Converter

Industry

CPC
H01L2924/1425

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1425Converter

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Heterogenous integration scheme for III-V/Si and Si CMOS integrated...
- Patent number 12,355,024
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced electronic packages for GaN power integrated cir...
- Patent number 12,334,421
- Issue date Jun 17, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device and method of operating the same
- Patent number 12,293,987
- Issue date May 6, 2025
- Realtek Semiconductor Corporation
- Chih-Chiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device isolation package
- Patent number 12,027,572
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,828
- Issue date Apr 16, 2024
- Denso Corporation
- Nobuyuki Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,929,354
- Issue date Mar 12, 2024
- Fuji Electric Co., Ltd.
- Masanari Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus
- Patent number 11,923,262
- Issue date Mar 5, 2024
- Denso Corporation
- Yasushi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device, power conversion device, and method for manuf...
- Patent number 11,830,795
- Issue date Nov 28, 2023
- Mitsubishi Electric Corporation
- Yuji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,798,870
- Issue date Oct 24, 2023
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure applied to power converter
- Patent number 11,742,268
- Issue date Aug 29, 2023
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Chiqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor module and method of manufacturing the same
- Patent number 11,722,800
- Issue date Aug 8, 2023
- Sony Group Corporation
- Shin Iwabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated half-bridge power converter
- Patent number 11,715,720
- Issue date Aug 1, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display pixels with integrated pipeline
- Patent number 11,699,383
- Issue date Jul 11, 2023
- Tectus Corporation
- Paul Scott Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated pillar dies having integrated electromagnetic shield layers
- Patent number 11,694,970
- Issue date Jul 4, 2023
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 11,621,232
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 11,621,230
- Issue date Apr 4, 2023
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral inductors
- Patent number 11,616,014
- Issue date Mar 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,610,873
- Issue date Mar 21, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 11,538,725
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Daniel Domes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, power module and power supply
- Patent number 11,387,160
- Issue date Jul 12, 2022
- Rohm Co., Ltd.
- Keisuke Wakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,656
- Issue date Jul 5, 2022
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...
- Publication number 20250201766
- Publication date Jun 19, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250149457
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yu HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140765
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...
- Publication number 20250067942
- Publication date Feb 27, 2025
- Lightmatter, Inc
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...
- Publication number 20250029958
- Publication date Jan 23, 2025
- NUVOTON TECHNOLOGY CORPORATION
- Chih-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395790
- Publication date Nov 28, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Andy HEINIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...
- Publication number 20240387501
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240312878
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Hiroaki AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243100
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071900
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240055360
- Publication date Feb 15, 2024
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...
- Publication number 20240014126
- Publication date Jan 11, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Lin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE DIES
- Publication number 20230420380
- Publication date Dec 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HALF-BRIDGE POWER CONVERTER
- Publication number 20230387067
- Publication date Nov 30, 2023
- Navitas Semiconductor Limited
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343700
- Publication date Oct 26, 2023
- RENESAS ELECTRONICS CORPORATION
- Nobuhito SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS
- Publication number 20230326890
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...
- Publication number 20230317537
- Publication date Oct 5, 2023
- STMicroelectronics S.r.l.
- Sergio SAVINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230299046
- Publication date Sep 21, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- Chih-Chiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20230245982
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION DEVICE, POWER DISTRIBUTION SYSTEM AND MANUFACTUR...
- Publication number 20230223370
- Publication date Jul 13, 2023
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated...
- Publication number 20230154912
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE
- Publication number 20230094556
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...
- Publication number 20230082556
- Publication date Mar 16, 2023
- Canon Kabushiki Kaisha
- Masayoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20220415867
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20220352087
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogenous integration scheme for III-V/Si and Si CMOS integrated...

Thermally enhanced electronic packages for GaN power integrated cir...

Electronic package device and method of operating the same

Microelectronic assemblies having conductive structures with differ...

Electrical devices and methods of manufacture

Semiconductor package with electromagnetic interference shielding

Integrated semiconductor device isolation package

Semiconductor device

Power semiconductor module

Electrical apparatus

Power module apparatus, cooling structure, and electric vehicle or...

Semiconductor device, power conversion device, and method for manuf...

Semiconductor device

Semiconductor device

Package structure applied to power converter

Semiconductor image sensor module and method of manufacturing the same

Integrated half-bridge power converter

Semiconductor device

Display pixels with integrated pipeline

Plated pillar dies having integrated electromagnetic shield layers

Semiconductor package having a lead frame including die paddles and...

Method of manufacturing semiconductor having double-sided substrate

Semiconductor package with electromagnetic interference shielding

Electrical devices and methods of manufacture

Peripheral inductors

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module arrangement

Coupling of integrated circuits (ICS) through a passivation-defined...

Semiconductor apparatus, power module and power supply

Semiconductor device

Patents Applicationslast 30 patents

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...

ELECTRONIC DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...

PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...

SEMICONDUCTOR DEVICE

HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CAPACITIVE COUPLING PACKAGE STRUCTURE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...

SEMICONDUCTOR DEVICE WITH MULTIPLE DIES

SEMICONDUCTOR DEVICE

INTEGRATED HALF-BRIDGE POWER CONVERTER

SEMICONDUCTOR DEVICE

3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS

POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR...

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

ELECTRONIC PACKAGE DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

POWER DISTRIBUTION DEVICE, POWER DISTRIBUTION SYSTEM AND MANUFACTUR...

Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated...

INTEGRATED SEMICONDUCTOR DEVICE ISOLATION PACKAGE

DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...

MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING