Copper [Cu] as principal constituent

Industry

CPC
H01L2224/29147

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29147Copper [Cu] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,087,721
- Issue date Sep 10, 2024
- Kyocera Corporation
- Tomonao Kikuchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 12,080,671
- Issue date Sep 3, 2024
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonded structure
- Patent number 12,070,801
- Issue date Aug 27, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,074,151
- Issue date Aug 27, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,051,633
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and method for manufacturing same
- Patent number 12,030,125
- Issue date Jul 9, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,027,509
- Issue date Jul 2, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic assembly, insulated circuit board, method for produc...
- Patent number 12,002,732
- Issue date Jun 4, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 11,948,910
- Issue date Apr 2, 2024
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,881,468
- Issue date Jan 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250118697
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER AND SEMICONDUCTOR DEVICE
- Publication number 20250118696
- Publication date Apr 10, 2025
- MINEBEA POWER SEMICONDUCTOR DEVICE INC.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY
- Publication number 20250112202
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Bonding
- Publication number 20250105196
- Publication date Mar 27, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250087619
- Publication date Mar 13, 2025
- AUO Corporation
- Yi-Shan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087620
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Tomoka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT ELECTRICAL INTERCONNECT ARRAYS USING COPPER NANO-WIRES (C...
- Publication number 20250079384
- Publication date Mar 6, 2025
- Board of Trustees of the University of Arkansas
- David Huitink
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING
- Publication number 20250079364
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
- Publication number 20250069973
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20250054848
- Publication date Feb 13, 2025
- Kabushiki Kaisha Toshiba
- Yasuhiro HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL
- Publication number 20250041977
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Kohei MITSUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022873
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki AOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME
- Publication number 20240424614
- Publication date Dec 26, 2024
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...
- Publication number 20240413119
- Publication date Dec 12, 2024
- ZF Friedrichshafen AG
- Fabian Hohmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240404883
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Electronic device with multi-layer contact and system

Semiconductor package and method for fabricating a semiconductor pa...

Heterogeneous annealing method and device

Silicon nitride circuit board and electronic component module

Thermal conductive film

Power semiconductor package unit of surface mount technology includ...

Bonding member for semiconductor device

Method for permanent connection of two metal surfaces

Electronic device and method for manufacturing electronic device

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and method for manufacturing semiconductor device

Layered bonding material, semiconductor package, and power module

Bonding material and bonded structure

Systems and methods for multi-color LED pixel unit with vertical li...

Integrated fan-out packaging

Semiconductor device

Contact and die attach metallization for silicon carbide based devi...

Bonding sheet and bonded structure

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Bonded body and method for manufacturing same

Layer structure with an intermetallic phase layer and a chip packag...

Systems and methods for multi-color LED pixel unit with vertical li...

Advanced device assembly structures and methods

Copper/ceramic assembly, insulated circuit board, method for produc...

Manufacturing method of semiconductor apparatus and semiconductor a...

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor package and production method thereof, and semiconduc...

Manufacturing method of power semiconductor device, power semicondu...

Anisotropic conductive film with carbon-based conductive regions an...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

POWER MODULE AND MANUFACTURING METHOD THEREFOR

SOLDER AND SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

Semiconductor Die Bonding

SEMICONDUCTOR MODULE

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

POWER MODULE AND POWER CONVERSION APPARATUS

COMPLIANT ELECTRICAL INTERCONNECT ARRAYS USING COPPER NANO-WIRES (C...

METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING

CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...

CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

SOLDER MATERIAL

Advanced Device Assembly Structures And Methods

Submounts with Stud Protrusions for Semiconductor Packages

SEMICONDUCTOR DEVICE

METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...

SINTER BONDING SHEET

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING