Cooling by change of state

Industry

CPC
H01L23/427

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/427Cooling by change of state

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for a semiconductor package
- Patent number 12,315,781
- Issue date May 27, 2025
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,298,082
- Issue date May 13, 2025
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member
- Patent number 12,292,238
- Issue date May 6, 2025
- Kyocera Corporation
- Yuichi Abe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase immersion-cooling heat-dissipation composite structure ha...
- Patent number 12,289,865
- Issue date Apr 29, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Compliant thermal management devices, systems, and methods of fabri...
- Patent number 12,262,509
- Issue date Mar 25, 2025
- Georgios Karamanis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator module and method of manufacturing the same
- Patent number 12,261,096
- Issue date Mar 25, 2025
- Denso Corporation
- Shinya Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material (PCM)-based conductive thermal actuator switc...
- Patent number 12,258,948
- Issue date Mar 25, 2025
- Raytheon Company
- Andrew J. Pitts
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module with thermal storage
- Patent number 12,237,243
- Issue date Feb 25, 2025
- GE Aviation Systems LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-transfer member and cooling system
- Patent number 12,222,166
- Issue date Feb 11, 2025
- Kyushu University, National University Corporation
- Yasuyuki Takata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for electrically decoupled, homogeneous temperature control...
- Patent number 12,198,907
- Issue date Jan 14, 2025
- Meyer Burger (Germany) GmbH
- Christian Böhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 12,188,732
- Issue date Jan 7, 2025
- The Regents of the University of Colorado
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated cooling assemblies including signal redistribution and m...
- Patent number 12,191,235
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 12,173,966
- Issue date Dec 24, 2024
- Fujitsu Limited
- Hideo Kubo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250157879
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...
- Publication number 20250157878
- Publication date May 15, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157880
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Fusanori NISHIKIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING
- Publication number 20250157881
- Publication date May 15, 2025
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...
- Publication number 20250149403
- Publication date May 8, 2025
- Wistron Corporation
- Tung-Yang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20250140697
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE
- Publication number 20250123058
- Publication date Apr 17, 2025
- ThermAvant Technologies, LLC
- Lily Ellebracht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INVERTED MEMORY STACK
- Publication number 20250125220
- Publication date Apr 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID HEAT SINK
- Publication number 20250118627
- Publication date Apr 10, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Hans Knauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250105093
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Daehyuk SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAK-PROOF HEAT DISSIPATION STRUCTURE OF HIGH THERMAL CONDUCTIVITY...
- Publication number 20250079260
- Publication date Mar 6, 2025
- CCHUAN CO., LTD.
- Cheng-Hsiung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...
- Publication number 20250079262
- Publication date Mar 6, 2025
- Intel Corporation
- Sami Mohammed Alelyani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Vapor Chamber for Heat Dissipation in Electronic Devices
- Publication number 20250062187
- Publication date Feb 20, 2025
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250062241
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250063700
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING AN IRON SLURRY IN SEMICONDUCTOR ASSEMBLY
- Publication number 20250054835
- Publication date Feb 13, 2025
- LENOVO (SINGAPORE) PTE. LTD.
- Mark Summerville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20250038066
- Publication date Jan 30, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Publication number 20250006588
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT RADIATION DEVICES
- Publication number 20240413053
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL

Cooling by change of state

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vapor chamber heat spreader for bare die processors

Heat spreader for a semiconductor package

Semiconductor device and manufacturing method thereof

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heat dissipation member

Two-phase immersion-cooling heat-dissipation composite structure ha...

Chip cooling platform based on micro-nano structure

Heatsink for co-packaged optical switch rack package

Compliant thermal management devices, systems, and methods of fabri...

Radiator module and method of manufacturing the same

Phase change material (PCM)-based conductive thermal actuator switc...

Heat sinks with beyond-board fins

Thermal management in integrated circuit packages

Power overlay module with thermal storage

Heat-transfer member and cooling system

Substrate, electronic device, and method for manufacturing substrate

Low-noise heat exchanger

Housing comprising a composite wall integrating at least one coolin...

System for electrically decoupled, homogeneous temperature control...

Electronic device with heat-conductive cover

Package structure

Single and multi-layer mesh structures for enhanced thermal transport

Integrated cooling assemblies including signal redistribution and m...

Integrated cooling assemblies for advanced device packaging and met...

Embedded cooling assemblies for advanced device packaging and metho...

Cooling device

Vapor chamber and manufacturing method of the same

High speed network device with orthogonal pluggable optics modules

Heat dissipation device assembly

Alignment mechanism

Patents Applicationslast 30 patents

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR APPARATUS

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...

POWER CONVERSION DEVICE

OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING

HEAT DISSIPATION DEVICE

COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...

HEAT DISSIPATION BY NANO PIPES

INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER

MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE

INVERTED MEMORY STACK

HYBRID HEAT SINK

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

Power, Signaling and Thermal Path Co-optimization

COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING PACKAGE STRUCTURE

LEAK-PROOF HEAT DISSIPATION STRUCTURE OF HIGH THERMAL CONDUCTIVITY...

METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...

Direct Vapor Chamber for Heat Dissipation in Electronic Devices

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

OPTIMIZED CHIP COOLING INFRASTRUCTURE

CONTROLLING AN IRON SLURRY IN SEMICONDUCTOR ASSEMBLY

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

COOLING SYSTEM BLOCK ASSEMBLY

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

HEAT RADIATION DEVICES

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...