Copper (Cu) as principal constituent

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H01L2224/85447

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85447Copper (Cu) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,971,436
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 10,930,616
- Issue date Feb 23, 2021
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,840,424
- Issue date Nov 17, 2020
- Bridgelux, Inc.
- R. Scott West
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and semiconductor package device using the...
- Patent number 10,763,133
- Issue date Sep 1, 2020
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical non-destructive inspection method and optical non-destructi...
- Patent number 10,751,832
- Issue date Aug 25, 2020
- JTEKT Corporation
- Naoki Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,146
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Naoya Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bonding regions exposed through protect...
- Patent number 10,699,994
- Issue date Jun 30, 2020
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 10,685,897
- Issue date Jun 16, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,672,689
- Issue date Jun 2, 2020
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protection layer surrounding a bonding pad
- Patent number 10,566,305
- Issue date Feb 18, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
- Patent number 10,522,638
- Issue date Dec 31, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,388,594
- Issue date Aug 20, 2019
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor pad for flexible circuits and flexible circuit incorporat...
- Patent number 10,368,436
- Issue date Jul 30, 2019
- OSRAM SYLVANIA Inc.
- Sridharan Venk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-interface IC card
- Patent number 10,366,320
- Issue date Jul 30, 2019
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,347,807
- Issue date Jul 9, 2019
- BRIDGELUX INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,269,754
- Issue date Apr 23, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Articles including ultra low dielectric layers
- Patent number 10,217,661
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages including modules that include at least one integr...
- Patent number 10,178,786
- Issue date Jan 8, 2019
- Honeywell International Inc.
- James L. Tucker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, DRIVE DEVICE FOR SEMICONDUCTOR DEVICE, MANUFA...
- Publication number 20240203931
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20240047437
- Publication date Feb 8, 2024
- Changxin Memory Technologies, Inc.
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178454
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tadatsugu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20200035639
- Publication date Jan 30, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214361
- Publication date Jul 11, 2019
- ROHM CO., LTD.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...
- Publication number 20190035643
- Publication date Jan 31, 2019
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190006272
- Publication date Jan 3, 2019
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARTICLES INCLUDING ULTRA LOW DIELECTRIC LAYERS
- Publication number 20170365511
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Robert L. Bruce
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY
- Publication number 20150035160
- Publication date Feb 5, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374888
- Publication date Dec 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Motoi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284617
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Yoko SAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO FACILITATE THERMAL TRANSFER FOR MOTOR DRIVE FE...
- Publication number 20140247560
- Publication date Sep 4, 2014
- Rockwell Automation Technologies, Inc.
- Nicholas Lemberg
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20140239509
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES
- Publication number 20140239485
- Publication date Aug 28, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140217567
- Publication date Aug 7, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140210093
- Publication date Jul 31, 2014
- Mitsubishi Electric Corporation
- Yazhe WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140138836
- Publication date May 22, 2014
- RENESAS ELECTRONICS CORPORATION
- Takaharu NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS

Copper (Cu) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having routable encapsulated conductive subst...

Semiconductor packages with pass-through clock traces and associate...

Semiconductor package having routable encapsulated conductive subst...

Packaging photon building blocks with top side connections and inte...

Direct selective adhesion promotor plating

Multi-branch terminal for integrated circuit (IC) package

Semiconductor module, method for manufacturing semiconductor module...

Die stack assembly using an edge separation structure for connectiv...

Packaging photon building blocks with top side connections and inte...

Semiconductor structure and semiconductor package device using the...

Optical non-destructive inspection method and optical non-destructi...

Die stack assembly using an edge separation structure for connectiv...

Semiconductor device

Electronic unit

Semiconductor device having bonding regions exposed through protect...

Semiconductor package having routable encapsulated conductive subst...

Protection from ESD during the manufacturing process of semiconduct...

Semiconductor device with protection layer surrounding a bonding pad

Semiconductor chip and power module, and manufacturing method of th...

Using MEMS fabrication incorporating into LED device mounting and a...

Protection from ESD during the manufacturing process of semiconduct...

Conductor pad for flexible circuits and flexible circuit incorporat...

Dual-interface IC card

Packaging photon building blocks with top side connections and inte...

Light emitting device and light emitting module

Semiconductor device

Light emitting die (LED) packages and related methods

Semiconductor device and method of forming an embedded SoP fan-out...

Articles including ultra low dielectric layers

Circuit packages including modules that include at least one integr...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, DRIVE DEVICE FOR SEMICONDUCTOR DEVICE, MANUFA...

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

Direct Selective Adhesion Promotor Plating

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...

SEMICONDUCTOR DEVICE

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ARTICLES INCLUDING ULTRA LOW DIELECTRIC LAYERS

PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE

Stackable Package by Using Internal Stacking Modules

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

STACK TYPE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SYSTEM AND METHOD TO FACILITATE THERMAL TRANSFER FOR MOTOR DRIVE FE...

Semiconductor Device and Method of Forming Topside and Bottom-side...

WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE