TREA

Cooling of mounted components

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  • H05K1/0203
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0203Cooling of mounted components
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

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    • Hyundai Motor Company
    • Nam Sik Kong
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    ELECTRONIC DEVICE
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    • Sony Interactive Entertainment Inc.
    • Takayuki HACHIYA
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    BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
    • Publication number 20250239911
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    • Milwaukee Electric Tool Corporation
    • Matthew J. Mergener
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    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20250234451
    • Publication date Jul 17, 2025
    • ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
    • Uwe Waltrich
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    PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION
    • Publication number 20250226280
    • Publication date Jul 10, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wensen Hung
    • H01 - BASIC ELECTRIC ELEMENTS
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    INVERTER-INTEGRATED ELECTRIC COMPRESSOR
    • Publication number 20250215869
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    • Sanden Corporation
    • Toshimasa SHIMA
    • F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
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    EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
    • Publication number 20250210459
    • Publication date Jun 26, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
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    AIRFLOW IN A CARD-BASED COMPUTING DEVICE
    • Publication number 20250212313
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    • NVIDIA Corporation
    • Xiang SUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...
    • Publication number 20250212314
    • Publication date Jun 26, 2025
    • MELLANOX TECHNOLOGIES, LTD.
    • Yaniv Kazav
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    SEMICONDUCTOR DEVICE
    • Publication number 20250201756
    • Publication date Jun 19, 2025
    • Fuji Electric Co., Ltd.
    • Yushi SATO
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    CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
    • Publication number 20250203751
    • Publication date Jun 19, 2025
    • AMOGREENTECH CO., LTD.
    • Jihyung LEE
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    AIRTIGHT OPTICAL MODULE
    • Publication number 20250203757
    • Publication date Jun 19, 2025
    • Innolight Technology (ChengDu) LTD.
    • Yin Wei
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    DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...
    • Publication number 20250194044
    • Publication date Jun 12, 2025
    • OVH
    • Ali CHEHADE
    • F28 - HEAT EXCHANGE IN GENERAL
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    INSULATED CIRCUIT BOARD WITH INTEGRATED HEAT SINK, AND ELECTRONIC D...
    • Publication number 20250193993
    • Publication date Jun 12, 2025
    • MITSUBISHI MATERIALS CORPORATION
    • Toyo Ohashi
    • H01 - BASIC ELECTRIC ELEMENTS
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    HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD
    • Publication number 20250194054
    • Publication date Jun 12, 2025
    • CANAAN CREATIVE CO., LTD.
    • Huan YANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    HEAT SINK STRUCTURE
    • Publication number 20250176139
    • Publication date May 29, 2025
    • KMW Inc.
    • Duk Yong KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
    • Publication number 20250172434
    • Publication date May 29, 2025
    • DENSO CORPORATION
    • Kazuaki FUJISAWA
    • H01 - BASIC ELECTRIC ELEMENTS
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    Heatsink techniques for optical and electrical modules
    • Publication number 20250168963
    • Publication date May 22, 2025
    • CIENA CORPORATION
    • Mitchell O'Leary
    • H01 - BASIC ELECTRIC ELEMENTS
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    SHIELD AND ELECTRONIC ASSEMBLY
    • Publication number 20250168967
    • Publication date May 22, 2025
    • AMLOGIC (SHANGHAI) CO., LTD.
    • Siwei Chen
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    ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
    • Publication number 20250149404
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    • Shinko Electric Industries Co., Ltd.
    • Shinichiro Sekijima
    • H01 - BASIC ELECTRIC ELEMENTS
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    POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY
    • Publication number 20250151198
    • Publication date May 8, 2025
    • Cisco Technology, Inc.
    • Joel Richard Goergen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    LAYOUT ARRANGEMENTS FOR PLUGGABLE OPTICS IN NETWORKING EQUIPMENT TO...
    • Publication number 20250147256
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    • Cisco Technology, Inc.
    • Joel Richard Goergen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    BATTERY PACK
    • Publication number 20250149674
    • Publication date May 8, 2025
    • TECHTRONIC FLOOR CARE TECHNOLOGY LIMITED
    • Patrick Diana
    • H01 - BASIC ELECTRIC ELEMENTS
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    HEATSINK BUSBAR
    • Publication number 20250142710
    • Publication date May 1, 2025
    • Analog Devices, Inc.
    • Hien Minh Pham
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    WEARABLE DEVICE ANTENNA SYSTEM
    • Publication number 20250141096
    • Publication date May 1, 2025
    • Snap Inc.
    • Andrea Ashwood
    • H01 - BASIC ELECTRIC ELEMENTS
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    BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS
    • Publication number 20250140774
    • Publication date May 1, 2025
    • Micron Technology, Inc.
    • Cem Basceri
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    HEAT DISSIPATION MODULE
    • Publication number 20250133649
    • Publication date Apr 24, 2025
    • ASUSTek COMPUTER INC.
    • Kuan-Chuan Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    CIRCUIT BOARD SYSTEM
    • Publication number 20250133658
    • Publication date Apr 24, 2025
    • Harman Becker Automotive Systems GmbH
    • Andreas KUSKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
    • Publication number 20250106978
    • Publication date Mar 27, 2025
    • LG Innotek Co., Ltd.
    • Ho Sung KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    MANUFACTURING METHOD OF POWER MODULE
    • Publication number 20250104902
    • Publication date Mar 27, 2025
    • Delta Electronics, Inc.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING