Copper [Cu] as principal constituent

Industry

CPC
H01L2224/37147

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37147Copper [Cu] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding method
- Patent number 12,080,675
- Issue date Sep 3, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 11,869,794
- Issue date Jan 9, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints and related methods of...
- Patent number 11,842,953
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode power electronic device packaging method and packaging stru...
- Patent number 11,476,242
- Issue date Oct 18, 2022
- ULTRABAND TECHNOLOGIES INC.
- Tai-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 11,469,205
- Issue date Oct 11, 2022
- Adventive International Ltd.
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor package and related methods
- Patent number 11,264,311
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power device
- Patent number 11,183,439
- Issue date Nov 23, 2021
- Actron Technology Corporation
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 10,985,093
- Issue date Apr 20, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,910,284
- Issue date Feb 2, 2021
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 10,892,210
- Issue date Jan 12, 2021
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,672,677
- Issue date Jun 2, 2020
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped lead terminals for packaging a semiconductor device for elec...
- Patent number 10,658,284
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387455
- Publication date Nov 21, 2024
- NHINC Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BONDING METHOD
- Publication number 20240379610
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delay-Free Temperature Measurement Of Power Switches
- Publication number 20240319012
- Publication date Sep 26, 2024
- Vitesco Technologies GMBH
- Fadi Rifai
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...
- Publication number 20240243095
- Publication date Jul 18, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240234360
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...
- Publication number 20240222311
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240203929
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203814
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING BOARD
- Publication number 20240203928
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170375
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Tatsuaki TSUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...
- Publication number 20240136214
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Siyuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240136319
- Publication date Apr 25, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE
- Publication number 20240128167
- Publication date Apr 18, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Glenda Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105666
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Daisuke Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS
- Publication number 20240105564
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE
- Publication number 20240106342
- Publication date Mar 28, 2024
- ZF Friedrichshafen AG
- Zhiwu Hu
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with sense terminal

Semiconductor device and bonding method

Semiconductor device and production method for semiconductor device

Leadframe package with adjustable clip

Semiconductor device and electronic device

Long-life extended temperature range embedded diode design for elec...

Semiconductor package with wire bond joints and related methods of...

Double side heat dissipation for silicon chip package

Power semiconductor module with laser-welded leadframe

Semiconductor device

Cascode power electronic device packaging method and packaging stru...

Universal surface-mount semiconductor package

Method of forming an aluminum oxide layer, metal surface with alumi...

Clips for semiconductor package and related methods

Package structure for power device

Stacked transistor assembly with dual middle mounting clips

Method for electrically contacting a component by galvanic connecti...

Semiconductor device

Semiconductor device and method for producing semiconductor device

Semiconductor device comprising a composite material clip

Semiconductor device having terminals directly attachable to circui...

Semiconductor module

Semiconductor device and method of manufacturing thereof

Package structures

Semiconductor device and method with clip arrangement in IC package

Semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Package with vertical interconnect between carrier and clip

Semiconductor package structure

Shaped lead terminals for packaging a semiconductor device for elec...

Patents Applicationslast 30 patents

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND BONDING METHOD

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

Delay-Free Temperature Measurement Of Power Switches

SEMICONDUCTOR DEVICE

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

METAL WIRING BOARD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS

HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE