Controlling internal stress of deposited layers

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B81C2201/0163

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

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B81C2201/0163Controlling internal stress of deposited layers

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,708,262
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,267,693
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a remote-controlled micro-scale three-dimen...
- Patent number 10,821,565
- Issue date Nov 3, 2020
- Regents of The University of Minnesota
- Chao Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods to apply stress engineering to self-aligned m...
- Patent number 10,734,228
- Issue date Aug 4, 2020
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MECHANICALLY COUPLED PIEZOELECTRIC MEMS MICROPHONE
- Publication number 20230303387
- Publication date Sep 28, 2023
- Skyworks Solutions, Inc.
- Siarhei Dmitrievich Barsukou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220185656
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HSIEN CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY