Copper (Cu) as principal constituent

Industry

CPC
H01L2224/48847

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48847Copper (Cu) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit, and motor device including the same
- Patent number 10,991,642
- Issue date Apr 27, 2021
- JOHNSON ELECTRIC INTERNATIONAL AG
- Chiping Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser ablation for wire bonding on organic solderability preservati...
- Patent number 10,833,043
- Issue date Nov 10, 2020
- Vitesco Technologies USA, LLC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device that includes a copper layer disposed on...
- Patent number 10,643,967
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Hiroaki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component comprising copper metallizations
- Patent number 10,347,580
- Issue date Jul 9, 2019
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,224,470
- Issue date Mar 5, 2019
- Nichia Corporation
- Akinori Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for semiconductor device packaging
- Patent number 10,147,697
- Issue date Dec 4, 2018
- NXP USA, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20210210417
- Publication date Jul 8, 2021
- Johnson Electric International AG
- Chiping SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20190244880
- Publication date Aug 8, 2019
- Johnson Electric International AG
- Chiping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...
- Publication number 20190198475
- Publication date Jun 27, 2019
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190172812
- Publication date Jun 6, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND WEDGE BONDING METHOD
- Publication number 20190088616
- Publication date Mar 21, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES
- Publication number 20150364431
- Publication date Dec 17, 2015
- Maxim Integrated Products, Inc.
- Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INTEGRATING A START-UP COMPONENT, A CONTROLLER, A...
- Publication number 20150162844
- Publication date Jun 11, 2015
- Zentel Electronics Corp.
- Jun Hsiung HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20150028462
- Publication date Jan 29, 2015
- Fuji Electric Co., Ltd.
- Akane HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374888
- Publication date Dec 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Motoi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140363926
- Publication date Dec 11, 2014
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140319567
- Publication date Oct 30, 2014
- Nichia Corporation.
- Akinori YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS
- Publication number 20140252627
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Matthias STECHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES
- Publication number 20140239485
- Publication date Aug 28, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140217567
- Publication date Aug 7, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Copper (Cu) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power amplifier systems with control interface and bias circuit

Method of forming an aluminum oxide layer, metal surface with alumi...

Wire bonding tool including a wedge tool

Integrated circuit, and motor device including the same

Laser ablation for wire bonding on organic solderability preservati...

Semiconductor integrated circuit device

Power amplifier modules including transistor with grading and semic...

Power semiconductor device that includes a copper layer disposed on...

Package-on-package (PoP) structure including stud bulbs

Semiconductor component comprising copper metallizations

Light emitting device

Semiconductor device and method of forming an embedded SoP fan-out...

Power overlay structure and reconstituted semiconductor wafer havin...

Plastic-packaged semiconductor device having wires with polymerized...

Semiconductor device

Package-on-package (PoP) structure including stud bulbs

Bond pad structure for semiconductor device packaging

Semiconductor device

Power amplifier modules with bonding pads and related systems, devi...

Semiconductor device

Contact pads with sidewall spacers and method of making contact pad...

Metal post bonding using pre-fabricated metal posts

Adding cap to copper passivation flow for electroless plating

Sintered conductive matrix material on wire bond

Power amplifier modules with power amplifier and transmission line...

Power amplifier modules with harmonic termination circuit and relat...

Semiconductor device

Package on-package (PoP) structure including stud bulbs

Methods for forming semiconductor devices with stepped bond pads

Patents Applicationslast 30 patents

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

WEDGE TOOL AND WEDGE BONDING METHOD

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES

PACKAGE STRUCTURE INTEGRATING A START-UP COMPONENT, A CONTROLLER, A...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

Packaging Methods and Packaged Semiconductor Devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

LIGHT EMITTING DEVICE

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

STACK TYPE SEMICONDUCTOR PACKAGE

SUPPLEMENTING WIRE BONDS

Metal Post Bonding Using Pre-Fabricated Metal Posts

SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS

WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

Device Including a Semiconductor Chip and Wires

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME