Cooling facilitated by shape of device

Industry

CPC
H01L23/367

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/367Cooling facilitated by shape of device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF circuit module and manufacturing method therefor
- Patent number 12,199,083
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki Aoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging stacked substrates and an integrated circuit die using a...
- Patent number 12,199,003
- Issue date Jan 14, 2025
- MARVELL ASIA PTE. LTD.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,199,002
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package design
- Patent number 12,191,225
- Issue date Jan 7, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,191,279
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal, semiconductor element and semiconductor device
- Patent number 12,191,372
- Issue date Jan 7, 2025
- FLOSFIA INC.
- Ryohei Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate comprising diamond and semiconductor int...
- Patent number 12,191,227
- Issue date Jan 7, 2025
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 12,183,649
- Issue date Dec 31, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,183,652
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction path from a laser die using a highly conductive the...
- Patent number 12,183,650
- Issue date Dec 31, 2024
- Intel Corporation
- Aditi Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip peltier cooling device and manufacturing method thereof
- Patent number 12,183,657
- Issue date Dec 31, 2024
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
- Publication number 20250020874
- Publication date Jan 16, 2025
- Intel Corporation
- Todd R. COONS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SIDE COOLING FOR POWER AMPLIFIER MODULE
- Publication number 20250022765
- Publication date Jan 16, 2025
- Qorvo US, Inc.
- Miles Larkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022766
- Publication date Jan 16, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE STRUCTURE
- Publication number 20250022767
- Publication date Jan 16, 2025
- SDP Global (China) Co., Ltd.
- TIAN-XUN LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...
- Publication number 20250022768
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015063
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014956
- Publication date Jan 9, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
- Publication number 20250006572
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...
- Publication number 20250008637
- Publication date Jan 2, 2025
- Casey Jamesen Carte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE
- Publication number 20250006602
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006569
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006584
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP MODULE
- Publication number 20250006715
- Publication date Jan 2, 2025
- LG Innotek Co., Ltd.
- Byung Hyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...
- Publication number 20250007363
- Publication date Jan 2, 2025
- American Axle & Manufacturing, Inc.
- Christopher D. Pump
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240429177
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by shape of device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die package structures including redistribution layers

RF circuit module and manufacturing method therefor

3D semiconductor devices and structures with metal layers

Electronic package and manufacturing method thereof

Systems and methods for non-overlap enforcement for inverter for el...

Interposer structure containing embedded silicon-less link chiplet

Electronics card including multi-chip module

Packaging stacked substrates and an integrated circuit die using a...

Semiconductor package and method of manufacturing the same

Electronic packages with integral heat spreaders

Flexible interposer

Method and extraction system for extracting an electronic device fr...

Semiconductor package and manufacturing method thereof

Ball grid array package design

Integrated circuit packages and methods of forming the same

Crystal, semiconductor element and semiconductor device

Semiconductor device including surface pressure absorbing member fo...

Heat dissipating substrate comprising diamond and semiconductor int...

Circuit board module

IC package including multi-chip unit with bonded integrated heat sp...

Semiconductor device

Integrated circuit structure

Semiconductor package with dummy MIM capacitor die

Systems and methods for single channel fault encoding for inverter...

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor package

Heat extraction path from a laser die using a highly conductive the...

Thermal conductive film

Thermally conductive sheet and method of manufacturing semiconducto...

On-chip peltier cooling device and manufacturing method thereof

Patents Applicationslast 30 patents

STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT

POWER MODULE STRUCTURE

TOP SIDE COOLING FOR POWER AMPLIFIER MODULE

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP-ON-FILM PACKAGE STRUCTURE

METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

COOLING SYSTEM BLOCK ASSEMBLY

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...

ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SIP MODULE

INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES