Control means for lapping machines or devices

Industry

CPC
B24B37/005

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/005Control means for lapping machines or devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Control of processing parameters during substrate polishing using e...
- Patent number 11,969,854
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioner, chemical mechanical polishing apparatus including the...
- Patent number 11,964,357
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Seungchul Han
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus having surface-property measuring device of pol...
- Patent number 11,958,161
- Issue date Apr 16, 2024
- Ebara Corporation
- Keisuke Kamiki
- B24 - GRINDING POLISHING
Information Patent Grant
Zone-based CMP target control
- Patent number 11,951,587
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Liang Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 11,951,589
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Method of evaluating silicon wafer, method of evaluating silicon wa...
- Patent number 11,948,819
- Issue date Apr 2, 2024
- Sumco Corporation
- Keiichiro Mori
- B24 - GRINDING POLISHING
Information Patent Grant
Dual membrane carrier head for chemical mechanical polishing
- Patent number 11,945,073
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Control method of grinding water flow rate during double side grind...
- Patent number 11,938,588
- Issue date Mar 26, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Chien-Ming Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Control of processing parameters for substrate polishing with angul...
- Patent number 11,931,853
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,931,854
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Slider with bond pad arrangements
- Patent number 11,935,569
- Issue date Mar 19, 2024
- Seagate Technology LLC
- James Gary Wessel
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for polishing and method of polishing
- Patent number 11,926,018
- Issue date Mar 12, 2024
- Ebara Corporation
- Masayoshi Ito
- B24 - GRINDING POLISHING
Information Patent Grant
Control of processing parameters during substrate polishing using c...
- Patent number 11,919,121
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with contactless platen edge control
- Patent number 11,919,120
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- David J. Lischka
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 11,911,868
- Issue date Feb 27, 2024
- Ebara Corporation
- Takashi Mitsuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,911,867
- Issue date Feb 27, 2024
- Ebara Corporation
- Toshifumi Kimba
- G01 - MEASURING TESTING
Information Patent Grant
Substrate polishing apparatus with contact extension or adjustable...
- Patent number 11,904,429
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Leak detection system and inspection method for the system
- Patent number 11,898,940
- Issue date Feb 13, 2024
- Ebara Corporation
- Toru Maruyama
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,897,077
- Issue date Feb 13, 2024
- Kioxia Corporation
- Tsutomu Miki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus, information processing system, polishing metho...
- Patent number 11,897,078
- Issue date Feb 13, 2024
- Ebara Corporation
- Akira Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing unit, substrate processing apparatus, and polishing method
- Patent number 11,890,716
- Issue date Feb 6, 2024
- Ebara Corporation
- Akihiro Yazawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing carrier head with piezoelectric pressure control
- Patent number 11,890,715
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing silicon wafer
- Patent number 11,890,719
- Issue date Feb 6, 2024
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing slurry buildup monitoring
- Patent number 11,890,722
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Thomas Ho Fai Li
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,883,922
- Issue date Jan 30, 2024
- Ebara Corporation
- Yuki Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided polishing apparatus
- Patent number 11,883,924
- Issue date Jan 30, 2024
- Fujikoshi Machinery Corp.
- Masashi Maruta
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,883,923
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Profile control with multiple instances of contol algorithm during...
- Patent number 11,865,664
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Switching control algorithms on detection of exposure of underlying...
- Patent number 11,850,699
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC CARRIER HEAD MONITORING
- Publication number 20240139900
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...
- Publication number 20240123566
- Publication date Apr 18, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION FOR SLURRY COMPOSITION IN IN-SITU ELECTROMAGNETIC INDU...
- Publication number 20240123565
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240116151
- Publication date Apr 11, 2024
- EBARA CORPORATION
- MASAYOSHI ITO
- B24 - GRINDING POLISHING
Information Patent Application
SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...
- Publication number 20240116152
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APP...
- Publication number 20240082982
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Toshiki MIYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE PROPERTY MEASURING APPARATUS FOR POLISHING PAD, SURFACE PRO...
- Publication number 20240075579
- Publication date Mar 7, 2024
- EBARA CORPORATION
- Kohei OHSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD
- Publication number 20240075583
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
SMART MANUFACTURING SOLUTIONS FOR WASTEWATER TREATMENT
- Publication number 20240077890
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Maxime CAYER
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL METHOD, CONTROL APPARATUS, TRAINING METHOD, AND TRAINING AP...
- Publication number 20240066657
- Publication date Feb 29, 2024
- KCTECH CO., LTD.
- Ji Hoon SON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING HEAD SYSTEM AND POLISHING METHOD
- Publication number 20240066658
- Publication date Feb 29, 2024
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POL...
- Publication number 20240051079
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyoung Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240042574
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240025007
- Publication date Jan 25, 2024
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF PROCESSING PARAMETERS DURING SUBSTRATE POLISHING USING C...
- Publication number 20240009796
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Application
Double-Sided Polishing Apparatus
- Publication number 20230415298
- Publication date Dec 28, 2023
- Fujikoshi Machinery Corp.
- Masashi MARUTA
- B24 - GRINDING POLISHING
Information Patent Application
BARRIER DEVICE USED IN THE MANUFACTURE OF A LAPPING PLATE, AND RELA...
- Publication number 20230405757
- Publication date Dec 21, 2023
- SEAGATE TECHNOLOGY LLC
- Chea Phann
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ZONES
- Publication number 20230405758
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
DETERMINING SUBSTRATE ORIENTATION WITH ACOUSTIC SIGNALS
- Publication number 20230390884
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230390882
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC MONITORING OF CMP RETAINING RING
- Publication number 20230390883
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Haoquan Fang
- B24 - GRINDING POLISHING
Information Patent Application
DETERMINING SUBSTRATE PRECESSION WITH ACOUSTIC SIGNALS
- Publication number 20230390885
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING AND METHOD OF POLISHING
- Publication number 20230381916
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20230381918
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR ESTIMATING LIFE OF POLISHING PAD AND POLISHING DEVICE
- Publication number 20230381910
- Publication date Nov 30, 2023
- EBARA CORPORATION
- KENICHIRO SAITO
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER MEASUREMENT DEVICE, CARRIER MEASUREMENT METHOD, AND CARRIER...
- Publication number 20230384077
- Publication date Nov 30, 2023
- SUMCO CORPORATION
- Hiroshi TAKAI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER THINNING METHOD HAVING FEEDBACK CONTROL
- Publication number 20230360919
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND METHOD OF DETERMINING A TIME TO REPLACE POL...
- Publication number 20230356350
- Publication date Nov 9, 2023
- EBARA CORPORATION
- Yuta SUZUKI
- B24 - GRINDING POLISHING

Control means for lapping machines or devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Control of processing parameters during substrate polishing using e...

Conditioner, chemical mechanical polishing apparatus including the...

Polishing apparatus having surface-property measuring device of pol...

Zone-based CMP target control

Wafer edge asymmetry correction using groove in polishing pad

Method of evaluating silicon wafer, method of evaluating silicon wa...

Dual membrane carrier head for chemical mechanical polishing

Control method of grinding water flow rate during double side grind...

Control of processing parameters for substrate polishing with angul...

Chemical mechanical polishing using time share control

Slider with bond pad arrangements

Apparatus for polishing and method of polishing

Control of processing parameters during substrate polishing using c...

Polishing system with contactless platen edge control

Substrate processing apparatus, substrate processing method, and st...

Polishing apparatus and polishing method

Substrate polishing apparatus with contact extension or adjustable...

Leak detection system and inspection method for the system

Semiconductor manufacturing apparatus

Polishing apparatus, information processing system, polishing metho...

Polishing unit, substrate processing apparatus, and polishing method

Polishing carrier head with piezoelectric pressure control

Method of polishing silicon wafer

Chemical mechanical polishing slurry buildup monitoring

Substrate processing apparatus

Double-sided polishing apparatus

Chemical mechanical polishing using time share control

Polishing apparatus

Profile control with multiple instances of contol algorithm during...

Switching control algorithms on detection of exposure of underlying...

Patents Applicationslast 30 patents

ACOUSTIC CARRIER HEAD MONITORING

PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...

COMPENSATION FOR SLURRY COMPOSITION IN IN-SITU ELECTROMAGNETIC INDU...

POLISHING APPARATUS

SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...

POLISHING APPARATUS

PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APP...

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

SURFACE PROPERTY MEASURING APPARATUS FOR POLISHING PAD, SURFACE PRO...

WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD

SMART MANUFACTURING SOLUTIONS FOR WASTEWATER TREATMENT

CONTROL METHOD, CONTROL APPARATUS, TRAINING METHOD, AND TRAINING AP...

POLISHING HEAD SYSTEM AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POL...

DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING

POLISHING METHOD AND POLISHING APPARATUS

CONTROL OF PROCESSING PARAMETERS DURING SUBSTRATE POLISHING USING C...

Double-Sided Polishing Apparatus

BARRIER DEVICE USED IN THE MANUFACTURE OF A LAPPING PLATE, AND RELA...

POLISHING CARRIER HEAD WITH MULTIPLE ZONES

DETERMINING SUBSTRATE ORIENTATION WITH ACOUSTIC SIGNALS

SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING

ACOUSTIC MONITORING OF CMP RETAINING RING

DETERMINING SUBSTRATE PRECESSION WITH ACOUSTIC SIGNALS

APPARATUS FOR POLISHING AND METHOD OF POLISHING

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

METHOD FOR ESTIMATING LIFE OF POLISHING PAD AND POLISHING DEVICE

CARRIER MEASUREMENT DEVICE, CARRIER MEASUREMENT METHOD, AND CARRIER...

WAFER THINNING METHOD HAVING FEEDBACK CONTROL

POLISHING APPARATUS AND METHOD OF DETERMINING A TIME TO REPLACE POL...