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Liquid cooling device for memory module
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Publication number 20240145333
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Publication date May 2, 2024
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Celestica Technology Consultancy (Shanghai) Co. Ltd.
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Mingqing LUO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145330
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Publication date May 2, 2024
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Mitsubishi Electric Corporation
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Yuji IWAI
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H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR MODULE
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Publication number 20240145331
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Publication date May 2, 2024
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HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
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Hitoshi NISHIMORI
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H01 - BASIC ELECTRIC ELEMENTS
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POWER ELECTRONICS MODULE
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Publication number 20240136248
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Publication date Apr 25, 2024
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SAFRAN ELECTRICAL & POWER
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Benoit Michaud
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H01 - BASIC ELECTRIC ELEMENTS
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WAFER ALIGNMENT STRUCTURE
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Publication number 20240136303
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Publication date Apr 25, 2024
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Tesla, Inc.
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Yong guo Li
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H01 - BASIC ELECTRIC ELEMENTS
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QUANTUM DEVICE
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Publication number 20240136274
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Publication date Apr 25, 2024
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NEC Corporation
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Katsumi KIKUCHI
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G06 - COMPUTING CALCULATING COUNTING
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SEMICONDUCTOR MODULE
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Publication number 20240136343
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Publication date Apr 25, 2024
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ROBERT BOSCH GmbH
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Felix Stewing
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H01 - BASIC ELECTRIC ELEMENTS
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CIRCUIT MODULE
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Publication number 20240138052
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Publication date Apr 25, 2024
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Murata Manufacturing Co., Ltd.
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Yoshihito OTSUBO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240128174
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Choongbin Yim
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240128147
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Sey-Ping SUN
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H01 - BASIC ELECTRIC ELEMENTS
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