Copper [Cu] as principal constituent

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H01L2224/13147

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13147Copper [Cu] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 12,211,814
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved wafer coating
- Patent number 12,199,054
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Feng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 12,199,064
- Issue date Jan 14, 2025
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250033132
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250038116
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee JOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
- Publication number 20250038138
- Publication date Jan 30, 2025
- NXP B.V.
- Ting Hsun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR
- Publication number 20250038092
- Publication date Jan 30, 2025
- NXP USA, Inc.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038156
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONNECTING INTEGRATED CIRCUITS
- Publication number 20250029952
- Publication date Jan 23, 2025
- Avago Technologies International Sales Pte. Limited
- Ting Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029935
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyuil Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20250022817
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Tetsurou ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
- Publication number 20250022841
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250022867
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Dooho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250015069
- Publication date Jan 9, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS
- Publication number 20250006685
- Publication date Jan 2, 2025
- JCET Management Co., Ltd.
- Zhan YING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS
- Publication number 20250006585
- Publication date Jan 2, 2025
- JCET Management Co., Ltd.
- Zhan YING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429197
- Publication date Dec 26, 2024
- SAMSUNG-RO, ELECTRONICS CO., LTD
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Publication number 20240421065
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421141
- Publication date Dec 19, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
- Publication number 20240413114
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE
- Publication number 20240411096
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor interconnect structures with conductive elements, and...

Multi-die package structures including redistribution layers

Method and apparatus for improved wafer coating

Substrate pad and die pillar design modifications to enable extreme...

Manufacturing optically accessible co-packaged optics

Package structure

Fine pitch copper pillar package and method

Semiconductor device assembly with pillar array

Pre-molded leadframes in semiconductor devices

Manufacturing method of an electronic apparatus

Semiconductor device

Leadframes in semiconductor devices

Semiconductor device

Low cost package warpage solution

Semiconductor package and method manufacturing the same

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor package and methods of manufacturing

RF devices with enhanced performance and methods of forming the same

Single-shot encapsulation

Semiconductor device including a semiconductor element having elect...

Flip chip package unit comprising thermal protection film and assoc...

Solder reflow apparatus and method of manufacturing an electronic d...

Bonding structures and methods for forming the same

Semiconductor device assembly with die support structures

Semiconductor packages and methods of forming same

Integrated chip for standard logic performance improvement having a...

Integrated fan-out package and the methods of manufacturing

Semiconductor device package and manufacturing method thereof

Etched trenches in bond materials for die singulation, and associat...

Semiconductor devices and preparation methods thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Advanced Device Assembly Structures And Methods

PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR CONNECTING INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGE

HIGH-FREQUENCY MODULE

SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE STRUCTURE

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF

HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES

OPTOELECTRONIC PACKAGE STRUCTURE