Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device assemblies having an electrically insulatin...
- Patent number 12,249,554
- Issue date Mar 11, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor device assemblies and systems with imp...
- Patent number 12,243,801
- Issue date Mar 4, 2025
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, method of manufacturing the same, and s...
- Patent number 12,243,803
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with submount includi...
- Patent number 12,243,796
- Issue date Mar 4, 2025
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly, and ceramic circuit substrate and semiconductor de...
- Patent number 12,240,218
- Issue date Mar 4, 2025
- Kabushiki Kaisha Toshiba
- Shota Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a thermal interface materia...
- Patent number 12,237,242
- Issue date Feb 25, 2025
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive structure for thermal regulation and optimization
- Patent number 12,224,223
- Issue date Feb 11, 2025
- Raytheon Company
- Edward L. Hieb
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface material containment
- Patent number 12,218,031
- Issue date Feb 4, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat dissipation member and method of manufacturing the same
- Patent number 12,213,286
- Issue date Jan 28, 2025
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal member and production method therefor
- Patent number 12,209,313
- Issue date Jan 28, 2025
- NGK Electronics Devices, Inc.
- Shigeru Yoshimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250079347
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Samir Mouhoubi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
- Publication number 20250079246
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250079258
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
- Publication number 20250079259
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE
- Publication number 20250079188
- Publication date Mar 6, 2025
- Texas State University
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE GRAPHENE PAD BORDERED WITH PROTECTIVE FILM AND...
- Publication number 20250079256
- Publication date Mar 6, 2025
- Suzhou Nanyi Technology Co., LTD
- Nan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250079274
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Han Jin DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE AND ASSEMBLY METHOD
- Publication number 20250079407
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...
- Publication number 20250079252
- Publication date Mar 6, 2025
- AMOGREENTECH CO., LTD.
- In Yong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250079257
- Publication date Mar 6, 2025
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...
- Publication number 20250073826
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Shota YAMAMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...
- Publication number 20250079353
- Publication date Mar 6, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY SUBSTRATE
- Publication number 20250079187
- Publication date Mar 6, 2025
- Phononics Ltd
- Shaul Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY
- Publication number 20250069984
- Publication date Feb 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...
- Publication number 20250070102
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250069983
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069986
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- So TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...
- Publication number 20250069987
- Publication date Feb 27, 2025
- Arieca Inc.
- Navid Kazem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A HEAT SPREADER, AND AN ELECTRONIC MODULE
- Publication number 20250071945
- Publication date Feb 27, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ingelhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL
- Publication number 20250069985
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20250069992
- Publication date Feb 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...
- Publication number 20250069982
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062180
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Hiroshi UKEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062184
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY
- Publication number 20250062182
- Publication date Feb 20, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Emil NYLANDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package including a thermal conductive layer a...

Bonded substrate and bonded substrate manufacturing method

Power electronic device assemblies having an electrically insulatin...

Semiconductor device, semiconductor system, moving body, and method...

Substrates for semiconductor device assemblies and systems with imp...

Thermal interface material, method of manufacturing the same, and s...

Semiconductor package

Method for manufacturing semiconductor device with submount includi...

Bonded assembly, and ceramic circuit substrate and semiconductor de...

Methods and heat distribution devices for thermal management of chi...

Semiconductor device package comprising a thermal interface materia...

Electronics assemblies employing copper in multiple locations

Chip-on-film package and display apparatus including the same

Semiconductor package and related methods

Semiconductor circuit structure with direct die heat removal structure

Adaptive structure for thermal regulation and optimization

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Semiconductor packages with increased power handling

Package structure with metallic layer over the surfaces of a plural...

Venturi-effect heat-transfer device

Thermal interface material containment

Electronic device

Semiconductor apparatus and manufacturing method thereof, and three...

Package structure for heat dissipation

Semiconductor device with improved performance in operation and imp...

Systems and methods for integrated gate driver for inverter for ele...

Heat dissipation member and method of manufacturing the same

Group III nitride based depletion mode differential amplifiers and...

Metal member and production method therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE

THERMALLY CONDUCTIVE GRAPHENE PAD BORDERED WITH PROTECTIVE FILM AND...

POWER MODULE

POWER MODULE AND POWER CONVERSION APPARATUS

POWER ELECTRONICS MODULE AND ASSEMBLY METHOD

INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...

GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...

POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...

HIGH THERMAL CONDUCTIVITY SUBSTRATE

POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY

POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...

A HEAT SPREADER, AND AN ELECTRONIC MODULE

3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY

SEMICONDUCTOR PACKAGE