Cooling means

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H01L2224/785

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/785Cooling means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for semiconductor package
- Patent number 11,594,503
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hosoo Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Control wire clamp and loop systems and methods
- Patent number 10,622,328
- Issue date Apr 14, 2020
- POLYGROUP MACAU LIMITED (BVI)
- Victor Hugo Ocegueda Gallaga
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor device, and wire-bonding apparatus
- Patent number 9,922,952
- Issue date Mar 20, 2018
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,899,348
- Issue date Feb 20, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 9,887,174
- Issue date Feb 6, 2018
- Shinkawa Ltd.
- Naoki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire spool system for a wire bonding apparatus
- Patent number 9,461,013
- Issue date Oct 4, 2016
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,368,471
- Issue date Jun 14, 2016
- Shinkawa Ltd.
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with bimetallic interface element for wire bonding
- Patent number 9,184,150
- Issue date Nov 10, 2015
- STMicroelectronics S.R.L.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stud bump formation
- Patent number 9,021,682
- Issue date May 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Joint quality inspection and joint quality inspection method
- Patent number 8,714,015
- Issue date May 6, 2014
- Toyota Jidosha Kabushiki Kaisha
- Nami Matsui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a semiconductor device with a contact pad on a sl...
- Patent number 8,674,511
- Issue date Mar 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting blade for a wire bonding system
- Patent number 8,141,765
- Issue date Mar 27, 2012
- Orthodyne Electronics Corporation
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond head for heavy wire bonder
- Patent number 7,762,449
- Issue date Jul 27, 2010
- ASM Assembly Automation LTD
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for producing a bonding connection
- Patent number 7,597,235
- Issue date Oct 6, 2009
- Infineon Technologies AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angled flying lead wire bonding process
- Patent number 7,495,342
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and method of operating the same
- Patent number 7,458,496
- Issue date Dec 2, 2008
- F&K Delvotec Bondtechnik GmbH
- Farhad Farassat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20240395765
- Publication date Nov 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20220199570
- Publication date Jun 23, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20210358873
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hosoo HAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL WIRE CLAMP AND LOOP SYSTEMS AND METHODS
- Publication number 20170358550
- Publication date Dec 14, 2017
- POLYGROUP MACAU LIMITED (BVI)
- Victor Hugo OCEGUEDA GALLAGA
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS
- Publication number 20160365330
- Publication date Dec 15, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20160358880
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160351537
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20160351535
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20160351536
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Toru Maeda
- B08 - CLEANING
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20160225739
- Publication date Aug 4, 2016
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS
- Publication number 20160148898
- Publication date May 26, 2016
- Chi Wah CHENG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150243627
- Publication date Aug 27, 2015
- SHINKAWA LTD.
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Stud Bump Formation and Apparatus for Performing the Same
- Publication number 20130167373
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130034955
- Publication date Feb 7, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS

Cooling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

In-process wire bond testing using wire bonding apparatus

Wire bonding device, wire cutting method and non-transitory compute...

Methods of forming wire interconnect structures and related wire bo...

Wire bonding apparatus

Wire bonding apparatus

Method for bonding insulated coating wire, connection structure, me...

Wire bonding method for semiconductor package

Method and device for establishing a wire connection as well as a c...

Ultrasonic vibration bonding apparatus

Curtain airbag device mounting structure and curtain airbag deploym...

Control wire clamp and loop systems and methods

Methods of operating a wire bonding machine to improve clamping of...

Method for manufacturing wire bonding structure, wire bonding struc...

Method of manufacturing semiconductor device and wire bonding appar...

Method for producing semiconductor device, and wire-bonding apparatus

Wire bonding apparatus and method of manufacturing semiconductor de...

Off substrate kinking of bond wire

Semiconductor device manufacturing method, semiconductor device, an...

Wire spool system for a wire bonding apparatus

Wire-bonding apparatus and method of manufacturing semiconductor de...

Electronic device with bimetallic interface element for wire bonding

Apparatus for stud bump formation

Joint quality inspection and joint quality inspection method

Method of forming a semiconductor device with a contact pad on a sl...

Wedge bonder and a method of cleaning a wedge bonder

Cutting blade for a wire bonding system

Bond head for heavy wire bonder

Apparatus and method for producing a bonding connection

Angled flying lead wire bonding process

Wire bonder and method of operating the same

Patents Applicationslast 30 patents

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

IN-PROCESS WIRE BOND TESTING

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

CUPD WIRE BOND CAPILLARY DESIGN

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

APPARATUS AND METHOD FOR WIRE PREPARATION

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

ULTRASONIC VIBRATION BONDING APPARATUS

CONTROL WIRE CLAMP AND LOOP SYSTEMS AND METHODS

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

OFF SUBSTRATE KINKING OF BOND WIRE

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

Methods for Stud Bump Formation and Apparatus for Performing the Same

SEMICONDUCTOR DEVICE