC
H01L2224/11312

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11312Continuous flow

Industries

Patents Grantslast 30 patents

Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,664,297
- Issue date May 30, 2023
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,127,658
- Issue date Sep 21, 2021
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid discharge device
- Patent number 10,932,372
- Issue date Feb 23, 2021
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including redistribution layers
- Patent number 10,818,536
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for correcting solder bump
- Patent number 10,681,822
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid discharge device, fluid discharge method, and fluid applicati...
- Patent number 10,632,492
- Issue date Apr 28, 2020
- Senju Metal Industry Co., Ltd.
- Takashi Nauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package structures including redistribution layers
- Patent number 10,566,229
- Issue date Feb 18, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,566,302
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system and method of making the integrated system
- Patent number 10,224,317
- Issue date Mar 5, 2019
- Infineon Technologies AG
- Thomas Kilger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Direct injection molded solder process for forming solder bumps on...
- Patent number 10,147,694
- Issue date Dec 4, 2018
- GLOBALFOUNDRIES Inc.
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
- Publication number 20240332234
- Publication date Oct 3, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- KEIKO IKUTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...
- Publication number 20210366809
- Publication date Nov 25, 2021
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20200168497
- Publication date May 28, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
- Publication number 20190096837
- Publication date Mar 28, 2019
- NANYA TECHNOLOGY CORPORATION
- PO CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180269173
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20180190531
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138139
- Publication date May 17, 2018
- NANYA TECHNOLOGY CORPORATION
- PO CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180108631
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180108630
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180082967
- Publication date Mar 22, 2018
- NANYA TECHNOLOGY CORPORATION
- PO CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20180082973
- Publication date Mar 22, 2018
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...
- Publication number 20180021803
- Publication date Jan 25, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Takashi NAUCHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Integrated System and Method of Making the Integrated System
- Publication number 20170278836
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...
- Publication number 20160118358
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES INC.
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150097286
- Publication date Apr 9, 2015
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER POST SOLDER BUMPS ON SUBSTRATES
- Publication number 20150031173
- Publication date Jan 29, 2015
- International Bushiness Machines Corporation
- Jae-Woong NAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Post Solder Bumps on Substrates
- Publication number 20140370662
- Publication date Dec 18, 2014
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...
- Publication number 20140264845
- Publication date Sep 18, 2014
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS

Continuous flow

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Injection molded solder head with improved sealing performance

Industrial chip scale package for microelectronic device

Manufacturing method for reflowed solder balls and their under bump...

Method for discharging fluid

Manufacturing method for reflowed solder balls and their under bump...

Assembly comprising hybrid interconnecting means including intermed...

Fluid discharge device

Method of forming a solder bump structure

Microelectronic devices including redistribution layers

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Fabrication of solder balls with injection molded solder

Wafer level flat no-lead semiconductor packages and methods of manu...

Method of forming a solder bump structure

Engineered polymer-based electronic materials

Integrated circuit system with carrier construction configuration a...

Method for correcting solder bump

Semiconductor chip, method for manufacturing semiconductor chip, in...

Expanded head pillar for bump bonds

Fluid discharge device, fluid discharge method, and fluid applicati...

Injection molded solder bumping

Method of forming a solder bump structure

Microelectronic package structures including redistribution layers

Fabrication of solder balls with injection molded solder

Wafer level flat no-lead semiconductor packages and methods of manu...

Integrated system and method of making the integrated system

Method of manufacturing electronic component module and electronic...

Direct injection molded solder process for forming solder bumps on...

Chip mounting structure

Method for manufacturing metal powder

Patents Applicationslast 30 patents

BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...

EXPANDED HEAD PILLAR FOR BUMP BONDS

MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS

METHOD OF FORMING A SOLDER BUMP STRUCTURE

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BONDING METHOD AND BONDED BODY

CHIP MOUNTING STRUCTURE

FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...

Integrated System and Method of Making the Integrated System

DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

COPPER POST SOLDER BUMPS ON SUBSTRATES

Copper Post Solder Bumps on Substrates

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...