Cooling means

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CPC
H01L2224/755

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/755Cooling means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
- Patent number 11,837,573
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted flip chip bonding apparatus
- Patent number 11,682,650
- Issue date Jun 20, 2023
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,545,462
- Issue date Jan 3, 2023
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
- Patent number 11,515,283
- Issue date Nov 29, 2022
- Samsung Display Co., Ltd.
- Chung-Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus including a heater and a cooling flow path used f...
- Patent number 11,508,688
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,508,689
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing oven
- Patent number 11,296,049
- Issue date Apr 5, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Christopher Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 11,239,060
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
- Publication number 20240332245
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Dae Seo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240096846
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- B32 - LAYERED PRODUCTS
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL
- Publication number 20230395559
- Publication date Dec 7, 2023
- NVIDIA Corporation
- Dongji Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20230230853
- Publication date Jul 20, 2023
- SHINKAWA LTD.
- Daisuke TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT-PRESSING MEMBER WITH IMPROVED FOCUS OF PRESSING AND LONGEVITY A...
- Publication number 20230123108
- Publication date Apr 20, 2023
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- FEI-FAN YU
- B30 - PRESSES
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ASSISTED FLIP CHIP BONDING APPARATUS
- Publication number 20220384383
- Publication date Dec 1, 2022
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220302077
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Takashi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT FOR FORMING A CONNECTION
- Publication number 20220238478
- Publication date Jul 28, 2022
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20220230985
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220130796
- Publication date Apr 28, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210398935
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210358879
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Cooling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus

Apparatus and method for forming a package structure

Laser reflow apparatus and laser reflow method

Low warpage curing methodology by inducing curvature

Method of manufacturing a semiconductor package

Bonding apparatus and bonding method

Chip bonding apparatus and method of manufacturing semiconductor de...

Manufacturing method of semiconductor package using jig

Process and device for low-temperature pressure sintering

Mounting apparatus

Dielectric-dielectric and metallization bonding via plasma activati...

Apparatus for and method for aligning dipoles and method of fabrica...

Heat assisted flip chip bonding apparatus

Arrangement and method for joining at least two joining partners

Mounting apparatus

Semiconductor manufacturing apparatus

Bonding head including a thermal compensator, die bonding apparatus...

Process and device for low-temperature pressure sintering

Mounting apparatus

Mounting apparatus and mounting system

Flexible circuit film bonding apparatus and method of bonding flexi...

Bonding apparatus including a heater and a cooling flow path used f...

Mounting apparatus and mounting system

Method of using a processing oven

Batch processing oven and method

Sintering press and method for sintering electronic components on a...

Solder reflow oven for batch processing

Method for bonding substrates

Processing oven

Ion beam etching chamber with etching by-product redistributor

Patents Applicationslast 30 patents

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

BONDING APPARATUS AND BONDING METHOD

MOUNTING HEAD

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

HOT-PRESSING MEMBER WITH IMPROVED FOCUS OF PRESSING AND LONGEVITY A...

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

HEAT ASSISTED FLIP CHIP BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

ARRANGEMENT FOR FORMING A CONNECTION

JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

MOUNTING APPARATUS

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

BONDING APPARATUS AND BONDING METHOD

BATCH PROCESSING OVEN AND METHOD