Cooling of mounted components

Industry

CPC
H05K1/0203

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0203Cooling of mounted components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal control of MEMS mirrors to limit resonant frequency shift
- Patent number 12,140,752
- Issue date Nov 12, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Sae Won Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Insulating and heat-radiating coating composition, and insulating a...
- Patent number 12,139,640
- Issue date Nov 12, 2024
- AMOSENSE CO., LTD.
- Hwan Ku Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Device for driving a compressor and processes for mounting the device
- Patent number 12,138,989
- Issue date Nov 12, 2024
- HANON SYSTEMS
- Hendrik Varain
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,133,321
- Issue date Oct 29, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Junpeng Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with enclosure frame, circuit board with elect...
- Patent number 12,127,328
- Issue date Oct 22, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Yang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity resonance suppression using discrete thermal pedestals in ac...
- Patent number 12,126,069
- Issue date Oct 22, 2024
- Hughes Network Systems, LLC
- Michael Buckley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method therefor
- Patent number 12,120,810
- Issue date Oct 15, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aerosol generating device and method for controlling same
- Patent number 12,108,802
- Issue date Oct 8, 2024
- KT & G Corporation
- Hun Il Lim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Method for fabricating assemble substrate
- Patent number 12,114,427
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation design for optical transceiver
- Patent number 12,108,518
- Issue date Oct 1, 2024
- Prime World International Holdings Ltd.
- Ling-An Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating circuit board
- Patent number 12,108,528
- Issue date Oct 1, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system and methods
- Patent number 12,101,909
- Issue date Sep 24, 2024
- Shuaib Badat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including cooling structure
- Patent number 12,100,637
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Jae Ho Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lighting arrangement comprising a substrate for light emitting elem...
- Patent number 12,092,301
- Issue date Sep 17, 2024
- SIGNIFY HOLDING, B.V.
- Rifat Ata Mustafa Hikmet
- F21 - LIGHTING
Information Patent Grant
Portable power supply
- Patent number 12,089,351
- Issue date Sep 10, 2024
- BLACK & DECKER INC.
- Snehal S. Choksi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus
- Patent number 12,082,339
- Issue date Sep 3, 2024
- Canon Kabushiki Kaisha
- Kentaro Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic module, method for producing an electronic module, and i...
- Patent number 12,082,333
- Issue date Sep 3, 2024
- Siemens Aktiengesellschaft
- Hubert Baueregger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsinks comprising a phase change material
- Patent number 12,082,374
- Issue date Sep 3, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques to control system updates and configuration changes via...
- Patent number 12,081,323
- Issue date Sep 3, 2024
- Intel Corporation
- Murugasamy K. Nachimuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling device and method of manufacturing the same
- Patent number 12,082,368
- Issue date Sep 3, 2024
- Aptiv Technologies AG
- Frank H. Adam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity resonance suppression using thermal pedestal arrangements in...
- Patent number 12,080,936
- Issue date Sep 3, 2024
- Hughes Network Systems, LLC
- Michael Buckley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automobile electronic system
- Patent number 12,071,083
- Issue date Aug 27, 2024
- Volkswagen Aktiengesellschaft
- Andreas Aal
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Metal ceramic substrate and method for manufacturing such metal cer...
- Patent number 12,075,557
- Issue date Aug 27, 2024
- Rogers Germany GmbH
- Vitalij Gil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,058,803
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Desktop electronic device
- Patent number 12,050,494
- Issue date Jul 30, 2024
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COOLING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240389267
- Publication date Nov 21, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240385665
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Joseph AHN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...
- Publication number 20240381585
- Publication date Nov 14, 2024
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...
- Publication number 20240379495
- Publication date Nov 14, 2024
- Intel Corporation
- Smit KAPILA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...
- Publication number 20240372792
- Publication date Nov 7, 2024
- Intel Corporation
- MURUGASAMY K. NACHIMUTHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...
- Publication number 20240365510
- Publication date Oct 31, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLDPLATE SYSTEM AND COOLING ARRANGEMENT
- Publication number 20240365503
- Publication date Oct 31, 2024
- ROHDE & SCHWARZ GMBH & CO. KG
- Johannes BRAUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH CAPACITANCE MEMORY DEVICE
- Publication number 20240357745
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESKTOP ELECTRONIC DEVICE
- Publication number 20240345635
- Publication date Oct 17, 2024
- Apple Inc.
- Brett W. DEGNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...
- Publication number 20240349465
- Publication date Oct 17, 2024
- Lunar Energy, Inc.
- Steven Nicholas Grolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341027
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20240334587
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20240334614
- Publication date Oct 3, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240334589
- Publication date Oct 3, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid Assisted Thermoelectric PCB Thermal Management System
- Publication number 20240334651
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Company of America, Division of Panasonic Corpor...
- NICHOLAS BRIAN HANSEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240324093
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Baoshan ZHUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT...
- Publication number 20240324108
- Publication date Sep 26, 2024
- Intel Corporation
- Juha T. Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT IN DATA STORAGE DEVICE
- Publication number 20240324136
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20240315435
- Publication date Sep 26, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-WEN CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240324143
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Hui JIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE BATTERY CHARGING APPARATUS
- Publication number 20240322580
- Publication date Sep 26, 2024
- Amphenol Tecvox, LLC
- Steven F. Selby
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE WITH INTEGRATED SLIDING PEDESTAL AND PROCESSING SYSTEM I...
- Publication number 20240314980
- Publication date Sep 19, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20240313444
- Publication date Sep 19, 2024
- ImmunoGen, Inc.
- Wayne C. Widdison
- C07 - ORGANIC CHEMISTRY
Information Patent Application
ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF
- Publication number 20240314918
- Publication date Sep 19, 2024
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA
- Publication number 20240314994
- Publication date Sep 19, 2024
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cooling of mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Voltage regulator module with inductor-cooled power stage

Thermal control of MEMS mirrors to limit resonant frequency shift

Insulating and heat-radiating coating composition, and insulating a...

Device for driving a compressor and processes for mounting the device

Electronic device

Electronic component with enclosure frame, circuit board with elect...

Cavity resonance suppression using discrete thermal pedestals in ac...

Circuit board and preparation method therefor

Aerosol generating device and method for controlling same

Method for fabricating assemble substrate

Heat dissipation design for optical transceiver

Insulating circuit board

Cooling system and methods

Electronic device including cooling structure

Lighting arrangement comprising a substrate for light emitting elem...

Portable power supply

Image pickup apparatus

Electronic module, method for producing an electronic module, and i...

Heatsinks comprising a phase change material

Techniques to control system updates and configuration changes via...

Cooling device and method of manufacturing the same

Cavity resonance suppression using thermal pedestal arrangements in...

Printed circuit board

Embedding component in component carrier by component fixation stru...

Automobile electronic system

Metal ceramic substrate and method for manufacturing such metal cer...

Method of constructing a circuitry assembly for heat dispersal usin...

Dynamic control of heat sink pressure

Circuit board assembly and electronic device

Desktop electronic device

Patents Applicationslast 30 patents

COOLING APPARATUS AND ELECTRONIC DEVICE

HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...

TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...

Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...

COLDPLATE SYSTEM AND COOLING ARRANGEMENT

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...

HIGH CAPACITANCE MEMORY DEVICE

DESKTOP ELECTRONIC DEVICE

THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

DYNAMIC CONTROL OF HEAT SINK PRESSURE

Fluid Assisted Thermoelectric PCB Thermal Management System

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT...

THERMAL MANAGEMENT IN DATA STORAGE DEVICE

HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS

VEHICLE BATTERY CHARGING APPARATUS

Circuit Board Cooling Configurations

COLD PLATE WITH INTEGRATED SLIDING PEDESTAL AND PROCESSING SYSTEM I...

METHODS FOR THE ACYLATION OF MAYTANSINOL

ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...

SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA