Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,545
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-chip device and method of formation
- Patent number 11,967,582
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power conversion device, and manufacturing me...
- Patent number 11,961,780
- Issue date Apr 16, 2024
- Hitachi Astemo, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
- Patent number 11,961,837
- Issue date Apr 16, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Srabanti Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 11,961,783
- Issue date Apr 16, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hitoshi Okano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including thermal interface structures and me...
- Patent number 11,955,405
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,955,399
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header for semiconductor package and semiconductor package
- Patent number 11,955,403
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and heat dissipation structure thereof, comprisi...
- Patent number 11,955,404
- Issue date Apr 9, 2024
- AURAS TECHNOLOGY CO., LTD.
- Jian-Dih Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity boron arsenide for thermal management, el...
- Patent number 11,948,858
- Issue date Apr 2, 2024
- The Regents of the University of California
- Yongjie Hu
- C30 - CRYSTAL GROWTH
Information Patent Grant
Surface-modified inorganic nitride, composition, thermally conducti...
- Patent number 11,945,718
- Issue date Apr 2, 2024
- FUJIFILM Corporation
- Seiichi Hitomi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,948,830
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for an electronic component
- Patent number 11,948,856
- Issue date Apr 2, 2024
- Siemens Aktiengesellschaft
- Daniel Reznik
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite thermal interface materials and associated devices, syste...
- Patent number 11,943,899
- Issue date Mar 26, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal insulation
- Patent number 11,942,393
- Issue date Mar 26, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar transistor with thermal conductor
- Patent number 11,942,534
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device module with dummy pad die layout
- Patent number 11,935,817
- Issue date Mar 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having thermal dissipation structure therein and...
- Patent number 11,935,760
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240136319
- Publication date Apr 25, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20240136248
- Publication date Apr 25, 2024
- SAFRAN ELECTRICAL & POWER
- Benoit Michaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20240136244
- Publication date Apr 25, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240136250
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Yeonho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240136249
- Publication date Apr 25, 2024
- DOWA METALTECH CO., LTD.
- Koji KOBAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240128153
- Publication date Apr 18, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240128093
- Publication date Apr 18, 2024
- ASUSTek COMPUTER INC.
- Xu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240120249
- Publication date Apr 11, 2024
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...
- Publication number 20240121901
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240120263
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120269
- Publication date Apr 11, 2024
- Hyundai Motor Company
- Kyoung Kook HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATING HEAT SPREADER
- Publication number 20240120705
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112982
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- HIROFUMI MAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240112978
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Vikas GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Substrate
- Publication number 20240112979
- Publication date Apr 4, 2024
- Solid-tech Co., Ltd.
- Tzu Chien HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY
- Publication number 20240112977
- Publication date Apr 4, 2024
- LITTELFUSE, INC.
- Rhodri Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- Publication number 20240113081
- Publication date Apr 4, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240105541
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20240105543
- Publication date Mar 28, 2024
- Hitachi, Ltd
- Hiroshi Kamizuma
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Semiconductor package having improved thermal interface between sem...

Heat dissipation sheet, manufacturing method of heat dissipation sh...

Multi-chip device and method of formation

Power semiconductor device

Method for manufacturing a semiconductor substrate and device by bo...

Integration of semiconductor device assemblies with thermal dissipa...

Semiconductor module, power conversion device, and manufacturing me...

RF devices with nanotube particles for enhanced performance and met...

Semiconductor apparatuses and methods involving diamond and GaN-bas...

Semiconductor apparatus and electronic apparatus

Semiconductor package including thermal interface structures and me...

Semiconductor package

Header for semiconductor package and semiconductor package

Semiconductor device

Semiconductor device

Electronic package and heat dissipation structure thereof, comprisi...

High-power die heat sink

High thermal conductivity boron arsenide for thermal management, el...

Surface-modified inorganic nitride, composition, thermally conducti...

RF devices with enhanced performance and methods of forming the sam...

Heat sink for an electronic component

Semiconductor device with thermal release layer and method for fabr...

Composite thermal interface materials and associated devices, syste...

Substrate with thermal insulation

Bipolar transistor with thermal conductor

Power device module with dummy pad die layout

Switching device and electronic circuit

Package structure having thermal dissipation structure therein and...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

POWER ELECTRONICS MODULE

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

HYBRID CHIP CARRIER PACKAGE

MANUFACTURING METHOD OF ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

SEMICONDUCTOR MODULE

EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...

INTEGRATED SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

POWER MODULE AND MANUFACTURING METHOD THEREOF

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

ISOLATING HEAT SPREADER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE

Carrier Substrate

ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY

SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

POWER CONVERSION APPARATUS